公开(公告)号：US20240385665A1

公开(公告)日：2024-11-21

申请号：US18788715

申请日：2024-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joseph AHN ,  Youngchul LEE ,  Taehyeong KIM ,  Hongki MOON ,  Jongkil PARK

IPC: G06F1/20 ,  G06F1/16 ,  G06F1/18 ,  H05K1/02 ,  H05K7/20

Abstract: An electronic device is provided. The electronic device includes a housing, a display disposed in the housing, a support member configured to support the display and including a first surface facing the display, a second surface facing the opposite direction to the first surface, and a first opening formed to penetrate at least one portion of the first surface and the second surface, a battery disposed on the second surface of the support member, wherein at least one portion of the battery faces the first opening, a printed circuit board disposed on the second surface of the support member and spaced from the battery, and a heat-radiating member configured to mediate heat transfer between the display and the printed circuit board, and including a first area and a second area coupled to the first area, wherein the first area is at least partially disposed to overlap the first surface, wherein the second area is at least partially disposed in the first opening, and wherein the at least a portion of the first area is coupled to the support member by laser welding.

公开(公告)号：US20200322467A1

公开(公告)日：2020-10-08

申请号：US16839534

申请日：2020-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung HUH ,  Kyungwan PARK ,  Seunghoon KANG ,  Boram KIM ,  Youngjin KIM ,  Sunghoon MOON ,  Hongki MOON ,  Yoonsun PARK ,  Hajoong YUN ,  Jonghoon LIM

IPC: H04M1/02 ,  H04N5/225 ,  H05K1/18 ,  H05K7/20

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing

公开(公告)号：US20200100390A1

公开(公告)日：2020-03-26

申请号：US16577835

申请日：2019-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungha KOO ,  Kuntak KIM ,  Jihong KIM ,  Hongki MOON ,  Hajoong YUN ,  Haejin LEE ,  Seyoung JANG

IPC: H05K7/20 ,  F28D15/04 ,  F28F21/06

Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.

公开(公告)号：US20230350472A1

公开(公告)日：2023-11-02

申请号：US18346394

申请日：2023-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck KWON ,  Jaeyoung HUH ,  Daesuk KANG ,  Seunghoon KANG ,  Boram KIM ,  Hongki MOON ,  Yoonsun PARK ,  Kyungwoo LEE ,  Seungjoo LEE ,  Jonghoon LIM

IPC: G06F1/20 ,  H01L23/427 ,  G06F1/16

CPC classification number: G06F1/203 ,  H01L23/427 ,  G06F1/206 ,  G06F1/1637

Abstract: Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.

公开(公告)号：US20230195167A1

公开(公告)日：2023-06-22

申请号：US18083322

申请日：2022-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeran JUNG ,  Seunghoon KANG ,  Hongki MOON ,  Jongkil PARK ,  Seungjoo LEE

IPC: G06F1/16 ,  G06F1/20 ,  H05K7/20

CPC classification number: G06F1/1624 ,  G06F1/1652 ,  G06F1/20 ,  H05K7/20963

Abstract: According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion configured to be unfolded based on the sliding movement of the first housing and including a first display area disposed on the first housing and a second display area extending from the first display area, an electrical component disposed in the housing, a heat dissipation sheet configured to receive heat generated from the electrical component and including a bending area facing the first display area and a fixed area facing the second display area, and a slit structure formed in at least a portion of the bending area and including at least a portion extending along a first direction inclined from a direction of the sliding movement of the first housing.

公开(公告)号：US20230026298A1

公开(公告)日：2023-01-26

申请号：US17869109

申请日：2022-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joseph AHN ,  Kyungha KOO ,  Hongki MOON

IPC: H05K7/20 ,  H05K5/04 ,  H05K5/02

Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

公开(公告)号：US20210392736A1

公开(公告)日：2021-12-16

申请号：US17286007

申请日：2019-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungha KOO ,  Hongki MOON ,  Chihwan JEONG ,  Kuntak KIM ,  Yunjeong PARK ,  Seungjoo LEE ,  Haejin LEE ,  Seyoung JANG

IPC: H05K1/02 ,  H05K1/14

Abstract: Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.

公开(公告)号：US20190223329A1

公开(公告)日：2019-07-18

申请号：US16324527

申请日：2017-07-24

Applicant: Samsung Electronics Co., Ltd

Inventor： Hongki MOON ,  Kihyun KIM ,  Jae-Il SEO ,  Jihong KIM ,  Yoon-Sun PARK ,  Wooram LEE ,  Se-Young JANG ,  Jongchul HONG ,  Kyungha KOO

IPC: H05K7/20 ,  H02J7/02 ,  H02J7/00 ,  H02J50/10 ,  H02J50/70 ,  H05K5/00

CPC classification number: H05K7/20909 ,  H02J7/0042 ,  H02J7/0044 ,  H02J7/02 ,  H02J7/025 ,  H02J50/10 ,  H02J50/70 ,  H05K5/0004 ,  H05K7/20 ,  H05K7/20172

Abstract: According to various embodiments, a wireless charging device can comprise: a first housing, which includes a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and includes at least one hole; a second housing arranged on the second surface of the first housing in the second direction; a coil unit arranged between the first housing and the second housing and configured to transmit power to an external device; a shielding member arranged adjacent to the coil unit and including at least one hole; and a fan arranged adjacent to the coil unit and configured to rotate.