公开(公告)号：US20230085764A1

公开(公告)日：2023-03-23

申请号：US18070825

申请日：2022-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyang NA ,  Kicheol BAE ,  Chulwoo PARK

IPC: H01L23/498 ,  H01L25/16 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: Various embodiments of the disclosure relate to an integrated circuit package, an electronic device including same, and a manufacturing method therefor, the method comprising: attaching at least one first element to a first surface of a substrate; molding the first surface using a first mold; grinding the first mold; attaching at least one second element and at least one connection member comprising a conductive material to a second surface of the substrate; and attaching an interposer substrate including landing pads for an electrical connection with a printed circuit board included in an electronic device to the second surface of the substrate.

公开(公告)号：US20210360796A1

公开(公告)日：2021-11-18

申请号：US17286519

申请日：2019-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungchul PARK ,  Sangwon HA ,  Chulwoo PARK

IPC: H05K3/40 ,  H05K1/11

Abstract: A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.

公开(公告)号：US20190123599A1

公开(公告)日：2019-04-25

申请号：US16222870

申请日：2018-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiyoun JANG ,  Chulwoo PARK ,  Hyundeok SEO ,  Se-Young JANG ,  Chi-Hyun CHO

IPC: H02J50/90 ,  H05K1/16 ,  H04B5/00 ,  H01F38/14 ,  H05K1/18 ,  H02J50/12 ,  H02J7/02

Abstract: Various embodiments of the present disclosure may provide an electronic device that includes: a first plate directed in a first direction, a second plate directed in a second direction opposite to the first direction, and a side member configured to surround at least a part of the space between the first and second plates; a first printed circuit board (PCB) that is disposed between the first and second plates and includes at least one processor; a second printed circuit board (PCB) that is disposed between the first printed circuit board and the second plate and includes at least one antenna pattern; and a temperature sensor disposed to measure the temperature of at least a part of the second printed circuit board. Other various embodiments are possible.

公开(公告)号：US20170185134A1

公开(公告)日：2017-06-29

申请号：US15387068

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun Hui HAN ,  Chulwoo PARK ,  Chi-Hyun CHO

IPC: G06F1/32 ,  H02J7/00 ,  H02J7/02

CPC classification number: G06F1/3212 ,  G06F1/26 ,  G06F1/28 ,  G06F1/30 ,  G06F1/329 ,  G06F1/3296 ,  H02J7/0052 ,  H02J7/025 ,  H02J7/35 ,  H02J2007/0067 ,  Y02D10/172 ,  Y02D10/174 ,  Y02D10/24

Abstract: Disclosed is an electronic device and a method for managing power of the electronic device, in which power consumption of the electronic device is controlled based on at least one of a power value which is inputted to or outputted from a power management integrated circuit, such that a pre-designated operating time of the electronic device can be ensured.

公开(公告)号：US20160254688A1

公开(公告)日：2016-09-01

申请号：US15053880

申请日：2016-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kuchul JUNG ,  Sanghyun RYU ,  Chulwoo PARK ,  Sunggeun YOON

IPC: H02J7/00

CPC classification number: H02J7/007 ,  G01R19/0084 ,  G01R31/362

Abstract: An electronic device of the present disclosure includes a battery cell configured to be electrically connected between a first node and a second node; an over current protection circuit configured to include a first terminal, a second terminal, and a switching element responsive to an occurrence of over current, and the first terminal is electrically connected to the first node; a power management integrated circuit configured to be electrically connected to the second terminal of the over current protection circuit; and a first protection circuit configured to be electrically connected between the first node and the power management integrated circuit, and to include at least one first passive element, wherein the power management integrated circuit monitors a voltage of the battery cell, based on at least a portion of a voltage or a current which is transmitted through the first protection circuit.

Abstract translation: 本公开的电子设备包括：电池单元，被配置为电连接在第一节点和第二节点之间; 过电流保护电路，其被配置为包括响应于过电流的发生的第一端子，第二端子和开关元件，并且所述第一端子电连接到所述第一节点; 电源管理集成电路，被配置为电连接到过电流保护电路的第二端子; 以及第一保护电路，其被配置为电连接在所述第一节点和所述电力管理集成电路之间，并且包括至少一个第一无源元件，其中所述功率管理集成电路基于至少一个第一无源元件来监测所述电池单元的电压 通过第一保护电路传输的电压或电流的一部分。

公开(公告)号：US20140006705A1

公开(公告)日：2014-01-02

申请号：US13835077

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haksoo YU ,  Chulwoo PARK ,  Joosun CHOI

IPC: G11C11/406 ,  G06F3/06

CPC classification number: G11C11/40607 ,  G06F3/0625 ,  G06F12/1009 ,  G06F2212/1028 ,  G11C11/40611 ,  G11C11/40622 ,  Y02D10/13

Abstract: A method for managing operation of a memory includes determining a status of data stored at a memory address, assigning a code based on the status of the data, and selectively performing a power management operation for an area of a memory that includes the memory address based on the code.

