公开(公告)号：US20240165922A1

公开(公告)日：2024-05-23

申请号：US18551122

申请日：2022-02-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yasunori NISHIGUCHI ,  Hiroharu INOUE

IPC: B32B15/08 ,  H05K1/03

CPC classification number: B32B15/08 ,  H05K1/032 ,  B32B2457/08

Abstract: A resin composition contains a curable resin. A quantity of outgas emitted from a cured product of the resin composition at a temperature falling within a range from 30° C. to 550° C. when the cured product is subjected to a thermal gravimetric analysis with a temperature increased from 30° C. to 800° C. at a temperature increase rate of 90° C. per minute is less than 27% by mass with respect to an entire mass of the cured product.

公开(公告)号：US20230331957A1

公开(公告)日：2023-10-19

申请号：US18025114

申请日：2021-09-09

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Rihoko WATANABE ,  Hirosuke SAITO ,  Hiroaki UMEHARA ,  Hiroharu INOUE

IPC: C08K5/3415 ,  C08K3/36 ,  C08J5/24 ,  C08J7/04 ,  H05K1/03 ,  C08L53/00

CPC classification number: C08K5/3415 ,  C08J5/246 ,  C08J7/0427 ,  C08K3/36 ,  C08L53/00 ,  H05K1/0373 ,  C08J2353/00 ,  C08L2203/20

Abstract: A resin composition contains a maleimide compound (A) having an indane structure in the molecule, and a styrenic polymer being solid at 25° C.

公开(公告)号：US20230250281A1

公开(公告)日：2023-08-10

申请号：US18012176

申请日：2021-06-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Jun YASUMOTO ,  Rihoko WATANABE ,  Teppei WASHIO ,  Hiroharu INOUE

IPC: C08L79/08 ,  C08J5/24 ,  C08J7/04 ,  H05K1/03

CPC classification number: C08L79/08 ,  C08J5/246 ,  C08J7/0427 ,  H05K1/0353 ,  C08J2309/06 ,  C08J2333/08 ,  C08J2363/00 ,  C08J2379/08 ,  C08L2203/16 ,  C08L2205/035

Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tanδ = E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tanδ = E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

公开(公告)号：US20230193024A1

公开(公告)日：2023-06-22

申请号：US18112837

申请日：2023-02-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kosuke TSUDA ,  Hirosuke SAITO ,  Yiqun WANG ,  Hiroharu INOUE

IPC: C08L71/12 ,  C08K3/36 ,  C08J5/24 ,  C08J5/18 ,  H05K1/03

CPC classification number: C08L71/126 ,  C08K3/36 ,  C08J5/249 ,  C08J5/18 ,  H05K1/0373 ,  C08L2203/16 ,  C08J2371/12 ,  C08J2425/16 ,  C08J2453/02

Abstract: An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).

公开(公告)号：US20220259424A1

公开(公告)日：2022-08-18

申请号：US17626881

申请日：2020-07-16

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD

Inventor： Hirosuke SAITO ,  Yiqun WANG ,  Hiroharu INOUE

IPC: C08L63/08 ,  C08J5/24 ,  B32B15/20 ,  B32B5/02 ,  B32B15/14 ,  B32B15/092 ,  B32B27/38 ,  B32B27/36 ,  B32B27/28 ,  B32B27/34 ,  B32B27/08 ,  H05K1/03 ,  H05K3/02

Abstract: An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.

公开(公告)号：US20190263087A1

公开(公告)日：2019-08-29

申请号：US16316579

申请日：2017-07-19

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Keiko KASHIHARA ,  Takashi HOSHI ,  Hiroharu INOUE

IPC: B32B5/02 ,  B32B15/14 ,  C08J5/24 ,  H05K1/03

Abstract: A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).

公开(公告)号：US20240084133A1

公开(公告)日：2024-03-14

申请号：US18517442

申请日：2023-11-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki UMEHARA ,  Fumito SUZUKI ,  Jun YASUMOTO ,  Hiroharu INOUE

IPC: C08L71/12 ,  C08J5/24 ,  C08K5/00 ,  C08K5/3492

CPC classification number: C08L71/126 ,  C08J5/244 ,  C08K5/0025 ,  C08K5/34924 ,  C08L2203/16 ,  C08L2203/202 ,  C08L2205/025 ,  C08L2312/00

Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

公开(公告)号：US20230250282A1

公开(公告)日：2023-08-10

申请号：US18012184

申请日：2021-06-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Rihoko WATANABE ,  Jun YASUMOTO ,  Hiroharu INOUE

IPC: C08L79/08 ,  C08K5/5313 ,  C08K5/5399 ,  C08J5/24 ,  C08J7/04 ,  H05K1/03

CPC classification number: C08L79/08 ,  C08K5/5313 ,  C08K5/5399 ,  C08J5/246 ,  C08J7/0427 ,  H05K1/0353 ,  C08L2205/03 ,  C08L2203/16 ,  C08J2309/06 ,  C08J2363/00 ,  C08J2379/08

Abstract: A resin composition contains a maleimide compound (A), a phosphine oxide compound (B), and an epoxy compound (C). The maleimide compound (A) includes a maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphine oxide compound (B) has a structure expressed by the following formula (b0), where X is a monovalent or divalent hydrocarbon group having at least one aromatic ring or an alkylene group and n is either 1 or 2.

公开(公告)号：US20220259363A1

公开(公告)日：2022-08-18

申请号：US17626886

申请日：2020-07-16

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hirosuke SAITO ,  Yiqun WANG ,  Hiroharu INOUE

IPC: C08F299/02 ,  C08K5/00 ,  C08J5/24 ,  C08K5/3492 ,  H05K1/03 ,  C08K5/06

Abstract: An aspect of the present invention is a resin composition containing a first styrene-based block copolymer having a hardness of 20 to 70, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.

公开(公告)号：US20210054197A1

公开(公告)日：2021-02-25

申请号：US16977384

申请日：2019-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki UMEHARA ,  Rihoko WATANABE ,  Hiroharu INOUE ,  Yiqun WANG

IPC: C08L71/12 ,  C08F112/08 ,  C08F120/14 ,  C08F222/40 ,  C08J5/24 ,  C08J5/04 ,  C08J5/18 ,  B32B15/08

Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).