公开(公告)号：US11770921B2

公开(公告)日：2023-09-26

申请号：US17235551

申请日：2021-04-20

Applicant: KOH YOUNG TECHNOLOGY INC.

Inventor： Duk Young Lee ,  Jae Hwan Lee ,  Jin Hyung Tak ,  Chan Woo Park ,  Guk Han

IPC: H05K13/08 ,  G05B19/418

CPC classification number: H05K13/0882 ,  G05B19/41885 ,  H05K13/089 ,  G05B2219/45029

Abstract: The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

公开(公告)号：US08447551B1

公开(公告)日：2013-05-21

申请号：US12828184

申请日：2010-06-30

Applicant: Tze Yang Ong ,  Jit Han Tan

Inventor： Tze Yang Ong ,  Jit Han Tan

IPC: G06F11/30 ,  B66F19/00 ,  G01D21/00

CPC classification number: H05K13/0404 ,  H05K13/08 ,  H05K13/089

Abstract: An assembly tool is provided. The assembly tool comprises a body and a gripper mount slidably mounted to the body with a first actuator. The first actuator is configured to slide the gripper mount from a first position to a second position along an axis. The assembly tool also comprises a gripper assembly slidably mounted to the gripper mount with a second actuator. The second actuator is configured to facilitate displacement of the gripper assembly with respect to the gripper mount along the axis. The assembly tool also comprises an encoder configured to indicate a displacement distance between an expected position and an actual position of the gripper assembly with respect to the gripper mount along the axis when the gripper mount is in the second position.

Abstract translation: 提供装配工具。 组装工具包括主体和夹持器安装件，其可滑动地安装到具有第一致动器的主体上。 第一致动器构造成沿着轴线将夹持器从第一位置滑动到第二位置。 组装工具还包括可滑动地安装到具有第二致动器的夹持器安装件的夹持器组件。 第二致动器构造成便于夹持器组件沿着轴线相对于夹持器安装座移动。 组装工具还包括编码器，其构造成当夹具安装件处于第二位置时，沿着轴线指示夹持器组件相对于夹持器安装件的预期位置和实际位置之间的位移距离。

公开(公告)号：US20080250636A1

公开(公告)日：2008-10-16

申请号：US10571853

申请日：2005-06-02

Applicant: Osamu Okuda ,  Takeyuki Kawase ,  Kazuyuki Yoshidomi

Inventor： Osamu Okuda ,  Takeyuki Kawase ,  Kazuyuki Yoshidomi

IPC: H05K3/30 ,  H05K13/04

CPC classification number: H05K13/041 ,  H05K13/0812 ,  H05K13/089 ,  Y10T29/49133 ,  Y10T29/53087 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187

Abstract: Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.

Abstract translation: 识别在玻璃板上以指定间隔排列的参考标记，并且从其识别结果，将与板尺寸匹配的各个区域的偏移值确定为用于校正用途的数值，以及用于组件放置的各个移动位置的进一步相应的偏移值 在作为放置位置校正，标记识别校正或放置位置偏移值的测量的操作中，头被反映为校正用的数值。 因此，实现高精度放置。 此外，执行由于部件放置头的倾斜导致的部件保持部件的位置偏移的校正。

公开(公告)号：US20060059502A1

公开(公告)日：2006-03-16

申请号：US10541984

申请日：2004-01-12

Applicant: Hubert Gerard Jean Vroomen ,  Peter Greve

Inventor： Hubert Gerard Jean Vroomen ,  Peter Greve

IPC: G11B7/24

CPC classification number: H05K13/0812 ,  H05K13/0818 ,  H05K13/089

Abstract: Machine (1) comprising a placement element (7) connected to an imaging device (6), and comprising an optical system (4) for detecting the position of a component (16) relative to the placement element (7) by means of the imaging device (6). The optical system (4) comprises at least one marking element (11). The marking element (11) and the component (16) can be displayed simultaneously by means of the optical system (4) in an image (17) to be made by means of the imaging device (6).

