公开(公告)号：US20240055318A1

公开(公告)日：2024-02-15

申请号：US18493194

申请日：2023-10-24

Applicant: Raytheon Company

Inventor： James S. Wilson ,  Alyson M. Tuttle ,  Karl L. Worthen

IPC: H01L23/367

CPC classification number: H01L23/3677 ,  H01L23/3736

Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.

公开(公告)号：US12278159B2

公开(公告)日：2025-04-15

申请号：US18493194

申请日：2023-10-24

Applicant: Raytheon Company

Inventor： James S. Wilson ,  Alyson M. Tuttle ,  Karl L. Worthen

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/473

Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.

公开(公告)号：US11837521B2

公开(公告)日：2023-12-05

申请号：US17233824

申请日：2021-04-19

Applicant: Raytheon Company

Inventor： James S. Wilson ,  Alyson M. Tuttle ,  Karl L. Worthen

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/473

CPC classification number: H01L23/3677 ,  H01L23/3736 ,  H01L23/473 ,  H01L2924/0002

Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.

公开(公告)号：US20220336319A1

公开(公告)日：2022-10-20

申请号：US17233824

申请日：2021-04-19

Applicant: Raytheon Company

Inventor： James S. Wilson ,  Alyson M. Tuttle ,  Karl L. Worthen

IPC: H01L23/367

Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.