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    ELECTRONIC DEVICE INCLUDING VAPOR CHAMBER
    2.
    发明申请
    ELECTRONIC DEVICE INCLUDING VAPOR CHAMBER 有权

    公开(公告)号：US20220272868A1

    公开(公告)日：2022-08-25

    申请号：US17673099

    申请日：2022-02-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hongki MOON ,  Kyungha KOO ,  Yoonsun PARK ,  Youngjae YOU ,  Hyunjoo LEE ,  Joseph AHN

    IPC: H05K7/20

    Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
    4.
    发明申请
    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE 有权

    公开(公告)号：US20210410268A1

    公开(公告)日：2021-12-30

    申请号：US17293280

    申请日：2019-11-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hongki MOON ,  Yoonsun PARK ,  Seunghoon KANG ,  Kyungha KOO ,  Seyoung JANG ,  Woojune JUNG

    IPC: H05K1/02 ,  H05K1/14 ,  H05K7/20

    Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

    HEAT TRANSFER MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME
    5.
    发明申请
    HEAT TRANSFER MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200267828A1

    公开(公告)日：2020-08-20

    申请号：US16795223

    申请日：2020-02-19

    Applicant: Samsung Electronics Co, Ltd

    Inventor： Hongki MOON ,  Yoonsun PARK ,  Seunghoon KANG ,  Kyungha KOO ,  Hajoong YUN ,  Seungjoo LEE ,  Yeonjoo LEE ,  Seyoung JANG

    IPC: H05K1/02 ,  H02J50/27

    Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.

    ELECTRONIC DEVICE WITH HEAT-RADIANT STRUCTURE
    7.
    发明申请
    ELECTRONIC DEVICE WITH HEAT-RADIANT STRUCTURE 审中-公开

    公开(公告)号：US20200319307A1

    公开(公告)日：2020-10-08

    申请号：US16840037

    申请日：2020-04-03

    Applicant: Samsung Electronics Co., Ltd. ,  Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jaeyoung HUH ,  Kyungwan PARK ,  Jungho BAE ,  Boram KIM ,  Youngjin KIM ,  Hyun KIM ,  Byeonghoon PARK ,  Yoonsun PARK ,  Woontahk SUNG ,  Kyungwoo LEE ,  Kihoon JANG ,  Younho CHOI

    IPC: G01S7/481 ,  G03B17/55 ,  H01S5/024 ,  H01S5/022 ,  H05K5/00 ,  H05K1/02 ,  H05K1/14 ,  H05K7/20 ,  G01S17/10

    Abstract: An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate facing a first direction and a back plate facing a second direction opposite to the first direction, an image sensor to receive light through a first region of the back plate, the image sensor disposed inside the housing, a laser emitter to emit light through a second region of the back plate, adjacent to the first region, the laser emitter disposed inside the housing, adjacent to the image sensor, a laser driver disposed between the laser emitter and the front plate, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure disposed between the laser emitter and the laser driver, a first heat transfer member including a first portion disposed between the first metal structure and the driver, a second portion extended from the first portion along an outer face of the housing structure, and a third portion extended from the second portion to a space between the driver and the front plate, while in contact with the first metal structure, a second heat transfer member extended from the third portion of the first heat transfer member, and a first Thermal Interface Material (TIM) disposed between the second heat transfer member and the front plate, the first TIM being in contact with the second heat transfer member.

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