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    Vertical Radio Frequency Module
    13.
    发明申请
    Vertical Radio Frequency Module 有权
    垂直射频模块

    公开(公告)号：US20160174357A1

    公开(公告)日：2016-06-16

    申请号：US14565744

    申请日：2014-12-10

    Applicant: RAYTHEON COMPANY

    Inventor： Waid Paine ,  James S. Wilson ,  Cary C. Kyhl ,  Robert S. Isom

    IPC: H05K1/02 ,  H05K1/18 ,  H01R12/72 ,  H05K1/11

    CPC classification number: H05K1/0204 ,  H01Q21/0025 ,  H01R12/72 ,  H05K1/0237 ,  H05K1/111 ,  H05K1/183 ,  H05K7/20509 ,  H05K2201/06 ,  H05K2201/09036 ,  H05K2201/10098

    Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

    Abstract translation: 具有多个通道的射频（RF）模块包括具有至少一个锥形边缘的散热器; 衬底，其布置在所述散热器的表面上，使得所述散热片的锥形边缘延伸超过所述衬底的边界。 RF，逻辑和电源电路设置在衬底上，并且一个或多个RF信号端口形成在衬底的边缘上，以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器为RF信号部件提供接地平面，并为设置在基板中的发热电路提供热路径。

    TUNABLE THERMAL TRANSFER WITHIN AN OSCILLATING HEAT PIPE
    14.
    发明公开
    TUNABLE THERMAL TRANSFER WITHIN AN OSCILLATING HEAT PIPE 审中-公开

    公开(公告)号：US20240200880A1

    公开(公告)日：2024-06-20

    申请号：US18067067

    申请日：2022-12-16

    Applicant: Raytheon Company

    Inventor： Tuan Duong ,  James S. Wilson ,  Miad Yazdani

    IPC: F28D15/06 ,  F16K31/00 ,  F16K31/06

    CPC classification number: F28D15/06 ,  F16K31/002 ,  F16K31/06

    Abstract: A tunable oscillating heat pipe system that includes an oscillating closed loop heat pipe configured for movement of a fluid in an internal passage in the closed loop to transfer heat from a first portion of the closed loop to a second portion. The heat pipe system further includes a valve arranged in a section of the internal passage movable between an open position and a closed position. In the open position, the valve is arranged to permit movement of the fluid in the internal passage and in the closed position, the valve is arranged in the internal passage to limit movement of the fluid in a part of the internal passage. Movement of the valve between the open position and the closed position can be a function of at least one of temperature at the first portion, temperature at the second portion, or temperature at the valve.

    WIRE BONDED AIR HEAT SINK
    16.
    发明申请
    WIRE BONDED AIR HEAT SINK 有权

    公开(公告)号：US20220336319A1

    公开(公告)日：2022-10-20

    申请号：US17233824

    申请日：2021-04-19

    Applicant: Raytheon Company

    Inventor： James S. Wilson ,  Alyson M. Tuttle ,  Karl L. Worthen

    IPC: H01L23/367

    Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.

    Two-phase expendable cooling systems with passive flow control membranes
    18.
    发明授权
    Two-phase expendable cooling systems with passive flow control membranes 有权

    公开(公告)号：US11226141B2

    公开(公告)日：2022-01-18

    申请号：US15831180

    申请日：2017-12-04

    Applicant: Raytheon Company

    Inventor： James S. Wilson ,  Alex E. Ockfen ,  Adolfo Lozano, III ,  Amanda S. Rickman

    IPC: F25B19/00 ,  H01L23/427 ,  H05K7/20 ,  F28F13/00 ,  F25B19/04

    Abstract: An apparatus includes a heat sink configured to receive thermal energy from one or more heat sources. The heat sink includes a local reservoir configured to hold a liquid coolant, and the heat sink is configured to pass the thermal energy into the liquid coolant in the local reservoir in order to vaporize at least some of the liquid coolant. The apparatus also includes a membrane configured to allow vaporized coolant to pass through the membrane out of the local reservoir into an ambient environment and to prevent unvaporized coolant from passing through the membrane. The membrane is thereby configured to provide passive flow control for the liquid coolant. The membrane could include a vapor-permeable and liquid-repelling membrane. The membrane can also be configured to hold the liquid coolant in the local reservoir against one or more surfaces of the heat sink.

    COLDPLATE WITH HEAT TRANSFER MODULE
    19.
    发明申请
    COLDPLATE WITH HEAT TRANSFER MODULE 有权

    公开(公告)号：US20210278146A1

    公开(公告)日：2021-09-09

    申请号：US16813202

    申请日：2020-03-09

    Applicant: Raytheon Company

    Inventor： James S. Wilson ,  James Giesey

    IPC: F28F9/02

    Abstract: A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.

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