公开(公告)号：US20220068633A1

公开(公告)日：2022-03-03

申请号：US17382793

申请日：2021-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjin SHIN ,  Keunwook SHIN

IPC: H01L21/027 ,  H01L21/768

Abstract: Provided are a method of forming a carbon layer and a method of forming an interconnect structure. The method of forming a carbon layer includes providing a substrate including first and second material layers, forming a surface treatment layer on at least one of the first and second material layers, and selectively forming a carbon layer on one of the first material layer and the second material layer. The carbon layer has an sp2 bonding structure.

公开(公告)号：US20210276873A1

公开(公告)日：2021-09-09

申请号：US17190852

申请日：2021-03-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon KIM ,  Kyung-Eun BYUN ,  Hyeonjin SHIN ,  Eunkyu LEE ,  Changseok LEE

IPC: C01B32/186

Abstract: A graphene manufacturing apparatus includes a reaction chamber a substrate supporter configured to structurally support a substrate inside the reaction chamber; a plasma generator configured to generate a plasma inside the reaction chamber; a first gas supply configured to supply an inert gas into the reaction chamber at a first height from an upper surface of the substrate supporter in a height direction of the reaction chamber; a second gas supply configured to supply a carbon source into the reaction chamber at a second height from the upper surface of the substrate supporter in the height direction of the reaction chamber; and a third gas supply configured to supply a reducing gas into the reaction chamber, wherein the first to third gas supply units are disposed at different heights at a third height from the upper surface of the substrate supporter in the height direction of the reaction chamber.

公开(公告)号：US20210066069A1

公开(公告)日：2021-03-04

申请号：US16885887

申请日：2020-05-28

Applicant: Samsung Electronics Co., Ltd. ,  UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)

Inventor： Changseok LEE ,  Hyeonsuk SHIN ,  Hyeonjin SHIN ,  Seokmo HONG ,  Kyungyeol MA

IPC: H01L21/02 ,  H01L29/08 ,  H01L29/417 ,  C23C16/34 ,  C23C16/02 ,  C23C16/50 ,  C30B25/10 ,  C30B25/16 ,  C30B29/40

Abstract: Disclosed herein is a method of fabricating hexagonal boron nitride in which hexagonal boron nitride is epitaxially grown. A method of fabricating hexagonal boron nitride includes placing a catalytic metal in a chamber, the catalytic metal having a hexagonal crystal structure and having a lattice mismatch of 15% or less with hexagonal boron nitride (h-BN) in a chamber; and growing hexagonal boron nitride on the catalytic metal at a temperature of 800° C. or lower while supplying a nitrogen source and a boron source into the chamber.

公开(公告)号：US20210020438A1

公开(公告)日：2021-01-21

申请号：US16928560

申请日：2020-07-14

Applicant: Samsung Electronics Co., Ltd. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Kyung-Eun BYUN ,  Hyoungsub KIM ,  Taejin PARK ,  Hoijoon KIM ,  Hyeonjin SHIN ,  Wonsik AHN ,  Mirine LEEM ,  Yeonchoo CHO

IPC: H01L21/02

Abstract: A method of forming a transition metal dichalcogenide thin film on a substrate includes treating the substrate with a metal organic material and providing a transition metal precursor and a chalcogen precursor around the substrate to synthesize transition metal dichalcogenide on the substrate. The transition metal precursor may include a transition metal element and the chalcogen precursor may include a chalcogen element.

公开(公告)号：US20200347494A1

公开(公告)日：2020-11-05

申请号：US16861614

申请日：2020-04-29

Applicant: Samsung Electronics Co., Ltd. ,  Research & business foundation sungkyunkwan university

Inventor： Kyung-Eun BYUN ,  Hyoungsub KIM ,  Taejin PARK ,  Hyeonjin SHIN ,  Hoijoon KIM ,  Wonsik AHN ,  Mirine LEEM

IPC: C23C16/30 ,  B22F7/00 ,  C23C16/46

Abstract: Provided are a metal chalcogenide thin film and a method and device for manufacturing the same. The metal chalcogenide thin film includes a transition metal element and a chalcogen element, and at least one of the transition metal element and the chalcogen element having a composition gradient along the surface of the metal chalcogenide thin film, the composition gradient being an in-plane composition gradient. The metal chalcogenide thin film may be prepared by using a manufacturing method including providing a transition metal precursor and a chalcogen precursor on a substrate by using a confined reaction space in such a manner that at least one of the transition metal precursor and the chalcogen precursor forms a concentration gradient according to a position on the surface of the substrate; and heat-treating the substrate.

