公开(公告)号：US07356918B2

公开(公告)日：2008-04-15

申请号：US10537304

申请日：2003-12-02

Applicant: Osamu Okuda ,  Kazuo Kido ,  Hideki Uchida ,  Haneo Iwamoto ,  Takashi Yazawa ,  Kazuyuki Yoshidomi

Inventor： Osamu Okuda ,  Kazuo Kido ,  Hideki Uchida ,  Haneo Iwamoto ,  Takashi Yazawa ,  Kazuyuki Yoshidomi

IPC: H05K3/30

CPC classification number: H05K13/0812 ,  H05K13/083 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53178

Abstract: An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then an electronic component can be mounted in a prescribed position or almost in the prescribed position.

Abstract translation: 提供具有沿X轴方向和Y轴方向线性变形的结构的X-Y机器人，照相机基准标记和控制单元。 X-Y机器人不会发生翘曲等的位移，并且即使由于连续的动作而发生热量，也仅沿X轴方向和Y轴方向线性变形。 因此，如果通过用板识别摄像机拾取摄像机基准标记的图像而获得由于热量引起的XY机器人的伸缩量，并且基于扩展量校正元件放置位置， 收缩，则电子部件可以安装在规定位置或几乎在规定位置。

公开(公告)号：US20060048380A1

公开(公告)日：2006-03-09

申请号：US10537304

申请日：2003-12-02

Applicant: Osamu Okuda ,  Kazuo Kido ,  Hideki Uchida ,  Haneo Iwamoto ,  Takashi Yazawa ,  Kazuyuki Yoshidomi

Inventor： Osamu Okuda ,  Kazuo Kido ,  Hideki Uchida ,  Haneo Iwamoto ,  Takashi Yazawa ,  Kazuyuki Yoshidomi

IPC: H05K3/30

CPC classification number: H05K13/0812 ,  H05K13/083 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53178

Abstract: An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then the electronic component can be mounted in the prescribed position or almost in the prescribed position.

Abstract translation: 提供具有沿X轴方向和Y轴方向线性变形的结构的X-Y机器人，照相机基准标记和控制单元。 X-Y机器人不会发生翘曲等的位移，并且即使由于连续的动作而发生热量，也仅沿X轴方向和Y轴方向线性变形。 因此，如果通过用板识别摄像机拾取摄像机基准标记的图像而获得由于热量引起的XY机器人的伸缩量，并且基于扩展量校正元件放置位置， 收缩，则电子部件可以安装在规定位置或几乎在规定位置。

公开(公告)号：US06973713B1

公开(公告)日：2005-12-13

申请号：US09559886

申请日：2000-04-26

Applicant: Wolfgang Huber ,  Mohammad Mehdianpour

Inventor： Wolfgang Huber ,  Mohammad Mehdianpour

IPC: H05K13/04 ,  H05K13/08 ,  B23P19/04 ,  G06F19/00

CPC classification number: H05K13/089 ,  H05K13/0818 ,  H05K13/087 ,  Y10T29/4913 ,  Y10T29/53039 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A method, apparatus and system are for operating an automatic component mounting unit for mounting an electrical component onto a substrate of an electrical assembly. The automatic component mounting unit utilizes a number of different mounting members, such as a head, feeding and sensor members, for mounting a variety of different components. Each of the mounting members includes a data storage device. The automatic component mounting unit also includes a control device for communicating with a data storage device of each of the mounting members for processing an amount of process data that is specific to each of the mounting members and that is generated prior to installation. As a result, the mounting members are readily configured for optimal use upon installation of the mounting members.

Abstract translation: 一种方法，装置和系统用于操作用于将电气部件安装到电气组件的基板上的自动部件安装单元。 自动部件安装单元使用许多不同的安装构件，例如头部，进给和传感器构件，用于安装各种不同的部件。 每个安装构件包括数据存储装置。 自动部件安装单元还包括用于与每个安装部件的数据存储装置进行通信的控制装置，用于处理特定于每个安装部件并且在安装之前产生的一定数量的过程数据。 结果，安装构件容易地构造成在安装安装构件时最佳使用。

公开(公告)号：US06961994B2

公开(公告)日：2005-11-08

申请号：US10221142

申请日：2001-03-08

Applicant: Katsumi Terada ,  Akira Yamauchi

Inventor： Katsumi Terada ,  Akira Yamauchi

IPC: H01L21/52 ,  H05K13/04 ,  H05K13/08 ,  H05K3/30

CPC classification number: H05K13/08 ,  H05K13/0413 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads with calibration marks, first recognition mechanism fixed in a chip mounting position, and second recognition mechanism fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads. In mounting operation, the first recognition mechanism recognizes the positions of a substrate and the calibration marks of the heads, whereas the second recognition mechanism recognizes the positions of chips attracted on the heads. The heads are moved vertically to adjust plane to be recognized. The chip and the substrate are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

