-
公开(公告)号：US09871299B2
公开(公告)日：2018-01-16
申请号：US14560598
申请日：2014-12-04
Applicant: QUALCOMM Incorporated
Inventor： Elimelech Ganchrow , Alon Yehezkely
Abstract: An apparatus includes a first metal region of a substrate, a second metal region of the substrate, and vias that electrically connect the first metal region to the second metal region to define a cavity of a slot aperture antenna.
-
公开(公告)号：US09570809B2
公开(公告)日：2017-02-14
申请号：US14296875
申请日：2014-06-05
Applicant: QUALCOMM INCORPORATED
Inventor： Elimelech Ganchrow , Ofer Markish , Iddo Diukman , Alon Yehezkely
CPC classification number: H01Q9/285 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q1/50 , H01Q15/02 , H01Q19/30
Abstract: A printed millimeter wave dipole antenna and techniques for designing such an antenna are disclosed. In one embodiment, the dipole antenna comprises: a signal wing and at least one ground wing for propagating signals in a millimeter wave band; and an unbalanced feeding structure directly coupled to the signal wing. The unbalanced feeding structure is boarded by a plurality of escorting vias to ensure equipotential grounds.
Abstract translation: 公开了一种印刷毫米波偶极天线和用于设计这种天线的技术。 在一个实施例中，偶极天线包括：信号翼和至少一个用于在毫米波段中传播信号的地面翼; 以及直接耦合到信号翼的不平衡馈送结构。 不平衡喂养结构由多个护送通道登上，以确保等电位。
-
公开(公告)号：US20150194736A1
公开(公告)日：2015-07-09
申请号：US14561680
申请日：2014-12-05
Applicant: QUALCOMM Incorporated
Inventor： Iddo Diukman , Alon Yehezkely
CPC classification number: H01Q19/30 , H01Q1/48 , H01Q1/50 , H01Q9/20 , H01Q21/0006 , H01Q21/062
Abstract: An apparatus includes a first ground plane, a second ground plane, an antenna, and a balun coupled to the antenna. The balun is disposed between the first ground plane and the second ground plane.
Abstract translation: 一种装置包括耦合到天线的第一接地平面，第二接地平面，天线和平衡 - 不平衡变换器。 平衡 - 不平衡转换器设置在第一接地平面和第二接地平面之间。
-
公开(公告)号：US10347967B2
公开(公告)日：2019-07-09
申请号：US15415145
申请日：2017-01-25
Applicant: QUALCOMM Incorporated
Inventor： Elimelech Ganchrow , Alon Yehezkely
Abstract: Certain aspects of the present disclosure relate to methods and apparatus for wireless communication, and more particularly, to using a flexible printed circuit board (PCB) to convey signals between a radio frequency (RF) module and a baseband module. The flexible PCB can then be used as a medium for deploying antennas or creating arrays of multiple RF modules.
-
公开(公告)号：US09525439B2
公开(公告)日：2016-12-20
申请号：US14493167
申请日：2014-09-22
Applicant: QUALCOMM Incorporated
Inventor： Alon Yehezkely
CPC classification number: H04B1/0067 , H04B1/0007 , H04B1/0483 , H04B1/40 , H04B7/0404 , H04B7/0689 , H04B7/0871
Abstract: Aspects of the present disclosure provide a radio frequency (RF) system that may be implemented in a variety of devices. For example, the RF system may include a plurality of first RF-modules, each configured to process RF signals received from a corresponding antenna array to generate intermediate frequency (IF) signals and to process IF signals for transmission via the antenna array, wherein the plurality of first RF modules are coupled to each other via a first interface comprising transmission lines for carrying at least an IF signal, a local oscillator (LO) signal, and a control signals; at least one second RF module; and a baseband module configured to provide IF signals, the LO signal, and the control signals to one of the first RF modules via a second interface and to provide at least IF signals to the second RF module via a third interface.
Abstract translation: 本公开的方面提供可以在各种设备中实现的射频（RF）系统。 例如，RF系统可以包括多个第一RF模块，每个第一RF模块被配置为处理从相应的天线阵列接收的RF信号以产生中频（IF）信号，并且处理经由天线阵列传输的IF信号，其中， 多个第一RF模块经由包括用于承载至少IF信号，本地振荡器（LO）信号和控制信号的传输线路的第一接口彼此耦合） 至少一个第二RF模块; 以及基带模块，被配置为经由第二接口将IF信号，所述LO信号和所述控制信号提供给所述第一RF模块之一，并且经由第三接口向所述第二RF模块提供至少IF信号。
-
Patent Agency Ranking
公开(公告)号：US20160164186A1
公开(公告)日：2016-06-09
申请号：US14560598
申请日：2014-12-04
Applicant: QUALCOMM Incorporated
Inventor： Elimelech Ganchrow , Alon Yehezkely
Abstract: An apparatus includes a first metal region of a substrate, a second metal region of the substrate, and vias that electrically connect the first metal region to the second metal region to define a cavity of a slot aperture antenna.
