公开(公告)号：US20130130729A1

公开(公告)日：2013-05-23

申请号：US13300899

申请日：2011-11-21

Applicant: RONALD STEVEN COK ,  Jon Allan Campbell ,  Neil Cannon ,  Mark S. Cook ,  Joseph Anthony Manico ,  Peter Karl Traeg

Inventor： RONALD STEVEN COK ,  Jon Allan Campbell ,  Neil Cannon ,  Mark S. Cook ,  Joseph Anthony Manico ,  Peter Karl Traeg

IPC: H04N5/225 ,  H04W4/12

CPC classification number: G06Q30/0621 ,  H04N21/41407 ,  H04N21/4788 ,  H04W4/185

Abstract: A method for making a media collection associated with an event having an event location by a user includes the user receiving an event signal; the user capturing one or more media element(s) with a media-capture device, the media element having an associated capture location; the user receiving a selection tool for the media-capture device for selecting captured media element(s) that have an associated capture location corresponding to the received event signal; operating the selection tool; and communicating one or more selected media element(s) to a media-element collection device.

Abstract translation: 一种与用户具有事件定位的事件相关联的媒体收集的方法包括：用户接收事件信号; 所述用户使用媒体捕获设备捕获一个或多个媒体元素，所述媒体元素具有相关联的捕获位置; 所述用户接收用于所述媒体捕获设备的选择工具，用于选择具有与所接收的事件信号相对应的相关联的捕获位置的所捕获的媒体元素; 操作选择工具; 以及将一个或多个所选择的媒体元素传送到媒体元素收集设备。

公开(公告)号：US20150271930A1

公开(公告)日：2015-09-24

申请号：US14217539

申请日：2014-03-18

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: H05K3/46

CPC classification number: G06F3/044 ,  G01R27/2605 ,  G06F2203/04112 ,  H05K3/4638 ,  H05K2203/06 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1075

Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate with a micro-wire layer having first and second areas. The micro-wire layer includes first and second micro-wire electrodes and first and second connection pads in the first and second areas, respectively. Each micro-wire electrode includes one or more electrically connected micro-wires and is electrically connected to a connection pad. The micro-wires are located in a common step. The first area is separated from the second area and the first area of the substrate and the second area of the micro-wire layer are located between the first micro-wires and the second area of the substrate so that a second layer edge extends at least partly beyond a first layer edge and one or more of the second connection pads is located between at least a portion of the first layer edge and the second layer edge.

Abstract translation: 一种制造多层微线结构的方法包括：提供具有第一和第二区域的微线层的衬底。 微线层分别包括第一和第二微线电极以及第一和第二区域中的第一和第二连接焊盘。 每个微线电极包括一个或多个电连接的微线，并且电连接到连接焊盘。 微线位于共同的步骤中。 第一区域与第二区域分离，并且衬底的第一区域和微线层的第二区域位于第一微细线和衬底的第二区域之间，使得第二层边缘至少延伸 部分地超出第一层边缘，并且所述第二连接焊盘中的一个或多个位于所述第一层边缘和所述第二层边缘的至少一部分之间。

公开(公告)号：US20150268756A1

公开(公告)日：2015-09-24

申请号：US14217546

申请日：2014-03-18

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: G06F3/044 ,  G01R27/26

CPC classification number: G06F3/044 ,  G01R27/2605 ,  G06F2203/04112 ,  H05K3/4638 ,  H05K2203/06 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1075

Abstract: A multi-area micro-wire structure includes a substrate and a micro-wire layer having first and second distinct and separated areas and first and second layer edges, respectively. The second layer edge is different from the first layer edge and the second area is larger than the first area. One or more first micro-wire electrodes and one or more first connection pads are located in the micro-wire layer in the first area. One or more second micro-wire electrodes and one or more second connection pads are located in the micro-wire layer in the second area. Each micro-wire electrode includes one or more electrically connected micro-wires. Each first or second connection pad is located adjacent to the first or second layer edge and electrically connected to a corresponding first or second micro-wire electrode, respectively.