Abstract translation: 使用包括设置在圆周上的多个头部的安装装置来实现准确和高速的安装。 安装装置包括具有校准标记的多个头部，固定在芯片安装位置的第一识别机构和固定在另一位置的第二识别机构。 在安装操作之前，第一识别机构和第二识别机构识别和存储头部的校准标记的位置。 在安装操作中，第一识别机构识别基板的位置和头的校准标记，而第二识别机构识别吸头头部的位置。 头垂直移动以调整平面以被识别。 芯片和基板根据识别机构获得的位置信息进行对准，并安装芯片。

公开(公告)号：US20040249595A1

公开(公告)日：2004-12-09

申请号：US10493755

申请日：2004-04-27

Inventor： Adrianus Johannes Petrus Maria Vermeer ,  Dionys Van De Ven ,  Robert Cullen ,  Maarten Reith

IPC: G06F019/00

CPC classification number: B25J9/1692 ,  G05B2219/39021 ,  G05B2219/39024 ,  H05K13/089

Abstract: Method and device for calibrating a component placement machine (1) which comprises a substrate holder (2) having at least one reference element (4) and a robot (3) having a gripper (5). A calibration component (7) is moved to an expected position of the reference element (4) relative to the robot (3) by means of the gripper (5). The calibration component (7) comprises a first part which (8) can be coupled to the gripper (5) in a removable way, and a second part (9) which is movable relative to said first part (8). The calibration component (7) is aligned relative to the reference element (4) by means of said second part (9), during which alignment said second part (9) moves relative to said first part (8). The actual relative position of the reference element (4) relative to the robot (3) is then determined on the basis of said movement.

Abstract translation: 用于校准元件放置机器（1）的方法和装置，其包括具有至少一个参考元件（4）的基板保持器（2）和具有夹持器（5）的机器人（3）。 校准组件（7）通过夹具（5）相对于机器人（3）移动到参考元件（4）的预期位置。 校准部件（7）包括第一部分（8）可以以可拆卸的方式联接到夹持器（5），以及可相对于所述第一部分（8）移动的第二部分（9）。 校准组件（7）通过所述第二部分（9）相对于参考元件（4）对准，在该对准期间，所述第二部分（9）相对于所述第一部分（8）移动。 然后基于所述移动来确定参考元件（4）相对于机器人（3）的实际相对位置。

公开(公告)号：US20040026006A1

公开(公告)日：2004-02-12

申请号：US10363693

申请日：2003-03-12

Inventor： Yoshiyuki Arai ,  Akira Yamauchi

IPC: B32B031/00

CPC classification number: H01L21/67294 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L24/75 ,  H05K13/089

Abstract: A chip mounting device comprising a first recognition means (3) for recognizing a first recognition mark (5) on the upper chip-retainable head (2) side, a second recognition means (4) for recognizing a second recognition mark (6) on the lower substrate-retainable stage (1) side, a third recognition means (18) for recognizing the recognition marks (5, 6) concurrently when the first recognition mark (5) is brought close to or into contact with the second recognition mark (6), and a temperature detection means (17) attached to the first recognition means (3) or the second recognition means (4), wherein calibration is carried out based on the recognition of the recognition marks when the temperature detection means (17) detects a beyond-allowance temperature change, whereby permitting a high-accuracy, efficient calibration independently of mechanical deformation and temperature change in environmental atmosphere.

Abstract translation: 一种芯片安装装置，包括用于识别上部可芯片保持头部（2）侧的第一识别标记（5）的第一识别装置（3），用于识别第二识别标记（6）的第二识别装置 下基板保持级（1）侧，第三识别装置（18），用于当第一识别标记（5）靠近或接触第二识别标记时同时识别识别标记（5,6） 6），以及安装在第一识别装置（3）或第二识别装置（4）上的温度检测装置（17），其中当温度检测装置（17）基于识别标记的识别执行校准， 检测超出容限的温度变化，从而独立于环境气氛中的机械变形和温度变化，允许高精度，高效的校准。