Abstract translation: 一种用于管理存储器的操作的方法包括：确定存储在存储器地址中的数据的状态，基于数据的状态分配代码，以及选择性地对包括存储器地址的存储器区域进行功率管理操作 在代码上。

公开(公告)号：US20250087464A1

公开(公告)日：2025-03-13

申请号：US18590406

申请日：2024-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyun SOH ,  Wookhyeon KWON ,  Chulwoo PARK ,  Dongkyu SHIN ,  Hoontaek LEE ,  Minnhoo CHOI ,  Yongwoo KIM ,  Jaehyun KIM ,  Hansol KIM ,  Deukho LEE ,  Junghyun CHO ,  Yangyeon CHU ,  Uzun KAAN

IPC: H01J37/32

Abstract: An embodiment provides a focus ring alignment apparatus including a frame, a sensing member that is connected to the frame and is configured to acquire images of a focus ring within in a substrate processing apparatus, and an alignment module that is connected to the frame and is configured to move the focus ring to change a position of the focus ring.

公开(公告)号：US20240357741A1

公开(公告)日：2024-10-24

申请号：US18640555

申请日：2024-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung CHUNG ,  Jinyong PARK ,  Chulwoo PARK ,  Yongjae SONG ,  Sangwon HA

IPC: H05K1/03

CPC classification number: H05K1/036 ,  H05K2201/0191 ,  H05K2201/0209

Abstract: An electronic device according to an embodiment of the disclosure may comprise: a housing and a printed circuit board disposed in the housing and comprising an alternately stacked plurality of insulation layers and plurality of conductive layers. The plurality of insulation layers may include at least one first insulation layer and at least one second insulation layer. The at least one first insulation layer may include a first insulator including a resin having a Tg value of 200 degrees or more and a filler having a content of 50% to 70%. The at least one second insulation layer may include a second insulator including a glass fiber.

公开(公告)号：US20230245864A1

公开(公告)日：2023-08-03

申请号：US17963704

申请日：2022-10-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： HAKYOUNG KIM ,  DOWON KIM ,  JISOO IM ,  YOUNGJIN NOH ,  Chulwoo PARK ,  MINYOUNG HUR

IPC: H01J37/32

CPC classification number: H01J37/32633 ,  H01J37/32642 ,  H01J2237/334

Abstract: Disclosed are plasma baffles, substrate processing apparatuses, and substrate processing methods. The plasma baffle comprises a lower ring, an upper ring outside the lower ring in a plan view and extending vertically, and an intermediate ring that extends from the lower ring to the upper ring to form an acute angle with respect to a horizontal direction. The lower ring includes a lower central hole that vertically penetrates a center of the lower ring, and a plurality of lower slits outside the lower central hole and vertically penetrating the lower ring. The intermediate ring provides an intermediate slit that connects an inner lateral surface of the intermediate ring to an outer lateral surface of the intermediate ring. An area ratio of the plurality of lower slits to the lower ring is equal to or greater than about 59%.

公开(公告)号：US20220309216A1

公开(公告)日：2022-09-29

申请号：US17491739

申请日：2021-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwoon LEE ,  Joohyun JEON ,  Sungjin KIM ,  Seunghyun KIM ,  Wonki ROH ,  Chulwoo PARK ,  Seongjae BYEON ,  Taeyoon AN ,  Hyoeun JUNG

IPC: G06F30/3308 ,  G06F30/25

Abstract: A method of modeling damages to a crystal caused by an incident particle includes obtaining particle information and crystal information; estimating energy loss of the incident particle based on the particle information and the crystal information; estimating a volume of a vacancy based on the energy loss; estimating a vacancy reaction based on the crystal information and the volume of the vacancy; and generating output data based on the vacancy reaction, the output data including quantification data of the damages.