Abstract translation: 多区域微线结构包括分别具有第一和第二不同和分离的区域以及第一和第二层边缘的基底和微线层。 第二层边缘与第一层边缘不同，第二区域大于第一区域。 一个或多个第一微线电极和一个或多个第一连接焊盘位于第一区域中的微线层中。 一个或多个第二微线电极和一个或多个第二连接焊盘位于第二区域中的微线层中。 每个微线电极包括一个或多个电连接的微线。 每个第一或第二连接焊盘位于第一或第二层边缘附近并且分别电连接到对应的第一或第二微线电极。

公开(公告)号：US20150085456A1

公开(公告)日：2015-03-26

申请号：US14032235

申请日：2013-09-20

Applicant: Ronald Steven Cok

Inventor： RONALD STEVEN COK

IPC: H05K1/02

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/097 ,  H05K1/185 ,  H05K3/1258 ,  H05K3/465 ,  H05K3/4664 ,  H05K2201/09218 ,  H05K2203/0108

Abstract: An imprinted multi-level micro-wire structure includes a substrate and a first layer formed over the substrate. The first layer includes first micro-wires formed in first micro-channels imprinted in the first layer. A second layer is formed in contact with the first layer. The second layer includes second micro-wires formed in second micro-channels imprinted in the second layer. At least one of the second micro-wires is in electrical contact with at least one of the first micro-wires.

Abstract translation: 印刷的多级微线结构包括基板和形成在基板上的第一层。 第一层包括形成在第一层中的第一微通道中形成的第一微细线。 形成与第一层接触的第二层。 第二层包括在第二层中印刷的第二微通道中形成的第二微细线。 第二微线中的至少一个与第一微线中的至少一个电接触。

公开(公告)号：US20150060395A1

公开(公告)日：2015-03-05

申请号：US14012240

申请日：2013-08-28

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: H05K3/12

CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

Abstract: A method of making an imprinted micro-wire structure includes providing a substrate having an edge area and a central area separate from the edge area and providing a first stamp and a multi-level second stamp. A curable bottom layer and multi-layer are provided on the substrate. A bottom-layer micro-channel is imprinted in the bottom layer. A multi-layer micro-channel and a top-layer micro-channel are imprinted in the multi-layer. Micro-wires are formed in each micro-channel. The bottom-layer micro-wire extends from the central area into the edge area. The multi-layer micro-wire contacts the bottom-layer micro-wire in the edge area. The top-layer micro-wire is over the central area and is separate from the multi-layer micro-wire and the bottom-layer micro-channel. The bottom-layer micro-wire is electrically connected to the multi-layer micro-wire and is electrically isolated from the top-layer micro-wire.

Abstract translation: 制造压印微线结构的方法包括提供具有与边缘区域分离的边缘区域和中心区域的基板，并提供第一印模和多级第二印模。 在基板上设置有可固化的底层和多层。 底层微通道印在底层中。 多层微通道和顶层微通道印在多层中。 微线形成在每个微通道中。 底层微线从中心区域延伸到边缘区域。 多层微线接触边缘区域的底层微线。 顶层微线在中心区域之上，与多层微线和底层微通道分离。 底层微线电连接到多层微线，并与顶层微线电隔离。

公开(公告)号：US20150060394A1

公开(公告)日：2015-03-05

申请号：US14012216

申请日：2013-08-28

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: H05K3/12

CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

Abstract: A method of making an imprinted micro-wire structure includes providing a substrate having an edge area and a central area separate from the edge area and providing first, second, and third different stamps. A curable bottom, connecting layer, and top layer are formed on the substrate. A bottom-layer micro-channel is imprinted in the bottom layer in the central area and the edge area, a connecting-layer micro-channel is imprinted in the connecting layer in the edge area over the bottom-layer micro-channel, an edge micro-channel is imprinted in the top layer in the edge area over the connecting-layer micro-channel, and top-layer micro-channels are imprinted in the top layer over the central area. Micro-wires are formed in each micro-channel. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.

Abstract translation: 制造压印微线结构的方法包括提供具有与边缘区域分离的边缘区域和中心区域的基板，并提供第一，第二和第三不同的邮票。 在基板上形成可固化的底部，连接层和顶层。 底层微通道印在中心区域和边缘区域的底层中，连接层微通道被压印在底层微通道上的边缘区域中的连接层中，边缘 微通道印在连接层微通道上的边缘区域的顶层中，顶层微通道印在中心区域的顶层中。 微线形成在每个微通道中。 中心区域的底层微线电连接到边缘区域中的边缘微线，并与顶层微线电隔离。

公开(公告)号：US20140251673A1

公开(公告)日：2014-09-11

申请号：US13784893

申请日：2013-03-05

Applicant: RONALD STEVEN COK ,  David Paul Trauernicht

Inventor： RONALD STEVEN COK ,  David Paul Trauernicht

IPC: H05K3/30 ,  H05K1/02

CPC classification number: H05K3/1258 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  Y10T29/49147