公开(公告)号：US20200335335A1

公开(公告)日：2020-10-22

申请号：US16922330

申请日：2020-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haeryong KIM ,  Hyeonjin SHIN ,  Jaeho LEE ,  Sanghyun JO

IPC: H01L21/02 ,  H01L29/66 ,  H01L29/786 ,  H01L29/778

Abstract: A method of growing a two-dimensional transition metal dichalcogenide (TMD) thin film and a method of manufacturing a device including the two-dimensional TMD thin film are provided. The method of growing the two-dimensional TMD thin film may include a precursor supply operation and an evacuation operation, which are periodically and repeatedly performed in a reaction chamber provided with a substrate for thin film growth. The precursor supply operation may include supplying two or more kinds of precursors of a TMD material to the reaction chamber. The evacuation operation may include evacuating the two or more kinds of precursors and by-products generated therefrom from the reaction chamber.

公开(公告)号：US20200152808A1

公开(公告)日：2020-05-14

申请号：US16740900

申请日：2020-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiyoung LEE ,  Jinseong HEO ,  Jaeho LEE ,  Haeryong KIM ,  Seongjun PARK ,  Hyeonjin SHIN ,  Eunkyu LEE ,  Sanghyun JO

IPC: H01L31/0216 ,  H01L31/028 ,  H01L31/0352 ,  H01L31/0224 ,  H01L31/18 ,  G01N21/59

Abstract: A broadband multi-purpose optical device includes a semiconductor layer having a light absorption characteristic, a first active layer having a light absorption band different from a light absorption band of the semiconductor layer, a first two-dimensional (2D) material layer adjacent to the first active layer, and a first interfacial layer configured to control a pinning potential of the semiconductor layer and the first active layer. The broadband multi-purpose optical device may further include at least one second active layer, and may include a tandem structure that further includes at least one second 2D material layer. The first active layer and the second active layer may have different light absorption bands. The broadband multi-purpose optical device may further include a second interfacial layer adjacent to the first 2D material layer.

公开(公告)号：US20190148493A1

公开(公告)日：2019-05-16

申请号：US16248945

申请日：2019-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minhyun LEE ,  Haeryong KIM ,  Hyeonjin SHIN ,  Seunggeol NAM ,  Seongjun PARK

IPC: H01L29/08 ,  H01L29/78 ,  H01L29/06 ,  H01L29/417 ,  H01L29/45 ,  H01L21/285 ,  H01L29/04 ,  H01L29/267

CPC classification number: H01L29/0847 ,  H01L21/28512 ,  H01L29/04 ,  H01L29/0665 ,  H01L29/0669 ,  H01L29/1606 ,  H01L29/165 ,  H01L29/267 ,  H01L29/41725 ,  H01L29/45 ,  H01L29/78

Abstract: A semiconductor device includes a semiconductor layer, a metal layer electrically contacting the semiconductor layer, and a two-dimensional material layer between the semiconductor layer and the metal layer and having a two-dimensional crystal structure.

公开(公告)号：US20190031906A1

公开(公告)日：2019-01-31

申请号：US15925034

申请日：2018-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon KIM ,  Minsu SEOL ,  Hyeonjin SHIN ,  Dongwook LEE ,  Yunseong LEE ,  Seongjun JEONG ,  Alum JUNG

IPC: C09D165/00 ,  C01B32/184 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  H01L21/311 ,  H01L21/027

CPC classification number: C09D165/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/182 ,  C01B32/184 ,  C08G61/02 ,  C08G2261/3424 ,  G03F7/094 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/38 ,  H01L21/0274 ,  H01L21/31138 ,  H01L21/31144 ,  Y10S977/734 ,  Y10S977/774 ,  Y10S977/842

Abstract: Provided are a method of preparing a graphene quantum dot, a graphene quantum dot prepared using the method, a hardmask composition including the graphene quantum dot, a method of forming a pattern using the hardmask composition, and a hardmask obtained from the hardmask composition. The method of preparing a graphene quantum dot includes reacting a graphene quantum dot composition and an including a polyaromatic hydrocarbon compound and an organic solvent at an atmospheric pressure and a temperature of about 250° C. The polyaromatic hydrocarbon compound may include at least four aromatic rings.

公开(公告)号：US20160343805A1

公开(公告)日：2016-11-24

申请号：US15010807

申请日：2016-01-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minhyun LEE ,  Haeryong KIM ,  Hyeonjin SHIN ,  Seunggeol NAM ,  Seongjun PARK

IPC: H01L29/08 ,  H01L29/06 ,  H01L29/04 ,  H01L29/165 ,  H01L29/78 ,  H01L29/267

CPC classification number: H01L29/0847 ,  H01L21/28512 ,  H01L29/04 ,  H01L29/0665 ,  H01L29/0669 ,  H01L29/1606 ,  H01L29/165 ,  H01L29/267 ,  H01L29/41725 ,  H01L29/45 ,  H01L29/78

Abstract: A semiconductor device includes a semiconductor layer, a metal layer electrically contacting the semiconductor layer, and a two-dimensional material layer between the semiconductor layer and the metal layer and having a two-dimensional crystal structure.

Abstract translation: 半导体器件包括半导体层，与半导体层电接触的金属层和半导体层与金属层之间的二维材料层并具有二维晶体结构。