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公开(公告)号：US10340871B2
公开(公告)日：2019-07-02
申请号：US16100185
申请日：2018-08-09
Applicant: QUALCOMM Incorporated
Inventor： Alon Yehezkely , Sagi Kupferman
IPC: H03H7/01 , H04B1/40 , H03F3/195 , H03F1/02 , H01L23/50 , H01L23/522 , H03F1/56 , H03F3/193 , H01L23/66 , C07K14/005
Abstract: The disclosure generally relates to a compact bypass and decoupling structure that can be used in a millimeter-wave radio frequency integrated circuit (RFIC). For example, according to various aspects, an RFIC incorporating the compact bypass and decoupling structure may comprise a grounded substrate, a mid-metal ground plane, a bypass capacitor disposed between the grounded substrate and the mid-metal ground plane, and a decoupling inductor disposed over the mid-metal ground plane. The bypass capacitor may close a current loop in the RFIC and the decoupling inductor may provide damping in a supply network associated with the RFIC. Furthermore, the decoupling conductor may have a self-resonance substantially close to an operating band associated with the RFIC to increase series isolation, introduce substrate losses that facilitate the damping in the supply network, and prevent high-Q resonances.
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公开(公告)号：US10063211B2
公开(公告)日：2018-08-28
申请号：US15422434
申请日：2017-02-01
Applicant: QUALCOMM Incorporated
Inventor： Alon Yehezkely , Sagi Kupferman
IPC: H04B1/38 , H03H7/01 , H04B1/40 , H03F3/195 , H03F1/02 , H01L23/50 , H01L23/522 , H03F1/56 , H03F3/193
CPC classification number: H03H7/0115 , C07K14/005 , C12N2760/16122 , C12N2760/16222 , H01L23/50 , H01L23/5223 , H01L23/5227 , H01L23/66 , H03F1/0222 , H03F1/565 , H03F3/193 , H03F3/195 , H03F2200/294 , H03F2200/408 , H03F2200/451 , H04B1/40
Abstract: The disclosure generally relates to a compact bypass and decoupling structure that can be used in a millimeter-wave radio frequency integrated circuit (RFIC). For example, according to various aspects, an RFIC incorporating the compact bypass and decoupling structure may comprise a grounded substrate, a mid-metal ground plane, a bypass capacitor disposed between the grounded substrate and the mid-metal ground plane, and a decoupling inductor disposed over the mid-metal ground plane. The bypass capacitor may close a current loop in the RFIC and the decoupling inductor may provide damping in a supply network associated with the RFIC. Furthermore, the decoupling conductor may have a self-resonance substantially close to an operating band associated with the RFIC to increase series isolation, introduce substrate losses that facilitate the damping in the supply network, and prevent high-Q resonances.
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公开(公告)号：US20150207536A1
公开(公告)日：2015-07-23
申请号：US14569206
申请日：2014-12-12
Applicant: QUALCOMM Incorporated
Inventor： Alon Yehezkely , Tamir Levinger , Sagi Kupferman , Sergey Levin
CPC classification number: H04B1/44 , H01Q3/24 , H03H7/465 , H03H11/02 , H03K2017/066 , H04B1/0064
Abstract: An apparatus includes an impedance circuit and a plurality of inductors coupled to the impedance circuit. Each of the plurality of inductors is coupled in parallel to a corresponding switch of a plurality of switches.
Abstract translation: 一种装置包括阻抗电路和耦合到阻抗电路的多个电感器。 多个电感器中的每一个并联耦合到多个开关的相应开关。
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公开(公告)号：US09729190B2
公开(公告)日：2017-08-08
申请号：US14569206
申请日：2014-12-12
Applicant: QUALCOMM Incorporated
Inventor： Alon Yehezkely , Tamir Levinger , Sagi Kupferman , Sergey Levin
CPC classification number: H04B1/44 , H01Q3/24 , H03H7/465 , H03H11/02 , H03K2017/066 , H04B1/0064
Abstract: An apparatus includes an impedance circuit and a plurality of inductors coupled to the impedance circuit. Each of the plurality of inductors is coupled in parallel to a corresponding switch of a plurality of switches.
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