公开(公告)号：US08269418B2

公开(公告)日：2012-09-18

申请号：US13293894

申请日：2011-11-10

申请人： Ki Bum Kim

发明人： Ki Bum Kim

IPC分类号： H01J1/62

CPC分类号： H05B33/02 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting device according to an embodiment includes: a body including a cavity formed with a stepped section; an electrode of which one end is disposed on the stepped section and the other end is disposed outside of the body; a heat sink including a main frame and a sub frame, wherein the sub frame includes a slope and a portion of the heat sink is disposed outside of the body; and a light emitting diode disposed on the heat sink.

摘要翻译： 根据实施例的发光器件包括：主体，包括形成有台阶部分的空腔; 电极，其一端设置在台阶部分上，另一端设置在主体的外侧; 包括主框架和子框架的散热器，其中所述子框架包括斜面，并且所述散热器的一部分设置在所述主体的外部; 以及设置在散热器上的发光二极管。

公开(公告)号：US08258538B2

公开(公告)日：2012-09-04

申请号：US12702395

申请日：2010-02-09

申请人： Ki Bum Kim

发明人： Ki Bum Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

摘要： A light emitting device package is provided. The light emitting device package may include a package body having a cavity formed therein, a lead frame, and a light emitting device positioned in the cavity and electrically connected to the lead frame. The lead frame may penetrate the package body such that one end of the lead frame is positioned in the cavity and the other end of the lead frame is exposed to an outside of the package body. The lead frame may be partially coated with a thin metal layer.

摘要翻译： 提供发光器件封装。 发光器件封装可以包括其中形成有空腔的封装主体，引线框架和位于空腔中并电连接到引线框架的发光器件。 引线框架可以穿过封装体，使得引线框架的一端位于空腔中，并且引线框架的另一端暴露于封装主体的外部。 引线框架可以部分地涂覆有薄金属层。

公开(公告)号：US20110284792A1

公开(公告)日：2011-11-24

申请号：US12906471

申请日：2010-10-18

申请人： Jong Myung Kim ,  Ki Bum Kim ,  Dong Jin Kang ,  Hyung Oh Ban ,  Hong Kil Baek ,  Won-Seog Koo ,  Jong-Kwan Park ,  Sung-Tae Choi

发明人： Jong Myung Kim ,  Ki Bum Kim ,  Dong Jin Kang ,  Hyung Oh Ban ,  Hong Kil Baek ,  Won-Seog Koo ,  Jong-Kwan Park ,  Sung-Tae Choi

IPC分类号： F16K51/00 ,  B22F3/12 ,  B22F3/26 ,  B22F1/00

CPC分类号： F16K25/005 ,  B22F5/008 ,  B22F2999/00 ,  C22C33/0285 ,  B22F3/10 ,  B22F2201/02

摘要： The present invention features a steel-base sintering alloy having a high wear-resistance for a valve seat of an engine. In preferred embodiments, the steel-base sintering alloy may include a chief element of Ferrum (Fe); and a powder-alloy which are composed of Carbon (C) of 0.6˜1.2 wt %, Nickel (Ni) of 1.0˜3.0 wt %, Cobalt (Co) of 15.0˜25.0 wt %, Chrome (Cr) of 3.0˜9.0 wt %, Molybdenum (Mo) of 8.0˜15.0 wt %, Tungsten (W) of 1.0˜4.0 wt %, Manganese (Mn) of 0.5˜2.0 wt %, and Calcium (Ca) of 0.1˜0.5 wt %.

摘要翻译： 本发明的特征在于具有用于发动机的阀座的高耐磨性的钢基烧结合金。 在优选实施例中，钢基烧结合金可以包括铁（Fe）的主要元素; 和由0.6〜1.2重量％的碳（C），1.0〜3.0重量％的镍（Ni），15.0〜25.0重量％的钴（Co），3.0〜9.0的铬（Co）组成的粉末合金） 重量％，钼（Mo）为8.0〜15.0重量％，钨（W）为1.0〜4.0重量％，锰（Mn）为0.5〜2.0重量％，钙（Ca）为0.1〜0.5重量％。

公开(公告)号：US08059074B2

公开(公告)日：2011-11-15

申请号：US11833450

申请日：2007-08-03

申请人： Ki-Bum Kim ,  Jae-Goo Lee

发明人： Ki-Bum Kim ,  Jae-Goo Lee

IPC分类号： G09G3/36

CPC分类号： G09G3/3655 ,  G09G3/3614 ,  G09G2320/08

摘要： A voltage generating circuit includes a first storage unit, a second storage unit, and a voltage generator. The first storage unit stores first voltage data, and the second storage unit stores second voltage data. The voltage generator generates a voltage corresponding to one of the first and the second voltage data according to whether the second voltage data is changed from the first voltage data.

