公开(公告)号：US11087721B2

公开(公告)日：2021-08-10

申请号：US16584228

申请日：2019-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taewoo Kim ,  Hongki Kwon ,  Jaehun Kim ,  Jinyong Park ,  Jaeyoul Lee ,  Hyunwook Lim ,  Woohyuk Jang ,  Hojun Chung

IPC: G09G5/393 ,  G06T5/00 ,  G06T5/50

Abstract: A display driver circuit includes a receiver that receives a still image or a moving image, a frame buffer that stores the still image received by the receiver in a still image mode, an image processor that performs an image enhancement operation on the moving image transferred from the receiver or the still image transferred from the frame buffer, and a motion processor that performs a motion compensation operation using a current frame output from the image processor and a previous frame stored in the frame buffer in a moving image mode. The previous frame is data which, in the moving image mode, are processed by the image processor before the current frame and are then stored in the frame buffer. The previous frame is output from the frame buffer to the motion processor in synchronization with the current frame.

公开(公告)号：US10709043B2

公开(公告)日：2020-07-07

申请号：US16575679

申请日：2019-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim Yun ,  Bongkyu Min ,  Dohoon Kim ,  Taewoo Kim ,  Jinyong Park ,  Jungje Bang ,  Hyeongju Lee

IPC: H05K7/00 ,  H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K7/14 ,  H05K1/14

Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

公开(公告)号：US12112688B2

公开(公告)日：2024-10-08

申请号：US17549382

申请日：2021-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ohjae Kwon ,  Jinyong Park ,  Hwaseok Seong ,  Jinsung Kang

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/0452 ,  G09G2320/0233 ,  G09G2320/041 ,  G09G2320/0626

Abstract: A display apparatus may include a display panel including a plurality of light emitting diode (LED) pixels; a panel driver configured to provide a driving signal to the display panel to drive the display panel; a memory storing heating characteristic information of each of a red (R) sub-pixel, a green (G) sub-pixel, and a blue (B) sub-pixel included in each of the plurality of LED pixels; and a processor configured to: obtain an average brightness value corresponding to an input image based on a gray level value of the input image, obtain heating estimation data of the input image based on the gray level value of the input image and the heating characteristic information stored in the memory, modify the obtained average brightness value based on the heating estimation data, and control the panel driver based on the modified average brightness value.

公开(公告)号：US12022614B2

公开(公告)日：2024-06-25

申请号：US17487673

申请日：2021-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongkyu Min ,  Taewoo Kim ,  Jinyong Park ,  Hyelim Yun ,  Hyeongju Lee ,  Sanghoon Park ,  Jiseon Han

IPC: H05K1/00 ,  H01L23/528 ,  H04M1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/141 ,  H01L23/528 ,  H04M1/0277 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/10378

Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.

公开(公告)号：US11675392B2

公开(公告)日：2023-06-13

申请号：US17564773

申请日：2021-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinyong Park ,  Dongku Kang ,  Jichul Kim ,  Bongkyu Min ,  Baekeun Cho ,  Chihyun Cho ,  Hyuncheol Jin

IPC: G06F1/16 ,  G06F1/18

CPC classification number: G06F1/1652 ,  G06F1/1624 ,  G06F1/1635 ,  G06F1/1698 ,  G06F1/183

Abstract: An electronic device is provided. The electronic device includes a rollable display. The electronic device may include a main bracket configured to support the first portion of the rollable display, a roller member disposed in the first direction from the main bracket and arranged in a third direction perpendicular to the first direction, at least one folding support member disposed between the main bracket and the roller member and configured to support the second portion of the rollable display, a circuit board disposed to overlap at least a portion of the main bracket, at least one electronic component disposed adjacent to the roller member, and a FPCB configured to electrically connecting the main circuit board and the electronic component, wherein the FPCB is disposed to pass through the folding support member and extends from a portion of the circuit board to a portion of the electronic component.

公开(公告)号：US20230137060A1

公开(公告)日：2023-05-04

申请号：US17807237

申请日：2022-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinyong Park ,  Hongki Kwon ,  Taewoo Kim ,  Hyeonsu Park ,  Hyunwook Lim ,  Hojun Chung

IPC: G09G5/393 ,  G09G3/36

Abstract: A display driver integrated circuit includes a frame buffer, a plurality of image processing circuits and an image processing controller. The frame buffer sequentially stores a plurality of frame data received from a host processor. Each of the plurality of frame data includes a plurality of data slices. The image processing circuits perform image signal processing operations, respectively, on ones of the data slices that are included in a respective one of the plurality of frame data and which are sequentially retrieved from the frame buffer. The image processing controller bypasses at least one of the image processing circuits by applying a bypass control signal to the image processing circuits based on a first plurality of data slices included in a first one of the plurality of frame data and a second plurality of data slices included in a second one of the plurality of frame data.

公开(公告)号：US11527191B2

公开(公告)日：2022-12-13

申请号：US16866930

申请日：2020-05-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hojun Chung ,  Hongki Kwon ,  TaeWoo Kim ,  Jinyong Park ,  Jaeyoul Lee

IPC: H04N19/176 ,  G09G3/20 ,  H04N19/182

Abstract: The present invention provides a display driver circuit. A determination circuit is configured to select a first mode for encoding first image data based on a first set of conditions respectively corresponding to a first set of modes. An encoder is configured to encode the first image data in the first mode. The determination circuit is additionally configured to select a second mode for encoding second image data received (n−1)th after the first image data are received; and to select a third mode for encoding third image data received(n)th after the first image data are received, based on a second set of conditions respectively corresponding to the first set of modes. A second condition in the second set of the conditions corresponding to the second mode includes a wider range of values than a first condition in the first set of the conditions corresponding to the second mode.

公开(公告)号：US11330716B2

公开(公告)日：2022-05-10

申请号：US17132484

申请日：2020-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinyong Park ,  Taewoo Kim ,  Hyeongju Lee ,  Bongkyu Min ,  Jungsik Park ,  Hyelim Yun

IPC: H05K1/14 ,  H05K1/11 ,  H05K5/00 ,  H05K1/02 ,  H05K3/46 ,  H04M1/02 ,  H01Q1/24 ,  H05K1/03 ,  H04M1/03

Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical terminal and the third electrical terminal are electrically coupled to each other, the second electrical terminal and the fourth electrical terminal are electrically coupled to each other, and the first ground terminal and the second ground terminal are electrically coupled to each other.

公开(公告)号：US12302495B2

公开(公告)日：2025-05-13

申请号：US17900687

申请日：2022-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung Chung ,  Jichul Kim ,  Jinyong Park ,  Gyeongmin Jin

IPC: H05K1/11 ,  H04M1/02 ,  H05K1/02 ,  H05K3/34

Abstract: According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.

公开(公告)号：US20250023664A1

公开(公告)日：2025-01-16

申请号：US18646461

申请日：2024-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinyong Park ,  Kyungho Ryu ,  Yongil Kwon ,  Alankyongho Kim ,  Yong-Yun Park ,  Jung-Pil Lim ,  Hyunwook Lim

IPC: H04L1/00

Abstract: Provided is a communication system including a first electronic device and a second electronic device connected with each other through first and second channels. The second electronic device includes a reception driver generating a first internal signal based on a first data signal provided by the first electronic device through the first channel, an error detector generating an error detection signal by determining whether an error is included in the first internal signal, and an error adjuster outputting a first feedback signal through the second channel based on the error detection signal, and the first electronic device outputs a second data signal having a voltage swing width determined based on the first feedback signal through the first channel.