公开(公告)号：US20210278146A1

公开(公告)日：2021-09-09

申请号：US16813202

申请日：2020-03-09

Applicant: Raytheon Company

Inventor： James S. Wilson ,  James Giesey

IPC: F28F9/02

Abstract: A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.

公开(公告)号：US11686539B2

公开(公告)日：2023-06-27

申请号：US16813202

申请日：2020-03-09

Applicant: Raytheon Company

Inventor： James S. Wilson ,  James Giesey

IPC: F28F9/02 ,  F28F1/02 ,  F28F1/40 ,  F28F3/02 ,  F28F3/12 ,  H05K7/20

CPC classification number: F28F9/026 ,  F28F1/022 ,  F28F1/40 ,  F28F3/025 ,  F28F3/12 ,  H05K7/20254 ,  F28F2275/025 ,  F28F2275/04 ,  F28F2275/06

Abstract: A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.