公开(公告)号：US11039262B2

公开(公告)日：2021-06-15

申请号：US16162795

申请日：2018-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung Kim ,  Sungchan Kang ,  Yongseop Yoon ,  Choongho Rhee ,  Sangha Park ,  Hyeokki Hong

IPC: H04R17/02 ,  H04S7/00 ,  H04R5/04 ,  G10L21/0216 ,  H04R1/32 ,  B60K35/00 ,  G06F3/16 ,  H04R1/40 ,  H04R1/24

Abstract: Provided are a directional acoustic sensor that detects a direction of sound, a method of detecting a direction of sound, and an electronic device including the directional acoustic sensor. The directional acoustic sensor includes a sound inlet through which a sound is received, a sound outlet through which the sound received through the sound inlet is output, and a plurality of vibration bodies arranged between the sound inlet and the sound outlet, in which one or more of the plurality of vibration bodies selectively react to the sound received by the sound inlet according to a direction of the received sound.

公开(公告)号：US10916436B2

公开(公告)日：2021-02-09

申请号：US16696513

申请日：2019-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho Rhee ,  Sungchan Kang ,  Hyunwook Kang ,  Cheheung Kim ,  Yongseop Yoon ,  Jaehyung Jang ,  Hyeokki Hong

IPC: H01L21/306 ,  H01L21/3065 ,  H01L21/56 ,  H01L21/683 ,  H01L21/02 ,  H01L21/311 ,  H01L21/3213

Abstract: Provided is a plasma dicing method. The plasma dicing method includes: performing plasma etching on a first surface of a substrate exposed between a plurality of membrane structures; forming a passivation layer on a semiconductor wafer to cover the plurality of membrane structures and at least one trench; performing plasma etching on a second surface of the substrate such that a through hole exposing a portion of the plurality of membrane structures and a dicing lane connected to the trench and having a width less than a width of the through hole are formed at the substrate; and removing the passivation layer and singulating the semiconductor wafer into a plurality of devices including a membrane partially exposed by the through hole.

公开(公告)号：US20200158564A1

公开(公告)日：2020-05-21

申请号：US16398449

申请日：2019-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseop Yoon ,  Sungchan Kang ,  Cheheung Kim ,  Choongho Rhee ,  Hyeokki Hong

IPC: G01H11/08 ,  H01L41/113 ,  H01L41/25

Abstract: Provided are resonators, a resonator system including the resonators, and a method of manufacturing the resonators. The resonator includes a vibration beam configured to vibrate in response to an external signal, a sensing unit configured to detect the movement of the vibration beam, and a lumped mass unit including a base unit that contacts the vibration beam and a wing unit arranged separately from the vibration beam on the base unit.

公开(公告)号：US10528069B2

公开(公告)日：2020-01-07

申请号：US15869605

申请日：2018-01-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeokki Hong ,  Cheheung Kim ,  Sungchan Kang ,  Jinmyoung Kim ,  Sangha Park ,  Yongseop Yoon ,  Choongho Rhee

IPC: G05F3/08 ,  H03K19/00

Abstract: An integrated circuit includes a highest class core circuit that has a positive power supply terminal connected to a positive power supply terminal of an external power source, and is configured to receive a first supply voltage which is at least a portion of a an input supply voltage that is provided from the external power source based on an operation throughput; and a lowest class core circuit that has a positive power supply terminal connected to a negative power supply terminal of an adjacent upper class core circuit, has a negative power supply terminal connected to a negative power supply terminal of the external power source, and is configured to receive a second supply voltage which is at least a portion of a part of the input supply voltage that excludes the first supply voltage.