Abstract translation: 机器（1）包括连接到成像装置（6）的放置元件（7），并且包括用于通过所述光学系统检测元件（16）相对于所述放置元件（7）的位置的光学系统（4） 成像装置（6）。 光学系统（4）包括至少一个标记元件（11）。 标记元件（11）和部件（16）可以通过借助于成像装置（6）制成的图像（17）中的光学系统（4）同时显示。

公开(公告)号：US06811627B2

公开(公告)日：2004-11-02

申请号：US10363693

申请日：2003-03-12

Applicant: Yoshiyuki Arai ,  Akira Yamauchi

Inventor： Yoshiyuki Arai ,  Akira Yamauchi

IPC: B32B3100

CPC classification number: H01L21/67294 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L24/75 ,  H05K13/089

Abstract: A chip mounting device comprising a first recognition means (3) for recognizing a first recognition mark (5) on the upper chip-retainable head (2) side, a second recognition means (4) for recognizing a second recognition mark (6) on the lower substrate-retainable stage (1) side, a third recognition means (18) for recognizing the recognition marks (5, 6) concurrently when the first recognition mark (5) is brought close to or into contact with the second recognition mark (6), and a temperature detection means (17) attached to the first recognition means (3) or the second recognition means (4), wherein calibration is carried out based on the recognition of the recognition marks when the temperature detection means (17) detects a beyond-allowance temperature change, whereby permitting a high-accuracy, efficient calibration independently of mechanical deformation and temperature change in environmental atmosphere.

Abstract translation: 一种芯片安装装置，包括用于识别上部可芯片保持头部（2）侧的第一识别标记（5）的第一识别装置（3），用于识别第二识别标记（6）的第二识别装置 下基板保持级（1）侧，第三识别装置（18），用于当第一识别标记（5）靠近或接触第二识别标记时同时识别识别标记（5,6） 6），以及安装在第一识别装置（3）或第二识别装置（4）上的温度检测装置（17），其中当温度检测装置（17）基于识别标记的识别执行校准， 检测超出容限的温度变化，从而独立于环境气氛中的机械变形和温度变化，允许高精度，高效的校准。

公开(公告)号：US20020108239A1

公开(公告)日：2002-08-15

申请号：US10041624

申请日：2002-01-10

Applicant: Fuji Machine Mfg. Co., Ltd.

Inventor： Takeyoshi Isogai ,  Kimihiko Yasuda ,  Noriaki Iwaki ,  Hiroshi Katsumi

IPC: H05K003/30 ,  B23P019/00

CPC classification number: H05K13/0413 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53087 ,  Y10T29/53178 ,  Y10T29/53191

Abstract: A method of detecting a position of a rotation axis of a suction nozzle of an electric-component mounting apparatus, the suction nozzle holding, by suction, an electric component, and being rotated about the rotation axis thereof to rotate the electric component held thereby, so that the electric component rotated is mounted on a component-mounting surface of a circuit substrate, the method including the step of detecting, on a position-detecting plane including the component-mounting surface of the circuit substrate, the position of the rotation axis of the suction nozzle.

Abstract translation: 一种检测电气部件安装装置的吸嘴的旋转轴的位置的方法，所述吸嘴通过抽吸保持电气部件，并且围绕其旋转轴线旋转以旋转由此保持的电气部件， 使得旋转的电气部件安装在电路基板的部件安装表面上，该方法包括以下步骤：在包括电路基板的部件安装表面的位置检测平面上检测旋转轴线的位置 的吸嘴。

公开(公告)号：US20020044432A1

公开(公告)日：2002-04-18

申请号：US10007821

申请日：2001-12-05

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi

IPC: H05K007/02

CPC classification number: H05K13/08 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

Abstract: A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract translation: 用于拾取电子部件的部件安装方法和部件安装装置，将电子部件定位在电路基板上并将电子部件安装到电路基板上适于在部件安装操作的暂停期间执行空转操作，从而消除 由于温度变化，元件安装精度的任何降低。

公开(公告)号：US20240206144A1

公开(公告)日：2024-06-20

申请号：US18594563

申请日：2024-03-04

Applicant: HANWHA PRECISION MACHINERY CO., LTD.

