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公开(公告)号:US12280325B2
公开(公告)日:2025-04-22
申请号:US17750884
申请日:2022-05-23
Inventor: Hyoungwoo Choi , Hyomin Lee , Min Ryu , Jinkyu Kang , Joonseon Jeong , Dongwook Kim , Daehoon Park , Hyun Chul Lee
Abstract: A porous composite structure including a substrate including a plurality of nanostructures; a particle layer disposed on a surface of the substrate; and a liquid, a method of preparing the porous composite structure, an article including the porous composite structure, and an air purifier including the porous composite structure.
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公开(公告)号:US20240074149A1
公开(公告)日:2024-02-29
申请号:US18312795
申请日:2023-05-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yangdoo KIM , Dongwook Kim , Sangwuk Park , Minkyu Suh , Geonyeop Lee , Dokeun Lee , Jungpyo Hong
IPC: H10B12/00
CPC classification number: H10B12/315 , H10B12/0335
Abstract: An integrated circuit (IC) device may include a conductive area on a substrate; a first electrode connected to the conductive area on the substrate, a width of the first electrode in a lateral direction gradually increasing toward the substrate; a second electrode on the substrate, the second electrode including a silicon germanium (SiGe) film, the SiGe film surrounding the first electrode; and a dielectric film between the first electrode and the second electrode. A content of a component of the SiGe film may vary according to a distance from the substrate.
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公开(公告)号:US20240040806A1
公开(公告)日:2024-02-01
申请号:US18125928
申请日:2023-03-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Joonsung Kim , Jihwang Kim , Jeongho Lee , Dongwook Kim , Wonkyoung Choi , Yunseok Choi
IPC: H10B80/00 , H01L23/538 , H01L23/31 , H01L23/498 , H01L23/00 , H01L23/36
CPC classification number: H10B80/00 , H01L23/5383 , H01L23/3128 , H01L23/49811 , H01L24/16 , H01L23/36 , H01L24/32 , H01L24/73 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253
Abstract: A semiconductor package includes a lower package, an upper package on the lower package, and an inter-package connector between the lower package and the upper package. The lower package includes a first redistribution structure, a first semiconductor chip mounted on a first mounting region of the first redistribution structure, a second semiconductor chip mounted on a second mounting region of the first redistribution structure, a molding layer on the first redistribution structure and in contact with a side wall of the first semiconductor chip and a side wall of the second semiconductor chip, and a conductive post passing through the molding layer and electrically connected to the first semiconductor chip through a first redistribution pattern of the first redistribution structure. The upper package is on the molding layer, vertically overlaps with the second mounting region of the first redistribution structure, and does not cover the first semiconductor chip.
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公开(公告)号:US11710673B2
公开(公告)日:2023-07-25
申请号:US17376883
申请日:2021-07-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Choongbin Yim , Dongwook Kim , Hyunki Kim , Jongbo Shim , Jihwang Kim , Sungkyu Park , Yongkwan Lee , Byoungwook Jang
IPC: H01L23/12 , H01L23/538
CPC classification number: H01L23/12 , H01L23/5384 , H01L23/5385 , H01L23/5386
Abstract: A semiconductor package including a first package substrate, a first semiconductor chip on the first package substrate, a first conductive connector on the first package substrate and laterally spaced apart from the first semiconductor chip, an interposer substrate on the first semiconductor chip and electrically connected to the first package substrate through the first conductive connector, the interposer substrate including a first portion overlapping the first semiconductor chip and a plurality of upper conductive pads in the first portion, a plurality of spacers on a lower surface of the first portion of the interposer substrate and positioned so as not to overlap the plurality of upper conductive pads in a plan view, and an insulating filler between the interposer substrate and the first package substrate may be provided.
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公开(公告)号:USD978099S1
公开(公告)日:2023-02-14
申请号:US29795014
申请日:2021-06-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Sinwi Moon , Jaewook Yoo , Daehun Jung , Byungmin Woo , Dongwook Kim , Jeewon Kim
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公开(公告)号:US11157095B2
公开(公告)日:2021-10-26
申请号:US16724805
申请日:2019-12-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sun Ok Jung , Dongwook Kim , Minjung Kim , Sookjin Kim , Jin-Gil Yang , Inji Jin
IPC: G06F3/0354 , G16H10/65 , A61B5/00 , A61B5/0245 , A61B5/0205 , G06F3/01 , G16H40/63 , G06F1/26 , G06F3/038 , G16H50/20 , A61B5/01 , A61B5/11 , A61B5/021 , A61B5/024 , A61B5/318
Abstract: An electronic device, accessory device and method using the same are disclosed herein. The accessory device is stowable in the electronic device, and includes at least a first sensor, a second sensor, a communication interface and a processor. The method includes receiving, through the communication interface, information from the electronic device corresponding to an application executed in the electronic device, in response to the received information, obtaining the first data through the first sensor when the received information is a first information and obtaining the second data through the second sensor when the information is a second information, and transmitting, to the electronic device, data based on at least one of the first data and the second data.
