Semiconductor devices with stacked transistor structures

    公开(公告)号:US12166097B2

    公开(公告)日:2024-12-10

    申请号:US18390246

    申请日:2023-12-20

    Abstract: A semiconductor device includes a lower channel pattern and an upper channel pattern stacked on a substrate in a first direction perpendicular to a top surface of the substrate, lower source/drain patterns on the substrate and at a first side and a second side of the lower channel pattern, upper source/drain patterns stacked on the lower source/drain patterns and at a third side and a fourth side of the upper channel pattern, a first barrier pattern between the lower source/drain patterns and the upper source/drain patterns, and a second barrier pattern between the first barrier pattern and the upper source/drain patterns. The first barrier pattern includes a first material and the second barrier pattern includes a second material, wherein the first material and the second material are different.

    Semiconductor devices with stacked transistor structures

    公开(公告)号:US11888044B2

    公开(公告)日:2024-01-30

    申请号:US17583314

    申请日:2022-01-25

    CPC classification number: H01L29/42392 H01L29/78618 H01L29/78696

    Abstract: A semiconductor device includes a lower channel pattern and an upper channel pattern stacked on a substrate in a first direction perpendicular to a top surface of the substrate, lower source/drain patterns on the substrate and at a first side and a second side of the lower channel pattern, upper source/drain patterns stacked on the lower source/drain patterns and at a third side and a fourth side of the upper channel pattern, a first barrier pattern between the lower source/drain patterns and the upper source/drain patterns, and a second barrier pattern between the first barrier pattern and the upper source/drain patterns. the first barrier pattern includes a first material and the second barrier pattern includes a second material, wherein the first material and the second material are different.

    SEMICONDUCTOR DEVICES
    15.
    发明公开

    公开(公告)号:US20230420535A1

    公开(公告)日:2023-12-28

    申请号:US18195074

    申请日:2023-05-09

    Abstract: A semiconductor device includes: an active region on a substrate extending in a first direction; a plurality of semiconductor layers spaced apart from each in a vertical direction on the active region, the plurality of semiconductor layers including lower and upper semiconductor layers; a gate structure on the substrate extending in a second direction to intersect the active region and the plurality of semiconductor layers; and a source/drain region on the active region and contacting the plurality of semiconductor layers. The source/drain region includes first epitaxial layers, including first layers on a side surface of the lower semiconductor layer and a second layer provided on and contacting the active region, and a second epitaxial layer contacts a side surface of the upper semiconductor layer in the first direction, and the first layer is between the second epitaxial layer and the side surface of the lower semiconductor layer.

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