Inventor： Eun Ho CHOI

IPC: H05K13/08

CPC classification number: H05K13/0812 ,  H05K13/0882 ,  H05K13/089

Abstract: An apparatus for mounting a component includes: a head including a nozzle and a substrate recognition camera; a first correction camera generating a first image by capturing an image of a component adsorbed to the nozzle and disposed at a first height; a second correction camera generating a second image by capturing an image of the component adsorbed to the nozzle and disposed at a second height; and a controller obtaining a mounting offset of the component by comparing the first image and the second image with each other and controlling the head so that the component is mounted on the substrate in a state in which the mounting offset is applied.

公开(公告)号：US20180242486A1

公开(公告)日：2018-08-23

申请号：US15752602

申请日：2015-08-27

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Hiroyoshi SUGITA ,  Jun IISAKA ,  Hidetoshi KAWAI ,  Hidetoshi ITO

IPC: H05K13/08 ,  H05K13/04

CPC classification number: H05K13/08 ,  G05B19/401 ,  H05K13/0409 ,  H05K13/0417 ,  H05K13/089

Abstract: A component mounting positional deviation amount measurement unit is set in a feeder setting section of a component mounting machine so as to be exchangeable with a cassette-type feeder, and includes measurement nozzle placement sections in which measurement nozzles exchangeably held in a mounting head of the component mounting machine are placed; measurement component placement sections in which measurement components are placed; and a measurement mounting table on which a measurement fiducial mark is provided. When a component mounting positional deviation amount of the component mounting machine is measured, the measurement component is sucked by the measurement nozzle by holding the measurement nozzle in the mounting head, the measurement component is mounted on the measurement mounting table, and a deviation amount of a mounting position of the measurement component with respect to the measurement fiducial mark is measured as a component mounting positional deviation amount of the component mounting machine.

公开(公告)号：US20090252400A1

公开(公告)日：2009-10-08

申请号：US12414207

申请日：2009-03-30

Applicant: Atsushi Iwase

Inventor： Atsushi Iwase

IPC: G06K9/00 ,  H04N7/18

CPC classification number: H05K13/089

Abstract: In order to recognize grid-like reference marks on a jig plate positioned in a mounting area by means of a substrate recognizing camera respectively, to obtain a positional shift amount of a mounting head with respect to XY coordinates on an apparatus of each of the reference marks, and to correct a mounting position, thereby carrying out a mounting operation, a jig component positioned and mounted sequentially on each of the reference marks formed on the jig plate by means of a nozzle head is recognized by the substrate recognizing camera, a shift amount of XY coordinates acquired by the camera recognition of the jig component from XY coordinates on the apparatus of the corresponding reference mark is obtained as corrected data on the nozzle head with respect to the reference mark, and a correction is carried out based on the corrected data when an electronic component is to be mounted on a substrate by means of the nozzle head.

Abstract translation: 为了通过基板识别摄像机分别在位于安装区域的夹具板上识别格栅状参考标记，以获得相对于每个参考的装置上的XY坐标的安装头的位置偏移量 标记，并且为了校正安装位置，从而执行安装操作，通过喷嘴头顺序地定位和安装在形成在夹具板上的每个参考标记上的夹具组件被基板识别照相机识别，移位 获得相对于基准标记的装置上的XY坐标上的夹具分量的相机识别获得的XY坐标的数量作为校准数据，作为相对于基准标记的喷嘴头的校正数据，并且基于经校正的校正 当通过喷嘴头将电子部件安装在基板上时的数据。