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    Sputtered spring films with low stress anisotropy
    11.
    发明申请
    Sputtered spring films with low stress anisotropy 有权
    具有低应力各向异性的溅射弹簧膜

    公开(公告)号：US20030192476A1

    公开(公告)日：2003-10-16

    申请号：US10121644

    申请日：2002-04-12

    Applicant: Xerox Corporation

    Inventor： David K. Fork ,  Scott Solberg ,  Karl Littau

    IPC: C23C014/32 ,  C23C016/00 ,  C23F001/00 ,  B44C001/22

    CPC classification number: G01R1/06733 ,  C23C14/14 ,  C23C14/3492 ,  C23C14/35 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01L21/67167 ,  H01L21/67207 ,  H05K3/4092 ,  Y10T428/24

    Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film formation to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.

    Abstract translation: 公开了用于制造弹簧结构的方法，其通过减少或消除通过操纵制造工艺参数和/或弹簧材料组成形成弹簧的薄膜中的应力各向异性来最小化螺旋扭转。 在一个实施例中，通过在弹簧材料膜形成期间操纵制造参数（即，温度，压力和电偏压）来实现各向同性内部应力，以在弹簧材料的饱和点处产生拉伸或压缩应力。 还公开了通过使用高温或软化金属的引入来调节饱和点的方法。 在其他实施例中，通过随机沉积（例如，压力均化）或定向沉积技术（例如，偏置溅射，脉冲溅射或长投射溅射）产生各向同性的内部应力。 集群工具用于分离释放和弹簧材料的沉积。

    Scanning probe system with spring probe and actuation/sensing structure
    12.
    发明申请
    Scanning probe system with spring probe and actuation/sensing structure 失效
    具有弹簧探头和致动/感应结构的扫描探头系统

    公开(公告)号：US20030183761A1

    公开(公告)日：2003-10-02

    申请号：US10136258

    申请日：2002-04-30

    Applicant: Xerox Corporation

    Inventor： Thomas Hantschel ,  Eugene M. Chow ,  David K. Fork ,  Michel A. Rosa ,  Dirk De Bruyker

    IPC: G12B021/02

    CPC classification number: G01Q70/10 ,  G01Q70/06 ,  G01Q70/16 ,  G01R1/06727 ,  Y10S977/873

    Abstract: Scanning probe systems, which include scanning probe microscopes (SPMS) are disclosed that include cantilevered spring (e.g., stressy metal) probes and actuation/position sensing electrodes formed on a substrate. The actuation electrodes are used to position the spring probe relative to the substrate using electrostatic, magnetic, acoustic, or piezoelectric arrangements. An actuation signal source is switched between full on and off states to facilitate nullON/OFFnull probe actuation in which the spring probe is either fully retracted against the substrate or deployed for scan operations. The position sensing electrodes are used to sense the deflected position of the spring probe relative to the substrate using resistive, magnetic, or piezoresistive arrangements. Spring probe arrays are disclosed that include multiple spring probes arranged on a single substrate. Each spring probe of the array includes a separate actuation electrode that is controlled using nullON/OFFnull or tapping probe actuation, and may include a separate position sensing electrode.

    Abstract translation: 公开了包括扫描探针显微镜（SPMS）的扫描探针系统，其包括形成在基底上的悬臂弹簧（例如，应力金属）探针和致动/位置感测电极。 致动电极用于使用静电，磁，声或压电布置相对于衬底定位弹簧探头。 致动信号源在完全打开和关闭状态之间切换，以便于“ON / OFF”探头致动，其中弹簧探针完全缩回到基板上或部署用于扫描操作。 位置检测电极用于使用电阻，磁阻或压阻布置来感测弹簧探针相对于基底的偏转位置。 公开了包括布置在单个基板上的多个弹簧探针的弹簧探针阵列。 阵列的每个弹簧探针包括使用“ON / OFF”或分接探头致动来控制的单独的致动电极，并且可以包括单独的位置感测电极。

    Microspring with conductive coating deposited on tip after release
    14.
    发明申请
    Microspring with conductive coating deposited on tip after release 有权
    导电涂层的微弹簧释放后沉积在尖端上