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公开(公告)号:USD1066349S1
公开(公告)日:2025-03-11
申请号:US29838349
申请日:2022-05-12
Applicant: Samsung Electronics Co., Ltd.
Designer: Jaeneung Lee , Chulyong Cho , Dongwook Kim , Diana Minsun Kang
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公开(公告)号:USD1024065S1
公开(公告)日:2024-04-23
申请号:US29842845
申请日:2022-06-16
Applicant: Samsung Electronics Co., Ltd.
Designer: Dongwook Kim , Chul-Yong Cho , Tae-Hun Kim , Jisoo Kim , Gyoosang Choi , Bo-Kyung Seong
Abstract: FIG. 1 is a front perspective view of a monitor showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the encircled portion 9 in FIG. 1;
FIG. 10 is an enlarged view of the encircled portion 10 in FIG. 1;
FIG. 11 is an enlarged view of the encircled portion in FIG. 2;
FIG. 12 is an enlarged view of the encircled portion 12 in FIG. 3;
FIG. 13 is an enlarged view of the encircled portion 13 in FIG. 3;
FIG. 14 is an enlarged view of the encircled portion in FIG. 4;
FIG. 15 is an enlarged view of the encircled portion in FIG. 5;
FIG. 16 is an enlarged view of the encircled portion 16 in FIG. 6;
FIG. 17 is an enlarged view of the encircled portion 17 in FIG. 6;
FIG. 18 is an enlarged view of the encircled portion in FIG. 8;
FIG. 19 is another front view thereof showing the display screen of the monitor rotated in an alternate position; and,
FIG. 20 is an enlarged view of the encircled portion in FIG. 19.
Dot-dash broken lines represent the boundaries of the enlarged portions and form no part of the claimed design. All other broken lines seen in the drawings depict portions of the monitor that form no part of the claimed design.-
公开(公告)号:USD1008202S1
公开(公告)日:2023-12-19
申请号:US29795005
申请日:2021-06-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Sinwi Moon , Jaewook Yoo , Daehun Jung , Byungmin Woo , Dongwook Kim , Jeewon Kim
Abstract: FIG. 1 is a front perspective view of a television, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the portion 9 in FIG. 1;
FIG. 10 is an enlarged view of the portion 10 in FIG. 1;
FIG. 11 is an enlarged view of the portion 11 in FIG. 1;
FIG. 12 is an enlarged view of the portion 12 in FIG. 2;
FIG. 13 is an enlarged view of the portion 13 in FIG. 3;
FIG. 14 is an enlarged view of the portion 14 in FIG. 4;
FIG. 15 is an enlarged view of the portion 15 in FIG. 5;
FIG. 16 is an enlarged view of the portion 16 in FIG. 6;
FIG. 17 is an enlarged view of the portion 17 in FIG. 7;
FIG. 18 is an enlarged view of the portion 18 in FIG. 8; and,
FIG. 19 is an exploded front perspective view thereof.
The even-dash broken lines illustrating portions of the television form no part of the claimed design. The dot-dot-dash broken lines encircling enlargement portions of the claimed design form no part of the claimed design.-
公开(公告)号:US11722633B2
公开(公告)日:2023-08-08
申请号:US17690246
申请日:2022-03-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hojune Yoo , Kwanyoung Kim , Dongwook Kim , Jungseop Kim , Seungil Yoon , Jaemyung Hur
IPC: H04N5/33 , H04N5/44 , G01J1/42 , H04N21/422
CPC classification number: H04N5/33 , H04N21/42204 , H04N21/42221
Abstract: Disclosed are a display apparatus and a method of controlling the same. a display apparatus including: a display; an optical sensor; and a processor configured to: identify an operation cycle shorter than an idle section of an infrared (IR) signal and including at least a part of a section for a detection operation of the optical sensor, based on the IR signal of which a signal section corresponding to a user key input and the idle section are repeated on a predetermined cycle, control the optical sensor to repetitively perform the detection operation on the identified operation cycle, and perform a predetermined operation based on a detection value obtained by the detection operation of the optical sensor.
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