公开(公告)号：US11051251B2

公开(公告)日：2021-06-29

申请号：US17104471

申请日：2020-11-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghui Park ,  Minsoo Kim ,  Chanhun Yun ,  Jinkyu Kim ,  Jiwoo Lee ,  Yeunwook Lim

IPC: H04W52/02 ,  H04W4/80

Abstract: The disclosure relates to a method for providing hardware reset in an electronic device having at least one non-physical key and the electronic device thereof, and an operating method of the electronic device may include detecting a current amount supplied to a processor, detecting whether wireless power is input, generating a hardware reset signal based on the detected current amount and the wireless power input, and transmitting the generated hardware reset signal to the processor.

公开(公告)号：US10477675B1

公开(公告)日：2019-11-12

申请号：US16377582

申请日：2019-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsoo Kim ,  Hyuntae Jung ,  Jiwoo Lee

IPC: H05K1/02 ,  H01Q1/48 ,  H04M1/02 ,  H01Q1/52

Abstract: Various embodiments of the disclosure relate to an electronic device including a capacitive structure. The electronic device may include: a housing including a first plate, a second plate facing a direction opposite the first plate, and a side member comprising a side wall surrounding a space between the first plate and the second plate, the side member including a conductive portion; a conductive mid-plate disposed in the housing parallel to the second plate; a dielectric gap formed between the conductive portion and the conductive mid-plate; a printed circuit board (PCB) disposed inside the housing between the conductive mid-plate and the second plate, the PCB including a ground plane; and a capacitive structure comprising a conductive material disposed at a boundary portion of the dielectric gap and the conductive mid-plate between the conductive mid-plate and the PCB, the capacitive structure including a first conductive layer connected to the conductive mid-plate, a second conductive layer spaced apart from the first conductive layer and electrically connected to the ground plane, and a dielectric layer interposed between the first conductive layer and the second conductive layer.

公开(公告)号：USD854028S1

公开(公告)日：2019-07-16

申请号：US29618081

申请日：2017-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Saegee Oh ,  Sihak Jang ,  Jamin Goo ,  Kiyoung Kwon ,  Gangheok Kim ,  Kiwon Kim ,  Minsoo Kim ,  Yonguk Kim ,  Jimin Kim ,  Chulkwi Kim ,  Joo Namkung ,  Seonghoon Yu ,  Yongju Yu ,  Dongkyu Lee ,  Yosub Lee ,  Imsung Lee ,  Chanwon Lee

公开(公告)号：USD847020S1

公开(公告)日：2019-04-30

申请号：US29600871

申请日：2017-04-17

Applicant: Samsung Electronics Co., Ltd.

Designer： Minsoo Kim

公开(公告)号：USD846440S1

公开(公告)日：2019-04-23

申请号：US29600874

申请日：2017-04-17

Applicant: Samsung Electronics Co., Ltd.

Designer： Minsoo Kim

公开(公告)号：US10108230B2

公开(公告)日：2018-10-23

申请号：US14877437

申请日：2015-10-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo Kim ,  Jaehwan Kim ,  Jinman Kim ,  Youngtae Jeong

IPC: G06F3/041 ,  G06F1/16 ,  G02F1/1333

Abstract: An electronic device including a flexible display and a method capable of determining a bending direction of the flexible display by using at least one bending confirmation touch recognition pattern are provided. The electronic device includes a flexible display unit including a display panel and a support structure configured to support the display panel; a sensor unit configured to sensing bending of the flexible display unit; and a control unit configured to determine a bending extent and a bending direction of the flexible display unit based on a sensing result of the sensor unit, wherein a plurality of touch recognition patterns are arranged on the display panel and the support structure, and the arranged touch recognition patterns include a bending confirmation pattern.

公开(公告)号：US09931838B2

公开(公告)日：2018-04-03

申请号：US15254019

申请日：2016-09-01

Applicant: SAMSUNG DISPLAY CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongjun Lee ,  Minsoo Kim ,  Jongwon Kim ,  Seungdon Lee ,  Hyunjin Lee

IPC: B41J2/045 ,  H01L51/56 ,  H01L51/52 ,  H01L27/32 ,  G02F1/133 ,  G02F1/1337 ,  G02F1/1341

CPC classification number: B41J2/04541 ,  B41J2/04586 ,  G02F1/1303 ,  G02F1/13306 ,  G02F1/1337 ,  G02F1/1341 ,  H01L27/3244 ,  H01L51/0005 ,  H01L51/5253 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/558

Abstract: An inkjet printing method includes: setting a first region to be printed at a constant print density within a target region to be printed; setting a second region within the target region and closer than the first region to an edge of the target region, wherein the second region is to be printed at a print density that varies according to a position; generating control data for a plurality of nozzles provided on an inkjet head in order to print the first region and the second region; and driving the inkjet head according to the control data.

公开(公告)号：US09721930B2

公开(公告)日：2017-08-01

申请号：US15168236

申请日：2016-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyoungjoo Lee ,  Minsoo Kim ,  Teak Hoon Lee ,  Young Kun Jee

IPC: H01L23/52 ,  H01L25/065 ,  H01L23/498 ,  H01L25/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/49838 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A semiconductor package includes a first semiconductor chip stacked on a package substrate in which a first surface of the first semiconductor chip faces the package substrate and a second surface that is opposite to the first surface, a second semiconductor chip stacked on the first semiconductor chip that includes a third surface facing the first semiconductor chip and a fourth surface that is opposite to the third surface, and an integral adhesive structure that substantially continuously fills a first space between the package substrate and the first semiconductor chip and a second space between the first and second semiconductor chips. The integral adhesive structure includes an extension protruding from outer sidewalls of the first and second semiconductor chips. The extension has one continuously convex sidewall between a level of the first surface and a level of the fourth surface.

公开(公告)号：USD764466S1

公开(公告)日：2016-08-23

申请号：US29536748

申请日：2015-08-19

Applicant: Samsung Electronics Co., Ltd.

Designer： Minsoo Kim ,  Jinsoo Kim ,  Yongseok Bang

公开(公告)号：USD752680S1

公开(公告)日：2016-03-29

申请号：US29511257

申请日：2014-12-09

Applicant: Samsung Electronics Co., Ltd.

Designer： Minsoo Kim ,  Yongseok Bang ,  Jinsoo Kim