公开(公告)号：US20200303565A1

公开(公告)日：2020-09-24

申请号：US16896780

申请日：2020-06-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Veronique FERRE ,  Agnes BAFFERT ,  Jean-Michel RIVIERE

IPC: H01L31/0203 ,  H01L21/56 ,  H01L31/0232 ,  H01L31/16

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.

公开(公告)号：US20200098958A1

公开(公告)日：2020-03-26

申请号：US16572979

申请日：2019-09-17

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Nicolas MASTROMAURO ,  Karine SAXOD

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/48

Abstract: An electronic device includes a carrier substrate having a front face and an electronic chip mounted on the front face. An encapsulation cover is mounted above the front face and bounds a chamber in which the chip is situated. A front opening is provided in front of an optical component of the chip. An optical element, designed to allow light to pass, is mounted on the cover in a position which covers the front opening of the cover. The optical element includes a central region designed to deviate light and a positioning pattern that is visible through the front opening. An additional mask is mounted on the encapsulation cover in a position which extends in front of the optical element. A local opening of the additional mask is situated in front of the optical component.

公开(公告)号：US20190280130A1

公开(公告)日：2019-09-12

申请号：US16295045

申请日：2019-03-07

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Research & Development) Limited

Inventor： Karine SAXOD ,  Nicolas MASTROMAURO ,  Colin CAMPBELL

IPC: H01L31/0203 ,  H01L31/12 ,  H01L31/0232 ,  H01L33/52 ,  H01L33/58 ,  H01L25/16

Abstract: Encapsulating cover for an electronic package is formed by a cover body having a front wall and, positioned around a through-passage, a mounting face that includes a bearing surface. A mounting face of an optical element bears against the bearing surface. The mounting face includes at least one local void that is set back with respect to the bearing surface to provide a space between the mounting face of the optical element and the bottom of the local void. The local void extends beyond an edge of the optical element. A drop of fastening adhesive extends locally into said local void and has a portion that is covered by the optical element and an uncovered portion that is located beyond the edge of the optical element.

公开(公告)号：US20190252212A1

公开(公告)日：2019-08-15

申请号：US16394925

申请日：2019-04-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit BESANCON ,  Alexandre MAS ,  Karine SAXOD

IPC: H01L21/56 ,  H01L23/552 ,  H01L23/053 ,  H01L21/48 ,  H01L23/04 ,  H01L23/31 ,  H01L23/06 ,  H01L23/10 ,  H01L21/52 ,  H01L23/433 ,  H01L23/42 ,  H01L23/24

CPC classification number: H01L21/565 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/04 ,  H01L23/053 ,  H01L23/06 ,  H01L23/10 ,  H01L23/24 ,  H01L23/315 ,  H01L23/3192 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/552 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014

Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.

公开(公告)号：US20190189860A1

公开(公告)日：2019-06-20

申请号：US16218944

申请日：2018-12-13

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jean-Michel RIVIERE ,  Romain COFFY ,  Karine SAXOD

IPC: H01L33/48 ,  H05K5/03 ,  H01L31/18 ,  H01L31/12 ,  H01L31/0232 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/162 ,  H01L31/18 ,  H01L33/005 ,  H01L33/58 ,  H05K5/03

Abstract: An electronic circuit including a cover crossed by an element and having a planar main inner surface.

公开(公告)号：US20190157469A1

公开(公告)日：2019-05-23

申请号：US16191625

申请日：2018-11-15

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Veronique FERRE ,  Agnes BAFFERT ,  Jean-Michel RIVIERE

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L21/56

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.

公开(公告)号：US20190027416A1

公开(公告)日：2019-01-24

申请号：US16035083

申请日：2018-07-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Nicolas MASTROMAURO

IPC: H01L23/31 ,  H01L23/32

CPC classification number: H01L23/3142 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/315 ,  H01L23/32

Abstract: An integrated circuit chip is mounted to a front face of a support plate. An encapsulation cap in then mounted to the support plate. The encapsulation cap includes a front wall and a peripheral wall having an end edge at least partly facing a peripheral zone of the support plate. The support plate and the encapsulation cap delimit a chamber in which the integrated circuit chip is situated. To mount the encapsulation cap, a bead of glue is inserted between the peripheral zone and the end edge of the peripheral wall of the encapsulation cap. A peripheral outer face of the encapsulation cap includes a recess extending from the end edge which locally uncovers a part of the bead of glue. A local hardening of the glue at the recess is performed as a first attachment step. Further hardening of the remainder of the glue is then performed.

公开(公告)号：US20230253519A1

公开(公告)日：2023-08-10

申请号：US18136633

申请日：2023-04-19

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Nicolas MASTROMAURO

IPC: H01L31/14 ,  G01S7/484 ,  G01S7/4865 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/52

CPC classification number: H01L31/143 ,  G01S7/484 ,  G01S7/4865 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/005 ,  H01L33/52 ,  H01L2933/005

Abstract: A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.

公开(公告)号：US20230194820A1

公开(公告)日：2023-06-22

申请号：US18110568

申请日：2023-02-16

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Research & Development) Limited

Inventor： Nicolas MASTROMAURO ,  Roy DUFFY ,  Karine SAXOD

IPC: G02B7/00 ,  H01L31/0232 ,  H01L31/0203 ,  G02B13/00

CPC classification number: G02B7/006 ,  H01L31/02325 ,  H01L31/0203 ,  G02B13/00

Abstract: An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.

公开(公告)号：US20210135072A1

公开(公告)日：2021-05-06

申请号：US17145929

申请日：2021-01-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Nicolas MASTROMAURO ,  Karine SAXOD

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/54

Abstract: An electronic device includes a carrier substrate having a front face and an electronic chip mounted on the front face. An encapsulation cover is mounted above the front face and bounds a chamber in which the chip is situated. A front opening is provided in front of an optical component of the chip. An optical element, designed to allow light to pass, is mounted on the cover in a position which covers the front opening of the cover. The optical element includes a central region designed to deviate light and a positioning pattern that is visible through the front opening. An additional mask is mounted on the encapsulation cover in a position which extends in front of the optical element. A local opening of the additional mask is situated in front of the optical component.