公开(公告)号：US11770921B2

公开(公告)日：2023-09-26

申请号：US17235551

申请日：2021-04-20

申请人： KOH YOUNG TECHNOLOGY INC.

发明人： Duk Young Lee ,  Jae Hwan Lee ,  Jin Hyung Tak ,  Chan Woo Park ,  Guk Han

IPC分类号： H05K13/08 ,  G05B19/418

CPC分类号： H05K13/0882 ,  G05B19/41885 ,  H05K13/089 ,  G05B2219/45029

摘要： The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.