公开(公告)号：US10447238B2

公开(公告)日：2019-10-15

申请号：US15643778

申请日：2017-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan Kang ,  Cheheung Kim ,  Sangha Park ,  Yongseop Yoon ,  Choongho Rhee

IPC: H03H9/54 ,  G01H11/08 ,  H03H9/24 ,  H03H9/13 ,  H04R17/02 ,  H04R17/10 ,  H04R25/00

Abstract: A filter system includes a first resonator having a first resonant frequency, and a second resonator having a second resonant frequency different from the first resonant frequency, and electrically connected to the first resonator. A first response characteristic of the first resonator and a second response characteristic of the second resonator with respect to a frequency include a first section in which a first phase of the first resonator is equal to a second phase of the second resonator, and a second section in which the first phase is different from the second phase by 180 degrees. A first electrode of the first resonator is reversely connected to a second electrode of the second resonator.

公开(公告)号：US20240142311A1

公开(公告)日：2024-05-02

申请号：US18215477

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinmyoung Kim ,  Choongho Rhee ,  Byonggwon Song ,  Yongseop Yoon ,  Jaekwan Kim ,  Jangwoo You ,  Byungkyu Lee

IPC: G01J5/22

CPC classification number: G01J5/22 ,  G01J2005/202

Abstract: Provided are a long-wave infrared sensor and an electronic device including the same. The long-wave infrared sensor and the electronic device including the same include a pixel array including a plurality of pixels, an optical absorber layer arranged on the pixel array, and a drive circuit configured to drive the pixel array, wherein each of the plurality of pixels for a long-wave infrared sensor includes a lower electrode and an upper electrode which are arranged apart from each other, and a plurality of magnetic tunnel junction devices arranged regularly between the lower electrode and the upper electrode and electrically connected to each other in parallel, and the plurality of magnetic tunnel junction devices are arranged apart from each other with an empty space therebetween.

公开(公告)号：US11341973B2

公开(公告)日：2022-05-24

申请号：US16474465

申请日：2017-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung Kim ,  Sungchan Kang ,  Sangha Park ,  Yongseop Yoon ,  Choongho Rhee

IPC: G10L17/02 ,  G10L17/14 ,  G01H13/00 ,  G10L17/04 ,  G10L17/20

Abstract: Provided are a method and device for recognizing a speaker by using a resonator. The method of recognizing the speaker includes receiving a plurality of electrical signals corresponding to a speech of the speaker from a plurality of resonators having different resonance bands; obtaining a difference of magnitudes of the plurality of electrical signals; and recognizing the speaker based on the difference of magnitudes of the plurality of electrical signals.

公开(公告)号：US11317197B2

公开(公告)日：2022-04-26

申请号：US17003357

申请日：2020-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung Kim ,  Sungchan Kang ,  Hyeokki Hong ,  Hyunwook Kang ,  Yongseop Yoon ,  Choongho Rhee

IPC: H04R1/32 ,  H04R3/00 ,  H04R17/10

Abstract: A compact directional acoustic sensor having an improved signal-to-noise ratio is disclosed. The disclosed directional acoustic sensor includes a first sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one first output signal having a first polarity based on external energy received from an input direction; a second sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one second output signal having a second polarity, that is different than the first polarity, based on the external energy received from the input direction; and at least one signal processor configured to generate at least one final output signal based on the at least one first output signal and the at least one second output signal.

公开(公告)号：US11146240B2

公开(公告)日：2021-10-12

申请号：US16880231

申请日：2020-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseop Yoon ,  Sungchan Kang ,  Cheheung Kim ,  Choongho Rhee

IPC: H03H9/24 ,  H03H9/02

Abstract: A micromechanical resonator includes a support beam having a fixed end, and a free end configured to vibrate. The micromechanical resonator includes a lumped mass disposed on the free end. A height of the lumped mass is greater than a width of the lumped mass.

公开(公告)号：US10756746B2

公开(公告)日：2020-08-25

申请号：US16433046

申请日：2019-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeokki Hong ,  Cheheung Kim ,  Sungchan Kang ,  Yongseop Yoon ,  Choongho Rhee

IPC: H03M1/38 ,  H03M1/56 ,  H03M1/66

Abstract: Provided is an integrated circuit including an analog-to-digital converter (ADC) configured to convert an analog signal to a digital signal; and a digital signal processor (DSP) configured to process the digital signal, wherein the ADC generates a power source during a process for converting the analog signal into the digital signal and supplies power to the DSP through the power source.