公开(公告)号：US12272961B2

公开(公告)日：2025-04-08

申请号：US17321762

申请日：2021-05-17

Applicant: Nokia Technologies Oy

Inventor： Diarmuid O'Connell ,  Oliver Burns ,  Nicholas Jeffers ,  Ian Davis ,  Akshat Agarwal

IPC: H02J50/10 ,  H02J7/02

Abstract: Aspects of the present disclosure may relate to an apparatus, a method, and non-transitory computer-readable storage medium configured for tuning radio frequency elements. In some aspects, the aspects may relate to at least one radio frequency element, at least one wireless charging, one or more channels configured to run between a first portion at least substantially adjacent to the at least one wireless charging coil and a second portion at least substantially adjacent to the at least one radio frequency element, and a dielectric fluid disposed within the one or more channels.

公开(公告)号：US11693456B2

公开(公告)日：2023-07-04

申请号：US17383841

申请日：2021-07-23

Applicant: Nokia Technologies Oy

Inventor： Nick Jeffers ,  Diarmuid O'Connell ,  Ian Davis ,  Akshat Agarwal ,  Oliver Burns

IPC: G06F1/16 ,  G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: G06F1/1681 ,  G06F1/203 ,  G06F1/206 ,  H01L23/427 ,  H05K7/20336 ,  G06F2200/201 ,  G06F2200/203

Abstract: Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

公开(公告)号：US20200275215A1

公开(公告)日：2020-08-27

申请号：US16287338

申请日：2019-02-27

Applicant: Nokia Technologies Oy

Inventor： Ian DAVIS ,  Akshat Agarwal

IPC: H04R17/10 ,  H04R3/04 ,  H04R31/00

Abstract: An apparatus including a first member; a first array of flexible actuators connected to the first member, where each of the flexible actuators includes a piezoelectric member and an extension on the piezoelectric member; and a first flexible membrane connected to the first array of flexible actuators. Each of the piezoelectric members is configured to be activated to move their respective extensions. Each of the extensions, when moved by their respective piezoelectric members, is configured to move the first flexible membrane.

公开(公告)号：US20190081453A1

公开(公告)日：2019-03-14

申请号：US16123400

申请日：2018-09-06

Applicant: Nokia Technologies Oy

Inventor： Rudi O'Reilly Meehan ,  Akshat Agarwal ,  Nicholas M. Jeffers

IPC: H01S5/024

Abstract: There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.