    公开(公告)号：US20030010615A1

    公开(公告)日：2003-01-16

    申请号：US09904370

    申请日：2001-07-11

    Applicant: Xerox Corporation

    Inventor： David K. Fork ,  Christopher L. Chua

    IPC: H01H001/02

    CPC classification number: B81C1/00666 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81C1/00476 ,  G01R1/06727 ,  G01R3/00 ,  H01L2924/0002 ,  H01R12/52 ,  H01R12/718 ,  H01R13/035 ,  H01R13/24 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  H01L2924/00

    Abstract: Efficient methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure after release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is then used to etch the spring metal layer to form a spring metal finger. A second (release) mask is then deposited that defines a release window used to remove a portion of the release layer and release a free end of the spring metal finger. The second mask is also used as a mask during the subsequent directional deposition of a conductive coating material on the cantilevered tip of the finger. The second mask is then stripped, and the residual coating deposited thereon is lifted off. The resulting spring structure includes conductive coating on the upper surface and front edge of the finger tip.

    Abstract translation: 公开了用于制造弹簧结构的有效方法，其中在释放之后将无源导电涂层沉积到弹簧结构上。 释放层沉积在基底上，然后在其上形成弹簧金属层。 然后使用第一掩模来蚀刻弹簧金属层以形成弹簧金属指。 然后沉积第二（释放）掩模，其限定用于去除释放层的一部分并释放弹簧金属指的自由端的释放窗口。 在随后将导电涂层材料定向沉积在手指的悬臂尖端上时，第二掩模也用作掩模。 然后剥离第二个掩模，并且将其上沉积的残余涂层剥离。 所得到的弹簧结构包括在指尖的上表面和前边缘上的导电涂层。

    Photolithographically-patterned out-of-plane coil structures and method of making
    15.
    发明申请
    Photolithographically-patterned out-of-plane coil structures and method of making 有权
    光刻图案的平面外线圈结构和制造方法

    公开(公告)号：US20020187662A1

    公开(公告)日：2002-12-12

    申请号：US10152360

    申请日：2002-05-20

    Applicant: Xerox Corporation

    Inventor： David K. Biegelsen ,  Christopher L. Chua ,  David K. Fork

    IPC: H01R012/00

    CPC classification number: H01F17/0006 ,  H01F17/0033 ,  H01F41/041 ,  H01F2027/2814 ,  H01G5/18 ,  H01G5/38 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2924/014 ,  H01L2924/19042 ,  H05K3/4092 ,  H01L2924/00014

    Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. Alternately, the loop winding can be formed of two elastic members in which the free ends are joined in mid-air. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

    Abstract translation: 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 或者，环绕组可由两个弹性构件形成，其中自由端在中空连接。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

    Spring structure with self-aligned release material
    17.
    发明申请
    Spring structure with self-aligned release material 有权
    具有自对准脱模材料的弹簧结构

    公开(公告)号：US20020016095A1

    公开(公告)日：2002-02-07

    申请号：US09917572

    申请日：2001-07-27

    Applicant: Xerox Corporation

    Inventor： David K. Fork ,  Jackson Ho ,  Rachel King-Ha Lau ,  JengPing Lu

    IPC: H05K001/00 ,  H01R012/00

    CPC classification number: G01R1/06716 ,  B81B2203/0118 ,  B81C1/00484 ,  B81C2201/0136 ,  B81C2203/058 ,  G01R1/06727 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R4/48 ,  H01R12/57 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4914 ,  H01L2924/00

    Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

    Abstract translation: 通过使用单个掩模通过形成弹簧金属和释放材料层来将含有接触垫或金属通孔的弹性结构光刻制造到衬底上的有效方法。 具体地说，使用光致抗蚀剂掩模或电镀金属图案或使用剥离处理技术，释放材料垫与弹簧金属手指自对准。 然后使用释放掩模释放弹簧金属指，同时保持将弹簧金属指的锚固部分固定到基底的释放材料的一部分。 当释放材料是导电的（例如钛）时，该释放材料部分直接位于接触垫或金属通孔上方，并且用作在完成的弹簧结构中的弹簧金属指的导管。 当释放材料不导电时，形成金属带以将弹簧金属手指连接到接触垫/通孔。

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