公开(公告)号：US20250020997A1

公开(公告)日：2025-01-16

申请号：US18632766

申请日：2024-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Suk Koo Hong ,  Jaemyoung Kim ,  Taegeun Seong ,  Minyoung Lee ,  Moohyun Koh ,  Kyungoh Kim ,  Minsoo Kim ,  Changsoo Woo

IPC: G03F7/004 ,  H01L21/027

Abstract: A photoresist composition including an organometallic compound, which includes at least one metal-ligand bond, a metal core, and at least one organic ligand bonded to the metal core; at least one first organic ligand precursor, which is different in chemical structure from the at least one organic ligand of the organometallic compound, and which includes a sulfonic acid group and has a structure capable of forming a coordination complex with the metal core; and a solvent. A method of manufacturing an integrated circuit device that includes forming a photoresist film on a substrate by use of the photoresist composition and forming a modified organometallic compound by binding an organic ligand including a sulfonic acid group to the organometallic compound through a ligand exchange between the organometallic compound and the at least one first organic ligand precursor based on chemical equilibrium in the photoresist film.