Abstract translation: 一种装置包括基板的第一金属区域，基板的第二金属区域和将第一金属区域电连接到第二金属区域以形成狭缝孔径天线的空腔的通孔。
-
公开(公告)号：US10606333B2
公开(公告)日：2020-03-31
申请号：US15908448
申请日：2018-02-28
Applicant: QUALCOMM Incorporated
Inventor： Oron Sasson , Alon Yehezkely
IPC: G06F1/32 , G06F1/3209 , H04B1/40 , H04W52/02 , G06F1/3234 , G06F1/3203
Abstract: The apparatus is a wake-up circuit including a first comparator coupled to an input signal and configured to compare the input signal to a first comparison value. The wake-up circuit includes a second comparator coupled to the input signal and configured to compare the input signal to a second comparison value. The wake-up circuit further includes an exclusive OR gate. A first input of the exclusive OR gate is coupled to an output of the first comparator. A second input of the exclusive OR gate is coupled to an output of the second comparator. The wake-up circuit also includes a tunable charge pump coupled to an output of the exclusive OR gate and configured to convert a signal from the exclusive OR gate to a DC value to wake up a circuit being monitored.
-
公开(公告)号：US10230433B2
公开(公告)日：2019-03-12
申请号：US14809927
申请日：2015-07-27
Applicant: QUALCOMM Incorporated
Inventor： Amichai Sanderovich , Alon Yehezkely
IPC: H04B7/04 , H04B7/0413 , H04B7/08
Abstract: Certain aspects of the present disclosure provide an apparatus for wireless communication. The apparatus may generally include a plurality of detectors, each configured to detect a signal received by at least one of a plurality of antenna arrays. The apparatus may further include a processing system configured to determine whether the signal is received by the at least one of the plurality of antenna arrays based on signals output from the plurality of detectors.
-
公开(公告)号：US10063211B2
公开(公告)日：2018-08-28
申请号：US15422434
申请日：2017-02-01
Applicant: QUALCOMM Incorporated
Inventor： Alon Yehezkely , Sagi Kupferman
IPC: H04B1/38 , H03H7/01 , H04B1/40 , H03F3/195 , H03F1/02 , H01L23/50 , H01L23/522 , H03F1/56 , H03F3/193
CPC classification number: H03H7/0115 , C07K14/005 , C12N2760/16122 , C12N2760/16222 , H01L23/50 , H01L23/5223 , H01L23/5227 , H01L23/66 , H03F1/0222 , H03F1/565 , H03F3/193 , H03F3/195 , H03F2200/294 , H03F2200/408 , H03F2200/451 , H04B1/40
Abstract: The disclosure generally relates to a compact bypass and decoupling structure that can be used in a millimeter-wave radio frequency integrated circuit (RFIC). For example, according to various aspects, an RFIC incorporating the compact bypass and decoupling structure may comprise a grounded substrate, a mid-metal ground plane, a bypass capacitor disposed between the grounded substrate and the mid-metal ground plane, and a decoupling inductor disposed over the mid-metal ground plane. The bypass capacitor may close a current loop in the RFIC and the decoupling inductor may provide damping in a supply network associated with the RFIC. Furthermore, the decoupling conductor may have a self-resonance substantially close to an operating band associated with the RFIC to increase series isolation, introduce substrate losses that facilitate the damping in the supply network, and prevent high-Q resonances.
-
公开(公告)号：US09680232B2
公开(公告)日：2017-06-13
申请号：US14286464
申请日：2014-05-23
Applicant: QUALCOMM Incorporated
Inventor： Ofer Markish , Alon Yehezkely
CPC classification number: H01Q21/0025 , H01L2224/16225 , H01Q1/48 , H01Q21/0093 , H01Q21/067 , H01Q21/205 , H01Q23/00
Abstract: A millimeter-wave radio frequency (RF) module is provided. The RF module includes a multilayer substrate having at least a front layer, a back layer, a plurality of middle layers, a first ground layer, and a second ground layer, wherein the first ground layer includes a graded-ground plane having a pair of non-overlapping ground lines connected at a single connection point through a graded connection, and wherein the second ground layer includes a double graded-ground plane having a pair of overlapping ground lines connected at a single connection point through a graded connection, wherein the first ground layer and the second ground layer provide a reference ground to a transmission line included in the multilayer substrate.
-
-
-
-
-
-
-
-
-
Search Results
24
records
(took 0.015 seconds)
