公开(公告)号：US20240357741A1

公开(公告)日：2024-10-24

申请号：US18640555

申请日：2024-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung CHUNG ,  Jinyong PARK ,  Chulwoo PARK ,  Yongjae SONG ,  Sangwon HA

IPC: H05K1/03

CPC classification number: H05K1/036 ,  H05K2201/0191 ,  H05K2201/0209

Abstract: An electronic device according to an embodiment of the disclosure may comprise: a housing and a printed circuit board disposed in the housing and comprising an alternately stacked plurality of insulation layers and plurality of conductive layers. The plurality of insulation layers may include at least one first insulation layer and at least one second insulation layer. The at least one first insulation layer may include a first insulator including a resin having a Tg value of 200 degrees or more and a filler having a content of 50% to 70%. The at least one second insulation layer may include a second insulator including a glass fiber.

公开(公告)号：US20230121285A1

公开(公告)日：2023-04-20

申请号：US17968308

申请日：2022-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon HA ,  Hyunmo YANG ,  Yeonkyung CHUNG ,  Younoh CHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K3/24 ,  H05K3/42

Abstract: A printed circuit board and/or an electronic device including the same are provided. The printed circuit board and/or an electronic device includes at least one insulation layer including a first rigid region and a flexible region extending from the first rigid region, at least one first circuit pattern disposed on one surface of the at least one insulation layer to at least partially transverse the flexible region from the first rigid region, and at least one conductive pad formed at least partially on a surface of the first circuit pattern in the first rigid region, wherein the flexible region may be configured to flexibly deform more than the first rigid region.

公开(公告)号：US20240407097A1

公开(公告)日：2024-12-05

申请号：US18797982

申请日：2024-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeheung YE ,  Kwangho JUNG ,  Yeonkyung CHUNG

IPC: H05K1/14 ,  H05K1/02

Abstract: A printed circuit board assembly including: a first printed circuit board including a first pad having a first recessed groove that is recessed with an inclined side surface; a second printed circuit board including a second pad, the second printed circuit board provided on the first printed circuit board and facing the first pad; a spacer positioned between the first pad and the second pad; and a solder applied on at least one of the first pad and the second pad and configured to electrically connect the first pad to the second pad, where the spacer includes: a main body; and a first protruding body that protrudes from one surface of the main body with an inclined side surface and is inserted into the first recessed groove.

公开(公告)号：US20230156902A1

公开(公告)日：2023-05-18

申请号：US18091368

申请日：2022-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuhwan LEE ,  Min PARK ,  Haejin LEE ,  Jaeheung YE ,  Yeonkyung CHUNG

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/10378

Abstract: An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.

公开(公告)号：US20220418108A1

公开(公告)日：2022-12-29

申请号：US17900687

申请日：2022-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung CHUNG ,  Jichul KIM ,  Jinyong PARK ,  Gyeongmin JIN

IPC: H05K1/11 ,  H04M1/02 ,  H05K3/34 ,  H05K1/02

Abstract: According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.