Method of utilizing mobile communication device to convert image character into text and system thereof
    21.
    发明申请
    Method of utilizing mobile communication device to convert image character into text and system thereof 审中-公开
    利用移动通信设备将图像字符转换为文本及其系统的方法

    公开(公告)号:US20080137958A1

    公开(公告)日:2008-06-12

    申请号:US11707833

    申请日:2007-02-16

    IPC分类号: G06K9/46 H04M3/42

    摘要: A method of utilizing a mobile communication device to convert image character into text and a system thereof are provided, which are utilized in a service to wirelessly transmit the image character captured by the mobile communication device to a server for being converted into an encoded text and then returned to the mobile communication device. The method includes the step of obtaining a digital image containing an image character; utilizing a wireless communication network to transmit the digital image into a server; extracting the area of the image character of the digital image; then, after recognizing and converting an image character program of the image character into a corresponding text, returning the text to the mobile communication device to be displayed, such that the problem of an inconvenient input operation when a large number of texts are input into the mobile communication device is solved.

    摘要翻译: 提供了利用移动通信设备将图像字符转换为文本的方法及其系统,其被用于服务中将由移动通信设备捕获的图像字符无线传送到服务器以转换为编码文本, 然后返回到移动通信设备。 该方法包括获得包含图像字符的数字图像的步骤; 利用无线通信网络将数字图像发送到服务器; 提取数字图像的图像字符的区域; 然后,在将图像字符的图像字符程序识别并转换成对应的文本之后,将文本返回到要显示的移动通信设备,使得当大量文本被输入到不正确的输入操作的问题时 移动通信设备得到解决。

    Silicon chip having through via and method for making the same
    22.
    发明授权
    Silicon chip having through via and method for making the same 有权
    具有通孔的硅芯片及其制造方法

    公开(公告)号:US08263493B2

    公开(公告)日:2012-09-11

    申请号:US12647856

    申请日:2009-12-28

    IPC分类号: H01L21/4763 H01L21/44

    CPC分类号: H01L21/76898

    摘要: The present invention relates to a silicon chip having a through via and a method for making the same. The silicon chip includes a silicon substrate, a passivation layer, at least one electrical device and at least one through via. The passivation layer is disposed on a first surface of the silicon substrate. The electrical device is disposed in the silicon substrate, and exposed to a second surface of the silicon substrate. The through via includes a barrier layer and a conductor, and penetrates the silicon substrate and the passivation layer. A first end of the through via is exposed to the surface of the passivation layer, and a second end of the through via connects the electrical device. When a redistribution layer is formed on the surface of the passivation layer, the redistribution layer will not contact the silicon substrate, thus avoiding a short circuit. Therefore, a lower resolution process can be used, which results in low manufacturing cost and simple manufacturing process.

    摘要翻译: 本发明涉及具有贯通孔的硅芯片及其制造方法。 硅芯片包括硅衬底,钝化层,至少一个电器件和至少一个通孔。 钝化层设置在硅衬底的第一表面上。 电气设备设置在硅衬底中,并暴露于硅衬底的第二表面。 通孔包括阻挡层和导体,并且穿透硅衬底和钝化层。 通孔的第一端暴露于钝化层的表面,通孔的第二端连接电气装置。 当在钝化层的表面上形成再分布层时,再分布层将不会接触硅衬底,从而避免短路。 因此,可以使用较低分辨率的工艺,这导致制造成本低和制造工艺简单。

    Systems and methods for human body pose estimation
    23.
    发明授权
    Systems and methods for human body pose estimation 有权
    人体姿态估计的系统和方法

    公开(公告)号:US07925081B2

    公开(公告)日:2011-04-12

    申请号:US11955270

    申请日:2007-12-12

    IPC分类号: G06K9/62

    CPC分类号: G06K9/00348

    摘要: Systems and computer-implemented methods for use in body pose estimation are provided. Training data is obtained, where the training data includes observation vector data and corresponding pose vector data for a plurality of images. The observation vector data is representative of the images in observation space. The pose vector data is representative of the same images in pose space. Based on the training data, a model is computed that includes parameters of mapping from the observation space to latent space, parameters of mapping from the latent space to the pose space, and parameters of the latent space. The latent space has a lower dimensionality than the observation space and the pose space.

    摘要翻译: 提供了用于身体姿态估计的系统和计算机实现的方法。 获得训练数据,其中训练数据包括用于多个图像的观察矢量数据和相应的姿态矢量数据。 观察矢量数据代表观察空间中的图像。 姿态向量数据代表姿势空间中相同的图像。 基于训练数据,计算出一个模型,其中包括从观察空间到潜伏空间的映射参数,从潜在空间到姿势空间的映射参数以及潜在空间的参数。 潜在空间具有比观察空间和姿态空间更低的维度。

    Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same
    24.
    发明授权
    Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same 有权
    在低介电常数材料中具有高纵横比通孔结构的器件及其制造方法

    公开(公告)号:US07501342B2

    公开(公告)日:2009-03-10

    申请号:US12050601

    申请日:2008-03-18

    IPC分类号: H01L21/44

    摘要: A method for manufacturing a device having a via structure includes the following steps. A seed metallic layer is formed on a substrate. A patterned metallic-trace layer is formed on the seed metallic layer. A positive-type photoresist layer is formed on the patterned metallic-trace layer and seed metallic layer. The photoresist layer is patterned for defining a through hole which exposes a part of the patterned metallic-trace layer, wherein the through hole has a high aspect ratio. A metallic material is electroplated in the through hole so as to form a metallic pillar. The photoresist layer is removed. A part of the seed metallic layer is etched, whereby traces of the patterned metallic-trace layer are electrically isolated from each other. A dielectric material layer is formed on the substrate for sealing the patterned metallic-trace layer and a part of the metallic pillar and exposing a top surface of the metallic pillar.

    摘要翻译: 用于制造具有通孔结构的器件的方法包括以下步骤。 种子金属层形成在基片上。 在种子金属层上形成图案化的金属痕迹层。 在图案化的金属痕迹层和种子金属层上形成正型光致抗蚀剂层。 图案化光致抗蚀剂层以限定暴露图案化的金属 - 迹线层的一部分的通孔,其中通孔具有高纵横比。 在通孔中电镀金属材料,形成金属柱。 去除光致抗蚀剂层。 蚀刻种子金属层的一部分,由此图案化的金属迹线层的迹线彼此电隔离。 在基板上形成电介质材料层,用于密封图案化的金属迹线层和金属柱的一部分并暴露金属柱的顶表面。