摘要翻译： 电压产生电路包括第一存储单元，第二存储单元和电压发生器。 第一存储单元存储第一电压数据，第二存储单元存储第二电压数据。 根据第二电压数据是否从第一电压数据改变，电压发生器产生对应于第一和第二电压数据之一的电压。

公开(公告)号：US20110108995A1

公开(公告)日：2011-05-12

申请号：US12819279

申请日：2010-06-21

申请人： Da Un NAH ,  Jae Myun KIM ,  Tae Hoon KIM ,  Jung Tae JEONG ,  Bok Gyu MIN ,  Ki Bum KIM

发明人： Da Un NAH ,  Jae Myun KIM ,  Tae Hoon KIM ,  Jung Tae JEONG ,  Bok Gyu MIN ,  Ki Bum KIM

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/73 ,  H01L23/481 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A spiral staircase shaped stacked semiconductor package is presented. The package includes a semiconductor chip module, a substrate and connection members. The semiconductor chip module includes at least two semiconductor chips which have chip selection pads and through-electrodes. The semiconductor chips are stacked such that the chip selection pads are exposed and the through-electrodes of the stacked semiconductor chips are electrically connected to one another. The substrate has the semiconductor chip module mounted thereto and has connection pads. The connection members electrically connect the chip selection pads to respective connection pads.

摘要翻译： 提出了一种螺旋状梯形堆叠半导体封装。 封装包括半导体芯片模块，基板和连接构件。 半导体芯片模块包括具有芯片选择焊盘和贯通电极的至少两个半导体芯片。 堆叠半导体芯片，使得芯片选择焊盘被暴露，并且堆叠的半导体芯片的贯通电极彼此电连接。 基板具有安装在其上的半导体芯片模块并具有连接焊盘。 连接构件将芯片选择焊盘电连接到相应的连接焊盘。

公开(公告)号：US20110062581A1

公开(公告)日：2011-03-17

申请号：US12835921

申请日：2010-07-14

申请人： Jae Myun KIM ,  Seung Jee KIM ,  Ki Bum KIM

发明人： Jae Myun KIM ,  Seung Jee KIM ,  Ki Bum KIM

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/52

CPC分类号： H01L25/0657 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor package includes a substrate, a first semiconductor chip module attached to the substrate, a conductive connection member attached to the first semiconductor chip module, and a second semiconductor chip module attached to the conductive connection member. The first and second semiconductor chip modules are formed to have step like shapes to and extend laterally in opposite directions so as to define a zigzag arrangement together.

摘要翻译： 半导体封装包括衬底，附着到衬底的第一半导体芯片模块，附接到第一半导体芯片模块的导电连接构件和附接到导电连接构件的第二半导体芯片模块。 第一和第二半导体芯片模块形成为具有阶梯形形状并且沿相反方向横向延伸，以便将锯齿形布置在一起。

公开(公告)号：US20110050074A1

公开(公告)日：2011-03-03

申请号：US12868243

申请日：2010-08-25

申请人： Ki Bum KIM

发明人： Ki Bum KIM

IPC分类号： H01J61/52

CPC分类号： H05B33/02 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting apparatus according to an embodiment includes: a body including a cavity; an electrode of which one end is disposed in the cavity by penetrating the body and the other end is disposed outside of the body; a heat radiating member including a main frame which is coupled with the body to form the bottom of the cavity and a sub frame which extends from the main frame, wherein the top surface of the main frame has a larger area than the bottom surface of the main frame and the sub frame includes a slope; and a light emitting device installed on the heat radiating member and electrically connected with the electrode.

摘要翻译： 根据实施例的发光装置包括：主体，包括空腔; 电极，其一端通过穿透本体而设置在空腔中，另一端设置在主体的外部; 散热构件，其包括与所述主体结合以形成所述空腔的底部的主框架和从所述主框架延伸的副框架，其中所述主框架的顶表面具有比所述主框架的底表面更大的面积 主框架和子框架包括斜面; 以及安装在散热构件上并与电极电连接的发光装置。

公开(公告)号：US07851778B2

公开(公告)日：2010-12-14

申请号：US11805827

申请日：2007-05-24

申请人： Dae-Hwan Kang ,  In-Ho Kim ,  Byung Ki Cheong ,  Jeung-Hyun Jeong ,  Taek Sung Lee ,  Won Mok Kim ,  Ki-Bum Kim

发明人： Dae-Hwan Kang ,  In-Ho Kim ,  Byung Ki Cheong ,  Jeung-Hyun Jeong ,  Taek Sung Lee ,  Won Mok Kim ,  Ki-Bum Kim

IPC分类号： H01L47/00 ,  H01L21/00

CPC分类号： H01L45/1675 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/144 ,  H01L45/1625

