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公开(公告)号：US20220077362A1
公开(公告)日：2022-03-10
申请号：US17433060
申请日：2020-02-07
IPC分类号： H01L33/58 , H01L25/075 , H01L33/50
摘要： In an embodiment a component includes a common carrier, a plurality of component parts, converter layers and internal scattering regions, wherein the component parts are arranged side by side in a lateral direction and vertically between the common carrier and the converter layers, wherein the component has a pass-through region and a radiation exit surface which, in a vertical direction, is spaced apart from the converter layers by the pass-through region, wherein adjacent converter layers are laterally spaced from each other by an intermediate region which, in top view of the carrier, is completely covered by the pass-through region, and wherein the inner scattering regions adjoin the pass-through region and the converter layers and are arranged at least partially in the intermediate region or directly adjoin the intermediate region.
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公开(公告)号：US09418972B2
公开(公告)日：2016-08-16
申请号：US14429390
申请日：2013-09-27
发明人： Peter Nagel , Stefan Illek
CPC分类号： H05B33/083 , H01L23/34 , H01L25/162 , H01L25/167 , H01L25/50 , H01L27/15 , H01L29/866 , H01L33/0079 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H05B33/089 , H01L2924/00
摘要： An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein each diode has two electrical connections, each electrical connection is led to a contact area, the contact areas are arranged on an underside of the first carrier, and a second carrier, wherein at least two zener diodes are arranged in the second carrier, the zener diodes have further electrical connections, each further electrical connection is led to a further contact area, the further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and is fixedly connected to the second carrier, and the zener diodes antiparallelly connect to the diodes.
摘要翻译： 光电子部件包括具有至少两个发光二极管的至少一个第一载体，其中每个二极管具有两个电连接，每个电连接被引导到接触区域，接触区域布置在第一载体的下侧，并且 第二载体，其中在所述第二载体中布置至少两个齐纳二极管，所述齐纳二极管具有另外的电连接，每个进一步的电连接被引导到另一接触区域，所述另外的接触区域布置在所述第二载体的顶侧 第一载体由第二载体的顶侧的下侧承载，并固定地连接到第二载体，并且齐纳二极管反平行地连接到二极管。
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公开(公告)号：US20150214203A1
公开(公告)日：2015-07-30
申请号：US14429390
申请日：2013-09-27
发明人： Peter Nagel , Stefan Illek
CPC分类号： H05B33/083 , H01L23/34 , H01L25/162 , H01L25/167 , H01L25/50 , H01L27/15 , H01L29/866 , H01L33/0079 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H05B33/089 , H01L2924/00
摘要： An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein each diode has two electrical connections, each electrical connection is led to a contact area, the contact areas are arranged on an underside of the first carrier, and a second carrier, wherein at least two zener diodes are arranged in the second carrier, the zener diodes have further electrical connections, each further electrical connection is led to a further contact area, the further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and is fixedly connected to the second carrier, and the zener diodes antiparallelly connect to the diodes.
摘要翻译： 光电子部件包括具有至少两个发光二极管的至少一个第一载体，其中每个二极管具有两个电连接，每个电连接被引导到接触区域，接触区域布置在第一载体的下侧，并且 第二载体，其中在所述第二载体中布置至少两个齐纳二极管，所述齐纳二极管具有另外的电连接，每个进一步的电连接被引导到另一接触区域，所述另外的接触区域布置在所述第二载体的顶侧 第一载体由第二载体的顶侧的下侧承载，并固定地连接到第二载体，并且齐纳二极管反平行地连接到二极管。
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公开(公告)号：US20190267519A1
公开(公告)日：2019-08-29
申请号：US16286100
申请日：2019-02-26
发明人： Peter Nagel , Klaus Reingruber , Simone Brantl , Konrad Wagner , Ralf Müller
摘要： An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.
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公开(公告)号：US20210391509A1
公开(公告)日：2021-12-16
申请号：US17287889
申请日：2019-10-28
发明人： Ivar Tangring , Peter Nagel
IPC分类号： H01L33/50 , H01L33/10 , H01L27/142 , H01L33/00
摘要： In an embodiment an optoelectronic semiconductor component includes a semiconductor body having an active region configured to generate first electromagnetic radiation, a wavelength conversion element having a conversion region and a sacrificial region, the conversion region configured to convert at least a portion of the first electromagnetic radiation to second electromagnetic radiation and a shaped body in which the semiconductor body and the wavelength conversion element are at least partially embedded and which is at least in places directly adjacent to the semiconductor body and the wavelength conversion element, wherein the conversion region is arranged between the sacrificial region and the semiconductor body, wherein the sacrificial region is transmissive to the first and second electromagnetic radiations, and wherein the shaped body is a reflector for the first and second electromagnetic radiations.
