A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tanδ = E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tanδ = E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.