Abstract:
A mover combination (226) for moving and positioning a device (34) includes a mover (328) that defines a fluid passageway (370) and a circulation system (330) having a passageway inlet (374) and a passageway outlet (376). The circulation system (330) directs a circulation fluid (378) into the fluid passageway (370). The circulation system (330) can include a liquid/gas separator (384) that is in fluid communication with the fluid passageway (370). With this design, the plumbing for the liquid (378A) and the gas (378B) can each be optimized. Additionally, the circulation system (330) can include a pressure control device (388) that controls the pressure of the circulation fluid (378) in at least a portion of the fluid passageway (370). With this design, the pressure control device (388) controls the pressure of the circulation fluid (378) near the fluid passageway (370) so that the temperature of the circulation fluid (378) at the passageway outlet (376) is approximately equal to the temperature of the circulation fluid (378) at the passageway inlet (374). Moreover, the circulation system (930) can include a pump assembly (980) that directs the circulation fluid (978) into the passageway inlet (974), and a pressure control device (996) that precisely controls a state of the circulation fluid (978) near the passageway inlet (974). With this design, the phase of the circulation fluid (978) at the passageway inlet (974) can be precisely controlled without restricting the flow of the circulation fluid (978).
Abstract:
Regular windings for use in an armature in an electric motor. Windings, each having approximately the same shape as a regular winding, may be overlapped to increase a conductor density within a volume encompassing portions of the windings by having a portion of each winding at least partially fill an aperture of an adjacent overlapping winding. The windings are associated with phases used to operate an electric motor. The windings and armature should be particularly useful in linear electric motors and in steppers used in semiconductor manufacture. Windings of the same shape improve manufacturability of the armature and electric motor. High conductor densities in the windings significantly improve efficiency of the electric motor.
Abstract:
The positioning system, particularly useful for moving a stage mounting a semiconductor wafer for the manufacture of semiconductor devices, provides a lead screw and zero backlash nut for coarse motion of the stage. A thrust member fixedly mounts the nut and the member is flexurally mounted to a housing supporting the stage acting through a piezoelectric motor connection. This action brings the stage in a coarse adjustment mode into the capture range of the piezoelectric motor for fine adjustment by in and out movement of a pusher rod extending from the motor. Flexures allow motion of the thrust member parallel to the lead screw and protects the piezoelectric motor from undesirable side loads. A separate duplicate mechanism is used for each of x-axis and y-axis movements of the housing and stage to bring the stage to a precise position by the respective coarse and fine translationary movements of the lead screw, thrust members and piezoelectric motors.
Abstract:
An optical alignment apparatus and method for a semiconductor lithography mask and wafer utilizes two monochromatic light sources of different wavelengths. The mask contains targets in the form of linear Fresnel zone plates and the wafer contains a reflecting grating. Incident illumination from the two light sources illuminates the mask targets and is reflected from the wafer gratings in various intensity depending on the physical characteristics of the wafer and mask layers and thicknesses and by the targets. A detector detects the strongest of the diffracted return beams from each of the monochromatic light sources and uses the strongest to align the targets and grating on the mask and wafer for more accurate printing of mask patterns on the wafer.
Abstract:
A controlled flow of X-ray attenuating gas such as helium is provided to an upper portion of a beam exposure chamber. A vent tube (21) extends from a lower portion of the chamber adjacent a mask to an exterior exit orifice (23) positioned at mask level to prevent ingress of air to the chamber and prevent mask membrane deflecton and change in the mask-to-silicon wafer substrate gap distance. The substrate (20) is positioned below the mask membrane and is surrounded by a mask-to-wafer zone into which is flowed a substrate fabrication process gas which is vented either by a gas flange (25) in spaced gapped relation to the mask holder and mask, or by a vent tube (46) extending from the zone to an orifice end (46a) approximate the level of the mask. There is then no pressure differential on the top and bottom surfaces of the mask membrane affecting the mask-to-wafer gap distance (8) during substrate fabrication operations.
Abstract:
A target (16) for a metrology system (10) that monitors the position of an object (12) includes a target housing (225) and a photo detector assembly (226). The target housing (225) can include a first target surface (218A), and a second target surface (218B) that is at an angle relative to the first target surface (218A). The photo detector assembly (226) can include a first detector (220A) that is secured to the first target surface (218A), and a second detector (220B) that is secured to the second target surface (218B). Each of the detectors (220A) (220B) can be a quad cell that includes four detector cells (238A) (238B) (238C) (238D) that are separated by a gap (236).
Abstract:
A metrology system that uses a plurality of photo-detecting targets positioned on the objects to be assembled, a plurality of rotating photo-emitting heads, a master signal generator that generates a reference RF signal, and a signal processor that determines the position of each of the targets from signals generated by each target in response to the photo-emitting heads. During operation, the reference RF signal is broadcast to the rotating photo-emitting heads and the photo-detecting targets. The RF signal is used to determine the azimuth of the heads relative to a zero reference position to a high degree of accuracy.
Abstract:
A liquid jet and recovery system for an immersion lithography apparatus has arrays of nozzles arranged to have their openings located proximal to an exposure region through which an image pattern is projected onto a workpiece such as a wafer. These nozzles are each adapted to serve selectively either as a source nozzle for supplying a fluid into the exposure region or as a recovery nozzle for recovering the fluid from the exposure region. A fluid controlling device functions to cause nozzles on selected one or more sides of the exposure region to serve as source nozzles and to cause nozzles on selected one or more of the remaining sides to serve as recovery nozzles such that a desired flow pattern can be established for the convenience of immersion lithography.
Abstract:
An image apparatus (10) for providing an adjusted image (242) of a scene (236) includes a capturing system (16) and a control system (24). The capturing system (16) captures an underexposed first frame (240) that is defined by a plurality of pixels (240A), including a first pixel and a second pixel. The first frame (240) includes at least one of a first texture region (240S) and a second texture region (240T). The control system (24) can analyze information from the pixels (240A) and determine if the first pixel has captured a portion of the first texture region (240S) or the second texture region (240T). Further, the control system (16) can analyze information from the pixels (240A) and to determine if the second pixel has captured a portion of the first texture region (240S) or the second texture region (240T). With this design, the control system (16) can reduce the noise in the first frame (240) to provide a well exposed adjusted image (242).
Abstract:
A liquid jet and recovery system for an immersion lithography apparatus has arrays of nozzles arranged to have their openings located proximal to an exposure region through which an image pattern is projected onto a workpiece such as a wafer. These nozzles are each adapted to serve selectively either as a source nozzle for supplying a fluid into the exposure region or as a recovery nozzle for recovering the fluid from the exposure region. A fluid controlling device functions to cause nozzles on selected one or more sides of the exposure region to serve as source nozzles and to cause nozzles on selected one or more of the remaining sides to serve as recovery nozzles such that a desired flow pattern can be established for the convenience of immersion lithography.