公开(公告)号：US20230009006A1

公开(公告)日：2023-01-12

申请号：US17783212

申请日：2020-12-02

Applicant: NITTO DENKO CORPORATION

Inventor： Masaki ITO ,  Hayato TAKAKURA ,  Ryohei KAKIUCHI

IPC: H05K3/28 ,  H05K3/44 ,  H05K1/05

Abstract: A method for manufacturing a wiring circuit board includes first forming an insulating base layer on a one-side surface in a thickness direction of a metal sheet, second forming a conductor layer on a one-side surface in the thickness direction of the insulating base layer so that a width of a wire is smaller than a width W2 of a wiring body base portion, third forming an insulating cover layer on a one-side surface in the thickness direction of the wiring body base portion exposed from the wire so that the wire is covered with the insulating cover layer and a width of a wiring body cover portion is smaller than the width W2, and fourth forming a metal supporting layer by etching the metal sheet from both sides in the thickness direction so that a width of a wiring body metal portion is smaller than the width W2.

公开(公告)号：US20220287177A1

公开(公告)日：2022-09-08

申请号：US17636251

申请日：2020-06-11

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Daigo TSUBAI ,  Hiroaki MACHITANI

IPC: H05K1/05 ,  H01B1/02 ,  H05K1/09

Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 μm or more.

公开(公告)号：US20220256712A1

公开(公告)日：2022-08-11

申请号：US17610058

申请日：2020-04-08

Applicant: NITTO DENKO CORPORATION

Inventor： Kenya TAKIMOTO ,  Naoki SHIBATA ,  Hayato TAKAKURA

IPC: H05K3/24 ,  H05K3/06 ,  H05K1/11 ,  H05K3/44 ,  H05K3/40

Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.

公开(公告)号：US20220192010A1

公开(公告)日：2022-06-16

申请号：US17441918

申请日：2020-03-05

Applicant: NITTO DENKO CORPORATION

Inventor： Ryosuke SASAOKA ,  Yasunari OYABU ,  Hiroaki MACHITANI ,  Hayato TAKAKURA

IPC: H05K1/02 ,  H05K3/00

Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.

公开(公告)号：US20210084750A1

公开(公告)日：2021-03-18

申请号：US16644781

申请日：2018-09-05

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshihiro KAWAMURA ,  Shusaku SHIBATA ,  Hayato TAKAKURA ,  Masaki ITO

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/46

Abstract: A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.

公开(公告)号：US20200154016A1

公开(公告)日：2020-05-14

申请号：US16607580

申请日：2018-04-25

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI ,  Shusaku SHIBATA

IPC: H04N5/225 ,  H05K1/03

Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.

公开(公告)号：US20200075474A1

公开(公告)日：2020-03-05

申请号：US16607612

申请日：2018-04-23

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Shuichi WAKAKI ,  Shusaku SHIBATA ,  Yoshihiro KAWAMURA ,  Masaki ITO

IPC: H01L23/498 ,  H01L27/146 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H04N5/225

Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.

公开(公告)号：US20240397609A1

公开(公告)日：2024-11-28

申请号：US18658450

申请日：2024-05-08

Applicant: NITTO DENKO CORPORATION

Inventor： Tomoaki TANAKA ,  Hayato TAKAKURA ,  Ryosuke SASAOKA

IPC: H05K1/02 ,  H05K3/18

Abstract: A wiring circuit board includes a first insulating layer, a wiring pattern disposed at one side of the first insulating layer in a thickness direction and including a terminal and a wire connected with the terminal, and a shield pattern disposed at the one side of the first insulating layer in the thickness direction and spaced apart from and adjacent to a part of the wire. The wire is made of a first conductive layer, and the shield pattern is made of a second conductive layer.

公开(公告)号：US20240114615A1

公开(公告)日：2024-04-04

申请号：US17768758

申请日：2020-09-15

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Naoki SHIBATA ,  Yasunari OYABU

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K3/16

CPC classification number: H05K1/0269 ,  H05K1/05 ,  H05K1/09 ,  H05K3/16 ,  H05K2201/2054

Abstract: A method for manufacturing a wiring circuit board includes steps: 1) preparing a metal supporting layer, a different-reflectance layer, an insulating base layer, and a wiring layer sequentially toward one side in a thickness direction, and 2) irradiating the circuit board with reflected light including light containing one wavelength in light between wavelengths 650 nm and 950 nm from one side in the thickness direction of the circuit board to inspect the wiring layer based on the reflected light at the circuit board. In 2), the outer shape of the wiring layer is inspected based on the contrast between first reflected light at one surface in the thickness direction of the wiring layer and second reflected light at one surface in the thickness direction of the different-reflectance layer. The difference between a reflectance R1 of the wiring layer and a reflectance R2 of the different-reflectance layer is 40% or more.

公开(公告)号：US20230389179A1

公开(公告)日：2023-11-30

申请号：US18323131

申请日：2023-05-24

Applicant: NITTO DENKO CORPORATION

Inventor： Kazutoshi KINOSHITA ,  Hayato TAKAKURA ,  Ryosuke SASAOKA

IPC: H05K1/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00

CPC classification number: H05K1/14 ,  H05K1/0306 ,  H05K1/05 ,  H05K3/0044 ,  H05K2203/0228

Abstract: Provided is a method for producing a wiring circuit board having excellent transportability. The method for producing a wiring circuit board includes a first step to a third step. In the first step, an assembly sheet is overlapped with a supporting sheet in a thickness direction. The assembly sheet includes a plurality of wiring circuit boards and a supporting portion supporting the plurality of wiring circuit boards. The supporting portion supports the assembly sheet. In the second step, the plurality of wiring circuit boards are separated from the supporting portion by cutting. In the third step, the assembly sheet including the plurality of wiring circuit boards separated from the supporting portion is conveyed, while being supported by the supporting sheet.