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    Power electronics component
    11.
    发明授权
    Power electronics component 有权
    电力电子元件

    公开(公告)号：US07236367B2

    公开(公告)日：2007-06-26

    申请号：US10487895

    申请日：2002-08-29

    Applicant: Olaf Lucke ,  Bernd Thyzel

    Inventor： Olaf Lucke ,  Bernd Thyzel

    IPC: H05K7/20 ,  H01L23/34

    CPC classification number: H01L23/3735 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2203/1572 ,  H01L2924/014

    Abstract: The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face condutor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.

    Abstract translation: 本发明涉及一种电力电子部件，其包括平面陶瓷基板（2），其平面陶瓷基板（2）的一个面上安置导轨（6）以厚膜技术施加，用于电连接电路的电力部件（7） 也设置在陶瓷基板（2）上。 具有其另一面的陶瓷基板（2）钎焊到金属作为散热器的金属支撑元件（1）上。 支撑元件（1）与以热传导方式容纳支撑元件（1）的导热壳体部分壳体连接。 在背离陶瓷基板（2）的支撑元件（1）的表面上，与陶瓷基板（2）大致相反，第二陶瓷基板（4）钎焊到承载电路的陶瓷基板（2）上， 具有大致相同的尺寸。

    Function module with built-in plate-type heat dissipation device
    12.
    发明申请
    Function module with built-in plate-type heat dissipation device 审中-公开
    功能模块内置板式散热装置

    公开(公告)号：US20040218361A1

    公开(公告)日：2004-11-04

    申请号：US10824223

    申请日：2004-04-14

    Inventor： Wen-Yen Lin ,  Tsan-Nan Chien

    IPC: H05K007/20

    CPC classification number: H05K7/20509 ,  H05K1/144 ,  H05K1/148 ,  H05K3/0061 ,  H05K2201/043

    Abstract: A function module with a built-in plate-type heat dissipation device. The function module includes a first circuit board, a second circuit board, and a plate-type heat dissipation device. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The plate-type heat dissipation device is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.

    Abstract translation: 具有内置板式散热装置的功能模块。 功能模块包括第一电路板，第二电路板和板式散热装置。 第一电路板包括其上形成有第一接地层的第一表面。 第二电路板耦合到第一电路板，并且包括面向第一表面的第二表面。 在第二表面上形成第二接地层。 板式散热装置设置在第一电路基板和第二电路基板之间，分别与第一接地层和第二接地层抵接。

    Compact circuit carrier package
    13.
    发明申请
    Compact circuit carrier package 有权
    紧凑型电路载体封装

    公开(公告)号：US20030193786A1

    公开(公告)日：2003-10-16

    申请号：US10122766

    申请日：2002-04-15

    Inventor： Ralf Greiner ,  Josef Maier ,  Kai Paintner ,  Richard Sinning

    IPC: H05K005/00 ,  H05K005/04 ,  H05K005/06

    CPC classification number: H05K3/4614 ,  H01L2224/48472 ,  H01L2924/19107 ,  H05K1/0272 ,  H05K1/0306 ,  H05K1/144 ,  H05K3/305 ,  H05K3/4629 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2203/049

    Abstract: A circuit carrier assembly includes a plurality of substrates directly secured together by an electrically conductive securing substance. In one example, the securing substance is a conductive epoxy. In another example, the electrically conductive securing substance is solder. Still another example includes a combination of solder and conductive epoxy. A non-conductive epoxy provides further mechanical connection and thermal conductivity between the substrates while also electrically isolating selected portions of the substrates in one example. The electrically conductive securing substance not only mechanically secures the substrates together and provides thermal conductivity between the substrates, which increases the thermal capacitance of the assembly, but also establishes at least one electrically conductive path between the substrates.

    Abstract translation: 电路载体组件包括通过导电固定物质直接固定在一起的多个基底。 在一个实例中，固定物质是导电环氧树脂。 在另一示例中，导电固定物质是焊料。 另一个实例包括焊料和导电环氧树脂的组合。 非导电环氧树脂在基板之间提供进一步的机械连接和导热性，同时在一个实例中也电绝缘基板的选定部分。 导电固定物质不仅将基板机械地固定在一起并且在基板之间提供导热性，这增加了组件的热容，而且在基板之间建立了至少一个导电路径。

    Component mounting process for printed circuit boards
    14.
    发明授权
    Component mounting process for printed circuit boards 失效
    印刷电路板组件安装工艺

