公开(公告)号：US20240407097A1

公开(公告)日：2024-12-05

申请号：US18797982

申请日：2024-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeheung YE ,  Kwangho JUNG ,  Yeonkyung CHUNG

IPC: H05K1/14 ,  H05K1/02

Abstract: A printed circuit board assembly including: a first printed circuit board including a first pad having a first recessed groove that is recessed with an inclined side surface; a second printed circuit board including a second pad, the second printed circuit board provided on the first printed circuit board and facing the first pad; a spacer positioned between the first pad and the second pad; and a solder applied on at least one of the first pad and the second pad and configured to electrically connect the first pad to the second pad, where the spacer includes: a main body; and a first protruding body that protrudes from one surface of the main body with an inclined side surface and is inserted into the first recessed groove.

公开(公告)号：US20240334588A1

公开(公告)日：2024-10-03

申请号：US18739889

申请日：2024-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jichul KIM ,  Jaeheung YE ,  Kyuhwan LEE ,  Kwangho JUNG

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/145 ,  H05K1/181 ,  H05K7/20409 ,  H05K2201/10159 ,  H05K2201/10318 ,  H05K2201/10568

Abstract: An electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.

公开(公告)号：US20240306354A1

公开(公告)日：2024-09-12

申请号：US18666570

申请日：2024-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangho JUNG ,  Yongwon LEE ,  Jaeheung YE ,  Jinhwan JEON

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H05K1/0218 ,  H05K1/18 ,  H05K2201/10189 ,  H05K2201/10242

Abstract: An electronic device according to an embodiment includes a printed circuit board including a conductive layer and a conductive pad connected to the conductive layer and exposed to an outside of the printed circuit board; an electric component disposed on a first region of the printed circuit board and the electric component electrically connected to the printed circuit board; a conductive member disposed on the conductive pad and the conductive member surrounding at least part of a periphery of the first region of the printed circuit board; and a shielding member isolating the first region of the printed circuit board from the outside of the printed circuit board by covering the electric component and the conductive member, the shielding member electrically connected to the conductive layer. In addition, various embodiments are possible.