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公开(公告)号：US20160323942A1
公开(公告)日：2016-11-03
申请号：US15210174
申请日：2016-07-14
发明人： Peter Nagel , Stefan Illek
摘要： An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein the diodes have electrical connections, the electrical connections are led to contact areas, and the contact areas are arranged on an underside of the first carrier; and a second carrier, wherein further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and fixedly connects to the second carrier, and an electronic circuit for open-loop and/or closed-loop control of the power supply of the diodes is integrated in the second carrier.
摘要翻译： 光电子部件包括具有至少两个发光二极管的至少一个第一载体，其中二极管具有电连接，电连接被引导到接触区域，并且接触区域布置在第一载体的下侧上; 以及第二载体，其中另外的接触区域布置在所述第二载体的顶侧上，所述第一载体由所述第二载体的顶侧上的下侧承载并固定地连接到所述第二载体， 二极管的电源的环路和/或闭环控制被集成在第二载波中。
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公开(公告)号：US11345068B2
公开(公告)日：2022-05-31
申请号：US16227789
申请日：2018-12-20
发明人： Peter Nagel , Tobias Gebuhr
IPC分类号： B29C45/14 , B29C33/14 , B29L31/34 , B29C45/26 , B29L31/00 , B29C39/10 , B29C33/42 , B29C33/00 , B29D11/00
摘要： A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.
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公开(公告)号：US10937932B2
公开(公告)日：2021-03-02
申请号：US16286100
申请日：2019-02-26
发明人： Peter Nagel , Klaus Reingruber , Simone Brantl , Konrad Wagner , Ralf Müller
摘要： An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.
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公开(公告)号：US10426006B2
公开(公告)日：2019-09-24
申请号：US15210174
申请日：2016-07-14
发明人： Peter Nagel , Stefan Illek
IPC分类号： H01L25/16 , H05B33/08 , H01L27/15 , H01L23/34 , H01L25/00 , H01L29/866 , H01L33/62 , H01L33/00
摘要： An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein the diodes have electrical connections, the electrical connections are led to contact areas, and the contact areas are arranged on an underside of the first carrier; and a second carrier, wherein further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and fixedly connects to the second carrier, and an electronic circuit for open-loop and/or closed-loop control of the power supply of the diodes is integrated in the second carrier.
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公开(公告)号：US20190157249A1
公开(公告)日：2019-05-23
申请号：US16195904
申请日：2018-11-20
发明人： Peter Nagel
IPC分类号： H01L25/075 , H01L33/60 , H01L33/54 , H01L33/50 , H01L33/00
摘要： An optoelectronic component includes a carrier including a mounting face, wherein at least one optoelectronic semiconductor chip configured to emit electromagnetic radiation is arranged above the mounting face, a molding material is arranged above the mounting face, the optoelectronic semiconductor chips are embedded into the molding material, a cavity is formed in the molding material, the cavity is empty, radiation emission faces of the optoelectronic semiconductor chips are not covered by the molding material, the cavity is accessible through an opening in the molding material, and an opening face of the opening is smaller than a sum of all radiation emission faces of the optoelectronic semiconductor chips.
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