-
公开(公告)号：US11679445B2
公开(公告)日：2023-06-20
申请号：US17095878
申请日：2020-11-12
Applicant: Raytheon Company
Inventor： Travis Lee Mayberry , Cory Thomas , Robert Arthur Condie , James S. Wilson
IPC: F28F3/02 , B33Y10/00 , B23K20/10 , B23K20/233 , B23P15/26 , F28F9/02 , F28F9/18 , B33Y80/00 , B23K103/10 , B23K101/14
CPC classification number: B23K20/103 , B23K20/2333 , B23P15/26 , F28F3/025 , F28F9/0224 , F28F9/18 , B23K2101/14 , B23K2103/10 , B33Y10/00 , B33Y80/00
Abstract: A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
-
公开(公告)号：US20220143736A1
公开(公告)日：2022-05-12
申请号：US17095878
申请日：2020-11-12
Applicant: Raytheon Company
Inventor： Travis Lee Mayberry , Cory Thomas , Robert Arthur Condie , James S. Wilson
Abstract: A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
-
公开(公告)号：US20230302567A1
公开(公告)日：2023-09-28
申请号：US18205248
申请日：2023-06-02
Applicant: Raytheon Company
Inventor： Travis Lee Mayberry , Cory Thomas , Robert Arthur Condie , James S. Wilson
CPC classification number: B23K20/103 , B23K20/2333 , B23P15/26 , F28F3/025 , F28F9/0224 , F28F9/18 , B33Y10/00
Abstract: A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
-
-
Search Results
3
records
(took 0.009 seconds)