公开(公告)号：US20030046812A1

公开(公告)日：2003-03-13

申请号：US10221142

申请日：2002-09-10

Inventor： Katsumi Terada ,  Akira Yamauchi

IPC: H05K003/30 ,  B23P019/00

CPC classification number: H05K13/089 ,  H05K13/041 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A mounting device (1) including a plurality of heads (3), each holding a chip (2), arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads (3) with calibration marks, first recognition means (10) fixed in a chip mounting position (A), and second recognition means (16) fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads (3) In mounting operation, the first recognition means (10) recognizes the positions of a substrate (4) and the calibration marks of the heads (3), whereas the second recognition means (16) recognizes the positions of chips (2) attracted on the heads (3). The heads are moved vertically to adjust plane to be recognized. The chip (2) and the substrate (4) are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

Abstract translation: 使用包括设置在圆上的多个头（3）的安装装置（1），每个头部（3）保持芯片（2），以实现准确和高速的安装。 安装装置包括具有校准标记的多个头部（3），固定在芯片安装位置（A）中的第一识别装置（10）和固定在另一位置的第二识别装置（16）。 在安装操作之前，第一识别机构和第二识别机构识别和存储头部（3）的校准标记的位置在安装操作中，第一识别装置（10）识别基板（4）和 头（3）的校准标记，而第二识别装置（16）识别吸头头（3）上的芯片（2）的位置。 头垂直移动以调整平面以被识别。 芯片（2）和基板（4）根据由识别机构获得的位置信息进行对准，并安装芯片。

公开(公告)号：US12115550B2

公开(公告)日：2024-10-15

申请号：US17744245

申请日：2022-05-13

Applicant: KULICKE AND SOFFA HI-TECH CO., LTD.

Inventor： Lu-Min Chen ,  Tsung-Lin Tsai

IPC: B05C11/10 ,  B05C5/02 ,  H05K13/04 ,  H05K13/08

CPC classification number: B05C11/1005 ,  B05C5/0216 ,  B05C5/027 ,  B05C11/1021 ,  B05C11/1026 ,  H05K13/0469 ,  H05K13/089

Abstract: A dual-valve automatic calibration system comprises a primary positioner, a first secondary positioner and a second secondary positioner: the first secondary positioner and the second secondary positioner are connected with a first fluid coating unit and a second fluid coating unit, respectively; the primary positioner comprises a primary X-axis positioner and a primary Y-axis positioner; both the first secondary positioner and the second secondary positioner are connected with the primary X-axis positioner. In contrast to the prior art that a secondary positioner is installed on a primary Z-axis positioner, a dual-valve automatic calibration system contributes to promotion of positioning precision on the Z-axis and reduction of a burden imposed on the Z-axis.

公开(公告)号：US20240147682A1

公开(公告)日：2024-05-02

申请号：US18221304

申请日：2023-07-12

Applicant: Samsung Display Co., Ltd.

Inventor： Taekyong Lee ,  Daeyeol Han

IPC: H05K13/08 ,  H05K13/00 ,  H05K13/02

CPC classification number: H05K13/081 ,  H05K13/0015 ,  H05K13/0053 ,  H05K13/02 ,  H05K13/084 ,  H05K13/0882 ,  H05K13/089

Abstract: An apparatus for manufacturing a display apparatus includes a controller configured to control a second stage, wherein the controller includes an image processor configured to calculate position information of a first material and a second material and alignment information of a bonded material based on image information sensed by a camera unit, an operator configured to calculate final bonding position based on the position information of the first material and the second material calculated by the image processor, a controller unit configured to move the second stage to the final bonding position calculated by the operator, and a deep learning unit configured to update the operator through deep learning based on the alignment information of the bonded material calculated by the image processor.

公开(公告)号：US20160306343A1

公开(公告)日：2016-10-20

申请号：US15075059

申请日：2016-03-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUJI NAKAMURA ,  HACHIRO NAKATSUJI ,  KENJI OKAMOTO

IPC: G05B19/418

CPC classification number: G05B19/418 ,  G05B19/41865 ,  G05B2219/45032 ,  H05K13/08 ,  H05K13/089 ,  H05K13/0895 ,  Y02P90/04 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/20

Abstract: A management apparatus is connected to a mount substrate manufacturing line including at least a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than the reflow apparatus in a mount substrate manufacturing line, to perform at least any one of an operation relating to maintenance, an operation relating to calibration, and an warm-up operation, based on first data relating to a period of time necessary to complete preparation for performing a process by the reflow apparatus.

Abstract translation: 管理装置通过网络连接至至少包括打印装置，部件安装装置和回流装置的安装基板制造线。 管理装置指示在安装基板制造生产线上比回流装置更上游侧的装置中的至少一个，执行与维护有关的操作，与校准有关的操作， 基于与通过回流装置进行处理的完成准备所需的一段时间有关的第一数据。