摘要： The present invention relates to a non-volatile electrical phase change memory device comprising a substrate, a first interlayer dielectric film deposited on the substrate, a bottom electrode layer formed on the first dielectric layer, a second interlayer dielectric film formed on the bottom electrode layer, a phase change material layer deposited on the second interlayer dielectric film, and a top electrode layer formed on said phase change material layer, the bottom electrode layer being brought into contact with the phase change material layer through a contact hole which is formed in the second interlayer dielectric film and filled with the phase change material or bottom electrode material, so that the phase change layer and the bottom electrode layer come into close contact with each other,wherein an interfacial control layer is formed at the interface of the contact hole between the phase change layer and the bottom electrode layer, said interfacial control layer having strong chemical bonds with the phase change material as well as electrical resistivity and thermal conductivity values lower than those of the bottom electrode material.

摘要翻译： 本发明涉及一种非挥发性电相变存储器件，其包括衬底，沉积在衬底上的第一层间电介质膜，形成在第一介电层上的底部电极层，形成在底部电极层上的第二层间电介质膜 沉积在第二层间电介质膜上的相变材料层和形成在所述相变材料层上的顶部电极层，所述底部电极层通过形成在所述相变材料层中的接触孔与所述相变材料层接触， 第二层间电介质膜，并填充有相变材料或底部电极材料，使得相变层和底部电极层彼此紧密接触，其中界面控制层形成在接触孔的界面处， 相变层和底部电极层，所述界面控制层具有强的作用 与相变材料的化学键以及电阻率和热导率值低于底部电极材料。

公开(公告)号：US07759587B2

公开(公告)日：2010-07-20

申请号：US11846268

申请日：2007-08-28

申请人： Ki-Bum Kim ,  Kwang-Jin Bae

发明人： Ki-Bum Kim ,  Kwang-Jin Bae

IPC分类号： H01H9/00

CPC分类号： H01H19/6355 ,  G04C3/001 ,  G04G21/00 ,  H01H19/001 ,  H01H19/48 ,  H01H19/63 ,  H01H2300/016

摘要： A two-way key of a portable terminal is provided. The two-way terminal includes a fixed member mounted on the portable terminal, a driving member rotatably assembled with the fixed member, and an operating member pivotably assembled with the fixed member, wherein, as the driving member rotates, the driving member comes into contact with the operating member and causes the operating member to pivot. The two-way key as configured above can construct a key capable of operating in two ways while taking a small space so that it contributes to the compact size of the terminal. Further, if the two-way key is employed in the watch-type portable terminal, the operating scheme is identical to that of a spring of a common analog wrist watch or a time control lever, so that it is familiar to a user and thus it is convenient for a user to use.

摘要翻译： 提供便携式终端的双向密钥。 双向终端包括安装在便携式终端上的固定构件，可旋转地组装有固定构件的驱动构件和与该固定构件可转动地组装的操作构件，其中，随着驱动构件旋转，驱动构件接触 与操作构件一起使操作构件枢转。 如上构造的双向键可以构造一个能够以两种方式操作的键，同时占用小空间，从而有助于终端的紧凑尺寸。 此外，如果在手表式便携式终端中采用双向键，则操作方案与普通模拟手表或时间控制杆的弹簧的操作方案相同，使得用户熟悉，因此 方便用户使用。

公开(公告)号：US07732331B2

公开(公告)日：2010-06-08

申请号：US10998229

申请日：2004-11-16

申请人： Ki-Bum Kim ,  Pekka J. Soininen ,  Ivo Raaijmakers

发明人： Ki-Bum Kim ,  Pekka J. Soininen ,  Ivo Raaijmakers

IPC分类号： H01L21/44 ,  H01L21/00 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L21/76846 ,  H01L21/28562 ,  H01L21/76855 ,  H01L21/76856 ,  H01L21/76858 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a method of fabricating a semiconductor device, which could advance the commercialization of semiconductor devices with a copper interconnect. In a process of metal interconnect line fabrication, a TiN thin film combined with an Al intermediate layer is used as a diffusion barrier on trench or via walls. For the formation, Al is deposited on the TiN thin film followed by copper filling the trench. Al diffuses to TiN layer and reacts with oxygen or nitrogen, which will stuff grain boundaries efficiently, thereby blocking the diffusion of copper successfully.

摘要翻译： 本发明提供一种制造半导体器件的方法，其可以通过铜互连促进半导体器件的商业化。 在金属互连线制造的过程中，与Al中间层结合的TiN薄膜用作沟槽或通孔壁上的扩散阻挡层。 为了形成，Al沉积在TiN薄膜上，随后铜填充沟槽。 Al扩散到TiN层并与氧或氮反应，这将有效地吸收晶界，从而阻止铜的扩散。