Abstract: A method of making a connection-pad structure includes providing a substrate and coating a curable layer over the substrate. A group of intersecting micro-channels is embossed in the curable layer. Each micro-channel extends from a surface of the curable layer into the curable layer toward the substrate. The curable layer is cured to form a cured layer having embossed intersecting micro-channels in the cured layer; the group of intersecting micro-channels forms a connection pad. A curable electrical conductor is located in the intersecting micro-channels. The curable electrical conductor is cured to form an electrically continuous cured electrical conductor formed in the group of intersecting micro-channels and an electrical connector is electrically connected to the cured electrical conductor.

Abstract translation: 制造连接垫结构的方法包括提供基底并在基底上涂覆可固化层。 一组相交的微通道被压印在可固化层中。 每个微通道从可固化层的表面延伸到可固化层朝向衬底。 将固化层固化，形成在固化层中具有压纹交叉的微通道的固化层; 相交的微通道组形成连接垫。 可固化电导体位于相交的微通道中。 固化的电导体被固化以形成形成在相交的微通道组中的电连续的固化电导体，并且电连接器电连接到固化的电导体。

公开(公告)号：US20140251661A1

公开(公告)日：2014-09-11

申请号：US13784869

申请日：2013-03-05

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: H05K1/02

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: A micro-channel structure having variable depths includes a substrate and a cured layer formed on the substrate. At least first and second micro-channels are embossed in the cured layer. The first micro-channel has a bottom surface defining a first depth and the second micro-channel has a bottom surface defining a second depth different from the first depth. A cured electrical conductor is making a micro-wire is formed in each of the first and second micro-channels over their respective bottom surfaces.

Abstract translation: 具有可变深度的微通道结构包括基板和形成在基板上的固化层。 至少第一和第二微通道在固化层中压花。 第一微通道具有限定第一深度的底表面，并且第二微通道具有限定不同于第一深度的第二深度的底表面。 固化的电导体正在使第一和第二微通道中的每一个在它们各自的底表面上形成微线。

公开(公告)号：US20130181043A1

公开(公告)日：2013-07-18

申请号：US13351645

申请日：2012-01-17

Applicant: RONALD STEVEN COK ,  Thomas Joseph Murray ,  Thiagarajah Arujunan

Inventor： RONALD STEVEN COK ,  Thomas Joseph Murray ,  Thiagarajah Arujunan

IPC: G06F17/40

CPC classification number: G06K19/06037 ,  G06K7/1465

Abstract: A method of making an ordered element list includes providing a plurality of machine-readable codes, each machine-readable code encoding a corresponding element or a reference to a corresponding element, and wherein each element of the plurality of elements forms a portion of a plurality of different ordered lists, each ordered list enabling a function having one or more operations; using a receiver to receive in order a digital image of each of a plurality of the machine-readable codes; using a processor to extract the elements received or referenced by the received digital images of the machine-readable codes; arranging the extracted elements in the received order to form an ordered list; and using a processor to perform the function enabled by the ordered list.

Abstract translation: 制造有序元素列表的方法包括提供多个机器可读代码，每个机器可读代码编码对应元件或对相应元件的引用，并且其中多个元素中的每个元素形成多个元件的一部分 每个有序列表启用具有一个或多个操作的功能; 使用接收机按顺序接收多个机器可读代码中的每一个的数字图像; 使用处理器来提取由所接收的机器可读代码的数字图像接收或引用的元素; 以所接收的顺序排列所提取的元素以形成有序列表; 并使用处理器执行由有序列表启用的功能。

公开(公告)号：US20160120174A1

公开(公告)日：2016-05-05

申请号：US14526611

申请日：2014-10-29

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: A01N25/08

CPC classification number: A01N25/34 ,  A01N25/10 ,  A01N59/16 ,  A01N25/04 ,  A01N25/08 ,  A01N59/20

Abstract: A multi-layer biocidal structure includes a support. A structured bi-layer is located on or over the support. The bi-layer includes a first cured layer on or over the support and a second cured layer on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the second cured layer.

Abstract translation: 多层杀生物结构包括载体。 结构化双层位于支撑上或上方。 所述双层包括在所述支撑体上或上方的第一固化层，以及在所述第一固化层的与所述载体相对的一侧上的第一固化层上或上的第二固化层。 结构化双层具有比第二层的厚度大至少一个深度。 多个杀生物颗粒仅位于第二固化层中。