Abstract:
Keyboard having contactors and contacts which are selectively urged against one another by depression causing engagement of one by the other, the keyboard having at least contactors or contacts or both which are constructed of a conductive polymeric composition such that upon engagement of a contactor with a contact there is exhibited substantially reduced bounce after repeated closure of contactor against contact even at micro ampere current levels.
Abstract:
A tactile switch plate for a keyboard member has a planar body portion provided with a plurality of outwardly deformed carrier portions corresponding in number and spacing to the number and spacing of the keys of the keyboard. Each of the carrier portions is resiliently flexible for movement toward the plane of the body and each carrier portion carries a preferably elastomeric switching member that is adapted to bridge the conductors and establish an electrical circuit between the conductors. The plate and switching members are produced by a molding process and the elastomeric switching members are cured by heat.
Abstract:
A key switch structure comprises a first insulating cover having on one surface thereof a first conductive layer and an anisotropically electrical conductive layer printed on the first conductive layer, a second insulating cover having one surface arranged at a side opposite to the anisotropically electrical conductive layer on the first cover member, and a second conductive layer sandwiched between the anisotropically electrical conductive layer and the second insulating cover. At least, one of the first and second insulating covers being flexible. A depression force is selectively introduced from the other surface side of the flexible cover through the anisotropically electrical conductive layer so as to form a conductive path between the first and second conductive layers.
Abstract:
A key switch structure comprises a first insulating cover having on one surface thereof a first conductive layer and an anisotropically electrical conductive layer printed on the first conductive layer, a second insulating cover having one surface arranged at a side opposite to the anisotropically electrical conductive layer on the first cover member, and a second conductive layer sandwiched between the anisotropically electrical conductive layer and the second insulating cover. At least, one of the first and second insulating covers being flexible. A depression force is selectively introduced from the other surface side of the flexible cover through the anisotropically electrical conductive layer so as to form a conductive path between the first and second conductive layers.
Abstract:
A conductive elastomeric ink is described comprised of very fine nickel particles admixed in a silicone binder. The ink has utility in elastomeric switch control devices, printed circuits and the like.
Abstract:
A pressure responsive, variable resistance, analog switch has first and second conductors interleaved in spaced-apart relationship and disposed on a base member. An insulative spacer ring is positioned around and rises above the first and second conductors. A resilient cover sheet is attached to the top of the insulative spacer ring in spaced relationship over the conductors to define an enclosure between the resilient cover sheet and the base member. A pressure sensitive resistive conductor composition is disposed on the resilient cover sheet or on the conductors in the enclosure to interconnect a resistance between the first and second conductors when the resilient cover sheet is depressed against the conductors. The amount of resistance so interconnected varies inversely to the amount of pressure exerted.
Abstract:
A multi-function touch switch apparatus has a first semiconductor composition layer disposed on top of a first conductor layer which is affixed to a first base member. A second semiconductor composition layer opposing the first semiconductor in spaced relationship thereto is disposed on a second conductor layer which is itself disposed on the bottom surface of a second support member. A third conductor layer is also disposed on the top surface of the second support member in opposing spaced-apart relationship to a fourth conductor layer disposed on the bottom surface of a third support member. The second and third support members and the affixed conductor layers and semiconductor layers are resiliently deformable in a transverse axis in response to a transverse touch force to thereby cause electrical contact between the second and third conductor layers to provide a closed switch and the first and second semiconductor layers to provide a closed switch in series with a pressure sensitive resistance.
Abstract:
Semiconductor device package assemblies and associated methods are disclosed herein. The semiconductor device package assembly includes (1) a base component having a front side and a back side, the base component having a first metallization structure at the front side; (2) a semiconductor device package having a first side, a second side with a recess, and a second metallization structure at the first side and a contacting region exposed in the recess at the second side; (3) an interconnect structure at least partially positioned in the recess at the second side of the semiconductor device package; and (4) a thermoset material or structure between the front side of the base component and the second side of the semiconductor device package. The interconnect structure is in the thermoset material and includes discrete conductive particles electrically coupled to one another.
Abstract:
A first resistor layer is formed on the lower surface of a base in film form, and at the same time, a second resistor layer in which particles of different particle diameters are dispersed is formed and layered on the lower surface of the first resistor layer, and thus, a pressure sensitive conductive sheet is formed. In this configuration, the second resistor layer in uneven form makes contact with the fixed contacts in accordance with a pressing force so that electrical connection is made via the second resistor layer and the first resistor layer, and therefore, a thin panel switch with little fluctuation in the resistance value resulting from repeated operation where a stable resistance value can be gained can be realized.
Abstract:
A bounceless switch apparatus having a junction resistance which varies inversely with the pressure applied normally thereto which includes a first conductor member, a pressure-sensitive layer including a semiconducting material covering the first conductor member in intimate electrically conducting contact therewith and a second conductor member positioned in nonelectrically conducting relationship to the pressure-sensitive layer. The pressure-sensitive layer has a first surface with a multiplicity of microprotrusions of the semiconducting material which provide a multiplicity of surface contact locations. As the normally open switch is closed in response to a pressing force applied to urge the second conductor member and the first surface together, the physical contact between the microprotrusions and the second conductor increases thereby variably increasing conduction between the first conductor member and the second conductor member.