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公开(公告)号：US20190267519A1
公开(公告)日：2019-08-29
申请号：US16286100
申请日：2019-02-26
发明人： Peter Nagel , Klaus Reingruber , Simone Brantl , Konrad Wagner , Ralf Müller
摘要： An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.
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公开(公告)号：US10937932B2
公开(公告)日：2021-03-02
申请号：US16286100
申请日：2019-02-26
发明人： Peter Nagel , Klaus Reingruber , Simone Brantl , Konrad Wagner , Ralf Müller
摘要： An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.
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