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6.发明授权公开(公告)号：US10242974B2
公开(公告)日：2019-03-26
申请号：US15113749
申请日：2015-01-21
发明人： Lutz Hoeppel , Juergen Moosburger , Andreas Ploessl , Patrick Rode , Peter Nagel , Dominik Scholz
IPC分类号： H01L33/00 , H01L31/12 , H01L29/267 , H01L27/15 , H01L25/16 , H01L33/48 , H01L25/00 , H01L31/0232 , H01L31/147 , H01L31/18 , H01L33/58
摘要： A method for producing a plurality of optoelectronic semiconductor components (100) is provided, comprising the following steps: a) providing an auxiliary carrier (2); b) providing a plurality of semiconductor chips (10), wherein each of the semiconductor chips has a carrier body (12) and a semiconductor body (4) arranged on an upper side (22) of the carrier body; c) attaching the plurality of semiconductor chips on the auxiliary carrier, wherein the semiconductor chips are spaced apart from one another in a lateral direction (L) and wherein the semiconductor bodies are facing the auxiliary carrier, as seen from the carrier body; d) forming a scattering layer (18), at least in regions between the semiconductor bodies of adjacent semiconductor chips; e) forming a composite package (20); f) removing the auxiliary carrier (2); and g) individually separating the composite package into a plurality of optoelectronic semiconductor components (100).
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公开(公告)号：US10910351B2
公开(公告)日：2021-02-02
申请号：US16195904
申请日：2018-11-20
发明人： Peter Nagel
摘要： An optoelectronic component includes a carrier including a mounting face, wherein at least one optoelectronic semiconductor chip configured to emit electromagnetic radiation is arranged above the mounting face, a molding material is arranged above the mounting face, the optoelectronic semiconductor chips are embedded into the molding material, a cavity is formed in the molding material, the cavity is empty, radiation emission faces of the optoelectronic semiconductor chips are not covered by the molding material, the cavity is accessible through an opening in the molding material, and an opening face of the opening is smaller than a sum of all radiation emission faces of the optoelectronic semiconductor chips.
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公开(公告)号：US20190193314A1
公开(公告)日：2019-06-27
申请号：US16227789
申请日：2018-12-20
发明人： Peter Nagel , Tobias Gebuhr
CPC分类号： B29C45/14639 , B29C45/26 , B29L2031/34
摘要： A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.
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公开(公告)号：US20190189871A1
公开(公告)日：2019-06-20
申请号：US16193308
申请日：2018-11-16
发明人： Peter Nagel , Klaus Reingruber
摘要： A method of producing a lighting device includes a radiation-emitting optoelectronic component, including: arranging the component on a carrier, applying a first layer on the carrier, wherein the first layer surrounds the component at least laterally in the form of a circumferential frame, and subsequently applying a second layer on the first layer laterally next to the frame, wherein the second layer includes a greater hardness than the first layer.
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公开(公告)号：US09543471B2
公开(公告)日：2017-01-10
申请号：US14889316
申请日：2014-05-12
发明人： Peter Nagel , Stefan Illek , Martin Strassburg
CPC分类号： H01L33/10 , H01L33/005 , H01L33/04 , H01L33/06 , H01L33/08
摘要： An optoelectronic device (10, 1010) having a semiconductor layer structure (100, 1100) comprising a first light-active layer (140) and a second light-active layer (240). A first tunnel junction (200) is formed between the first light-active layer (140) and the second light-active layer (240). A first Bragg reflector (160) is formed between the first light-active layer (140) and the first tunnel junction (200). A second Bragg reflector (260) is formed between the second light-active layer (240) and the first tunnel junction (200).
摘要翻译： 具有包括第一光活性层（140）和第二光活性层（240）的半导体层结构（100,1100）的光电子器件（10,1010）。 在第一光活性层（140）和第二光活性层（240）之间形成第一隧道结（200）。 第一布拉格反射器（160）形成在第一光活性层（140）和第一隧道结（200）之间。 第二布拉格反射器（260）形成在第二光活性层（240）和第一隧道结（200）之间。
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