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公开(公告)号:US12166097B2
公开(公告)日:2024-12-10
申请号:US18390246
申请日:2023-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungil Park , Jae Hyun Park , Kyungho Kim , Cheoljin Yun , Daewon Ha
IPC: H01L29/78 , H01L29/423 , H01L29/786
Abstract: A semiconductor device includes a lower channel pattern and an upper channel pattern stacked on a substrate in a first direction perpendicular to a top surface of the substrate, lower source/drain patterns on the substrate and at a first side and a second side of the lower channel pattern, upper source/drain patterns stacked on the lower source/drain patterns and at a third side and a fourth side of the upper channel pattern, a first barrier pattern between the lower source/drain patterns and the upper source/drain patterns, and a second barrier pattern between the first barrier pattern and the upper source/drain patterns. The first barrier pattern includes a first material and the second barrier pattern includes a second material, wherein the first material and the second material are different.
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公开(公告)号:US11888044B2
公开(公告)日:2024-01-30
申请号:US17583314
申请日:2022-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungil Park , Jae Hyun Park , Kyungho Kim , Cheoljin Yun , Daewon Ha
IPC: H01L29/423 , H01L29/786 , H01L29/165 , H01L21/82
CPC classification number: H01L29/42392 , H01L29/78618 , H01L29/78696
Abstract: A semiconductor device includes a lower channel pattern and an upper channel pattern stacked on a substrate in a first direction perpendicular to a top surface of the substrate, lower source/drain patterns on the substrate and at a first side and a second side of the lower channel pattern, upper source/drain patterns stacked on the lower source/drain patterns and at a third side and a fourth side of the upper channel pattern, a first barrier pattern between the lower source/drain patterns and the upper source/drain patterns, and a second barrier pattern between the first barrier pattern and the upper source/drain patterns. the first barrier pattern includes a first material and the second barrier pattern includes a second material, wherein the first material and the second material are different.
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公开(公告)号:US09654118B2
公开(公告)日:2017-05-16
申请号:US15179202
申请日:2016-06-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junhan Bae , Kee-Won Kwon , Kyungho Kim , Jung Hoon Chun , Youngsoo Sohn , Seok Kim
CPC classification number: H03L7/0891 , H03D13/004 , H03L7/081 , H03L7/085 , H03L7/087 , H03L7/0995 , H03L7/104 , H03L7/107 , H03L7/1072
Abstract: A phase-rotating phase locked loop (PLL) may include first and second loops that share a loop filter and a voltage controlled oscillator in order to perform the operation of a phase-rotating PLL, the first and second loops configured to activate in response to an enable signal. The PLL may further include a phase frequency detection controller configured to provide the enable signal to the first and second loops in response to a transition of a coarse signal that may be applied as a digital code.
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公开(公告)号:US20160089340A1
公开(公告)日:2016-03-31
申请号:US14866216
申请日:2015-09-25
Inventor: Sungchun Cho , Kyungho Kim , Euiseok Shin , Jongsun Kang , Jooho Shin , Juhyeon Bae , Hyeonju Jeong , Areum Jo , Sangchul Park
IPC: A61K31/045 , G01N33/50
Abstract: A method of increasing PGC-1α gene expression, decreasing PARIS gene expression, or promoting farnesylation of PARIS in a mammalian cell, the method comprising administering an effective amount of farnesol, a pharmaceutically acceptable salt thereof, or a solvate thereof to the cell; and related methods and compositions.
Abstract translation: 一种在哺乳动物细胞中增加PGC-1α基因表达,减少PARIS基因表达或促进PARIS的法呢基化的方法,该方法包括向细胞施用有效量的法呢醇,其药学上可接受的盐或其溶剂合物; 以及相关方法和组成。
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公开(公告)号:US20230420535A1
公开(公告)日:2023-12-28
申请号:US18195074
申请日:2023-05-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kanghun Moon , Kyungho Kim , Kihwan Kim , Choeun Lee , Yonguk Jeon
IPC: H01L29/423 , H01L29/66 , H01L29/417 , H01L29/786 , H01L29/06 , H01L29/775
CPC classification number: H01L29/42392 , H01L29/66545 , H01L29/41775 , H01L29/78696 , H01L29/0673 , H01L29/775
Abstract: A semiconductor device includes: an active region on a substrate extending in a first direction; a plurality of semiconductor layers spaced apart from each in a vertical direction on the active region, the plurality of semiconductor layers including lower and upper semiconductor layers; a gate structure on the substrate extending in a second direction to intersect the active region and the plurality of semiconductor layers; and a source/drain region on the active region and contacting the plurality of semiconductor layers. The source/drain region includes first epitaxial layers, including first layers on a side surface of the lower semiconductor layer and a second layer provided on and contacting the active region, and a second epitaxial layer contacts a side surface of the upper semiconductor layer in the first direction, and the first layer is between the second epitaxial layer and the side surface of the lower semiconductor layer.
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