    公开(公告)号：US4873764A

    公开(公告)日：1989-10-17

    申请号：US260852

    申请日：1988-10-21

    Applicant: Frank W. Grimm

    Inventor： Frank W. Grimm

    IPC: H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/40

    CPC classification number: H05K1/184 ,  H05K1/036 ,  H05K1/145 ,  H05K2201/0133 ,  H05K2201/043 ,  H05K2201/091 ,  H05K2201/09845 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K3/4046 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/53174

    Abstract: A process is disclosed for use in the manufacture of layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon. The assembly has at least one inner layer between the first and second layers for receiving and retaining a surface-mount device inserted through aligned holes in the layers. The device has an electrically conductive cap at each end for electrical connection to the conductive patterns. The inner layer physically retains the surface-mount device in place pending the electrical connection of the end caps to the conductive patterns, and by virtue of its being inherently compliant and yielding, provides for physically retaining the surface-mount device in place pending the electrical and mechanical connection of the electrically conductive end caps to the conductive patterns.

    Abstract translation: 公开了一种用于制造具有其上具有导电图案的第一和第二层的分层印刷电路板组件的方法。 组件在第一和第二层之间具有至少一个内层，用于接收和保持插入层中对准的孔的表面安装装置。 该装置在每个端部具有导电盖，用于与导电图案电连接。 内层将表面贴装器件物理地保持在适当位置，等待端盖与导电图案的电连接，并且由于其本身具有柔顺性和屈服性，从而将表面贴装器件物理地保持在适当位置，等待电气 以及导电端盖与导电图案的机械连接。

    Printed circuit board
    15.
    发明授权
    Printed circuit board 失效
    印刷电路板

    公开(公告)号：US4417297A

    公开(公告)日：1983-11-22

    申请号：US279687

    申请日：1981-07-02

    Applicant: Kohei Oyama ,  Hiroyuki Yokouchi

    Inventor： Kohei Oyama ,  Hiroyuki Yokouchi

    IPC: H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K3/40

    CPC classification number: H05K1/184 ,  H05K1/145 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2201/10401 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K3/4046 ,  Y02P70/611

    Abstract: In a printed circuit board wherein chip components are mounted in aligned holes provided through two printed substrates stacked over one another, spacer members are interposed between the printed substrates so as to define spaces therebetween around the holes. Since the printed substrates and chip components are movable relative one another due to such spaces, thermal stresses in the joints between the chip components and the printed substrates can be relieved.

    Abstract translation: 在其中芯片部件安装在通过彼此堆叠的两个印刷基板提供的对准孔中的印刷电路板中，间隔件被插入在印刷基板之间，以便在孔之间限定空间。 由于印刷基板和芯片部件由于这样的空间而相对移动，所以可以减轻芯片部件和印刷基板之间的接合处的热应力。

    Circuit Board and Electronic Device
    16.
    发明公开
    Circuit Board and Electronic Device 审中-公开

    公开(公告)号：US20230345619A1

    公开(公告)日：2023-10-26

    申请号：US17799917

    申请日：2021-11-16

    Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

    Inventor： Qianlin PU ,  Fei LI ,  Zijian WANG ,  Xu LU

    IPC: H05K1/14 ,  H05K1/02

    CPC classification number: H05K1/0218 ,  H05K1/028 ,  H05K1/144 ,  H05K2201/043

    Abstract: A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.

    MODULES AND CONNECTIONS FOR MODULES TO COUPLE TO A COMPUTING DEVICE
    19.
    发明申请
    MODULES AND CONNECTIONS FOR MODULES TO COUPLE TO A COMPUTING DEVICE 有权
    用于耦合到计算设备的模块的模块和连接

    公开(公告)号：US20150277503A1

    公开(公告)日：2015-10-01

    申请号：US14626723

    申请日：2015-02-19

    Applicant: Google, Inc.

    Inventor： Paul Eremenko ,  Ara Knaian ,  Seth Newburg ,  David Fishman

    IPC: G06F1/16 ,  H04M1/02 ,  H04W88/02

    CPC classification number: G06F1/1658 ,  G06F1/1684 ,  H04M1/0254 ,  H04M1/0274 ,  H04W88/02 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/044

    Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

    Abstract translation: 本文的示例包括用于耦合到计算设备的模块的模块和连接。 示例性模块包括壳体，其包括耦合到计算设备的端部，多个电容焊盘，每个电容焊盘包括用于实现数据传输的数据触点，功率接触焊盘以提供或接收电力，以及接地触点焊盘以耦合到地。 接地焊盘的尺寸大于电源接触焊盘，并且接地焊盘定位成比电源接触焊盘更接近配置成耦合到计算设备的壳体的端部。

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