公开(公告)号：US20030192476A1

公开(公告)日：2003-10-16

申请号：US10121644

申请日：2002-04-12

Applicant: Xerox Corporation

Inventor： David K. Fork ,  Scott Solberg ,  Karl Littau

IPC: C23C014/32 ,  C23C016/00 ,  C23F001/00 ,  B44C001/22

CPC classification number: G01R1/06733 ,  C23C14/14 ,  C23C14/3492 ,  C23C14/35 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01L21/67167 ,  H01L21/67207 ,  H05K3/4092 ,  Y10T428/24

Abstract: Methods are disclosed for fabricating spring structures that minimize helical twisting by reducing or eliminating stress anisotropy in the thin films from which the springs are formed through manipulation of the fabrication process parameters and/or spring material compositions. In one embodiment, isotropic internal stress is achieved by manipulating the fabrication parameters (i.e., temperature, pressure, and electrical bias) during spring material film formation to generate the tensile or compressive stress at the saturation point of the spring material. Methods are also disclosed for tuning the saturation point through the use of high temperature or the incorporation of softening metals. In other embodiments, isotropic internal stress is generated through randomized deposition (e.g., pressure homogenization) or directed deposition techniques (e.g., biased sputtering, pulse sputtering, or long throw sputtering). Cluster tools are used to separate the deposition of release and spring materials.

Abstract translation: 公开了用于制造弹簧结构的方法，其通过减少或消除通过操纵制造工艺参数和/或弹簧材料组成形成弹簧的薄膜中的应力各向异性来最小化螺旋扭转。 在一个实施例中，通过在弹簧材料膜形成期间操纵制造参数（即，温度，压力和电偏压）来实现各向同性内部应力，以在弹簧材料的饱和点处产生拉伸或压缩应力。 还公开了通过使用高温或软化金属的引入来调节饱和点的方法。 在其他实施例中，通过随机沉积（例如，压力均化）或定向沉积技术（例如，偏置溅射，脉冲溅射或长投射溅射）产生各向同性的内部应力。 集群工具用于分离释放和弹簧材料的沉积。

公开(公告)号：US20020003231A1

公开(公告)日：2002-01-10

申请号：US09924840

申请日：2001-08-08

Applicant: XEROX CORPORATION

Inventor： Decai Sun ,  Eric Peeters ,  Christopher L. Chua ,  Francesco Lemmi ,  Patrick Y. Maeda ,  Scott Solberg

IPC: H01L029/04

CPC classification number: H01L31/1055 ,  B41J2/45 ,  H01L25/0753 ,  H01L31/1016 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01S5/02 ,  H01S5/0262 ,  H01S5/4025 ,  H01L2924/00

Abstract: A light-producing device integrated with a power monitoring system include a light-producing device from which light is emitted in wavelengths that can range from approximately 700 nm to approximately 3 microns. A semi-transparent sensor is located such that at least a portion of the light emitted passes through the semi-transparent sensor and at least a portion of light is absorbed by the semi-transparent sensor. The semi-transparent sensor is configured to be semi-transparent at wavelengths that can range from 700 nm to 3 microns. The semi-transparent sensor may also be used with an external light source, for example with fiber-optic cables.

Abstract translation: 与功率监测系统集成的发光装置包括发光装置，光发射装置可以在约700nm至约3微米的范围内发射波长。 半透明传感器被定位成使得所发射的光的至少一部分通过半透明传感器，并且至少一部分光被半透明传感器吸收。 半透明传感器被配置为在700nm至3微米范围内的波长处是半透明的。 半透明传感器也可以与外部光源一起使用，例如使用光纤电缆。