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    STRIPLINE EDGE SNAP RADIO-FREQUENCY CONNECTION
    12.
    发明申请
    STRIPLINE EDGE SNAP RADIO-FREQUENCY CONNECTION 有权

    公开(公告)号：US20210066830A1

    公开(公告)日：2021-03-04

    申请号：US16552694

    申请日：2019-08-27

    Applicant: RAYTHEON COMPANY

    Inventor： Kevin Wilder ,  Alan C. Smith ,  James Benedict ,  Andrew Southworth ,  Thomas V. Sikina ,  Mary K. Herndon ,  John P. Haven

    IPC: H01R12/71 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H01R12/70 ,  H01R43/20 ,  H01R43/26

    Abstract: A stripline radio-frequency (RF) connection interface is provided and includes first and second printed circuit boards (PCBs). The first PCB includes a first trace, ground planes at opposite sides of the first trace, dielectric material interposed between the first trace and the ground planes and a first end. The first end is formed as a first rabbet at which the first trace is exposed. The second PCB includes a second trace, ground planes at opposite sides of the second trace, dielectric material interposed between the second trace and the ground planes and a second end. The second end is formed as a second rabbet, which is substantially identical to the first rabbet, at which the second trace is exposed. The first and second ends are mated in a shiplap joint to electrically couple the first and second traces.

    MODULE BASE WITH INTEGRATED THERMAL SPREADER AND HEAT SINK FOR THERMAL AND STRUCTURAL MANAGEMENT OF HIGH-PERFORMANCE INTEGRATED CIRCUITS OR OTHER DEVICES
    17.
    发明申请
    MODULE BASE WITH INTEGRATED THERMAL SPREADER AND HEAT SINK FOR THERMAL AND STRUCTURAL MANAGEMENT OF HIGH-PERFORMANCE INTEGRATED CIRCUITS OR OTHER DEVICES 审中-公开

    公开(公告)号：US20200091035A1

    公开(公告)日：2020-03-19

    申请号：US16569330

    申请日：2019-09-12

    Applicant: Raytheon Company

    Inventor： Anurag Gupta ,  David A. Brooks ,  Mary K. Herndon

    IPC: H01L23/42 ,  H01L23/367 ,  H01L23/46 ,  H01L21/48

    Abstract: An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.

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