PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME

    公开(公告)号:US20250020997A1

    公开(公告)日:2025-01-16

    申请号:US18632766

    申请日:2024-04-11

    Abstract: A photoresist composition including an organometallic compound, which includes at least one metal-ligand bond, a metal core, and at least one organic ligand bonded to the metal core; at least one first organic ligand precursor, which is different in chemical structure from the at least one organic ligand of the organometallic compound, and which includes a sulfonic acid group and has a structure capable of forming a coordination complex with the metal core; and a solvent. A method of manufacturing an integrated circuit device that includes forming a photoresist film on a substrate by use of the photoresist composition and forming a modified organometallic compound by binding an organic ligand including a sulfonic acid group to the organometallic compound through a ligand exchange between the organometallic compound and the at least one first organic ligand precursor based on chemical equilibrium in the photoresist film.

    Electronic device including wireless charging structure

    公开(公告)号:US11670963B2

    公开(公告)日:2023-06-06

    申请号:US16852884

    申请日:2020-04-20

    Abstract: An electronic device is provided. The electronic device includes a housing including a front plate that faces a first direction and a rear plate that faces a second direction, which is opposite the first direction, a display panel configured to output a screen through the front plate, a bracket disposed between the display panel and the rear plate, the bracket being configured to support internal components, a flexible printed circuit board including a first area electrically connected to the display panel, and a second area extending from the first area and disposed between the display panel and the bracket, a wireless charging structure disposed on one face of the second area or inside the second area, the wireless charging structure including a coil portion and transmission wires electrically connected to the coil portion, and a magnetic plate disposed between the bracket and the flexible printed circuit board, and at least one area of the magnetic plate being disposed to face the wireless charging structure.

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