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公开(公告)号：US20230163037A1
公开(公告)日：2023-05-25
申请号：US17836155
申请日：2022-06-09
发明人： Ken SAKAMOTO , Keitaro ICHIKAWA
IPC分类号： H01L23/31 , H01L21/56 , H01L25/16 , H01L23/495 , H01L21/48
CPC分类号： H01L23/3107 , H01L21/565 , H01L21/561 , H01L25/16 , H01L23/49575 , H01L21/4842 , H01L2924/10272 , H01L2924/1033 , H01L2924/10254 , H01L23/295
摘要： The third side surface includes inclined surfaces inclined in a direction in which a center in an up-down direction of the third side surface is convex. The mold resin further includes a residual section provided in the center of the third side surface and a dowel section provided between the inclined surface and the residual section. The dowel section projects further in a lateral direction than the inclined surface. The residual section further projects in the lateral direction than the dowel section and has a fracture surface perpendicular to the up-down direction.
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公开(公告)号：US20230024580A1
公开(公告)日：2023-01-26
申请号：US17781713
申请日：2020-02-06
发明人： Ken SAKAMOTO , Haruko HITOMI , Kozo HARADA , Seiki HIRAMATSU
IPC分类号： H01L23/31 , H01L25/065 , H01L25/18 , H01L23/00 , H02M7/5387
摘要： A semiconductor module includes a first power semiconductor device, a conductive wire, and a resin film. The conductive wire is joined to a surface of a first front electrode of the first power semiconductor device. The resin film is formed to be continuous on at least one of an end portion or an end portion of a first joint between the first front electrode and the conductive wire in a longitudinal direction of the conductive wire, a surface of the first front electrode, and a surface of the conductive wire. The resin film has an elastic elongation rate of 4.5% to 10.0%.
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公开(公告)号：US20220415735A1
公开(公告)日：2022-12-29
申请号：US17778871
申请日：2020-01-17
发明人： Kozo HARADA , Ken SAKAMOTO , Yoshihiro YAMAGUCHI
摘要： A power module includes an insulating substrate, a case member, a power semiconductor element, a base member, a sealing member, and an adhesive member. The insulating substrate has a first surface and a second surface opposite to the first surface. The case member surrounds the insulating substrate when viewed in a direction perpendicular to the first surface. The power semiconductor element faces the first surface. The base member faces the second surface. The sealing member seals the power semiconductor element and the insulating substrate and is in contact with the case member. The adhesive member fixes the base member and the case member, and surrounds the insulating substrate when viewed in the direction perpendicular to the first surface.
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公开(公告)号：US20220165700A1
公开(公告)日：2022-05-26
申请号：US17440790
申请日：2019-05-30
发明人： Haruko HITOMI , Kozo HARADA , Ken SAKAMOTO
摘要： The conductive wire is bonded to the front electrode of the semiconductor device at the bonding section. The first resin member covers at least one end portion of two end portions of the bonding section, the first surface of the front electrode, and the second surface of the conductive wire. The second resin member covers the bent portion of the first resin member. The first resin member has a higher break elongation and a higher break strength than the second resin member. The second tensile elastic modulus of the second resin member is greater than the first tensile elastic modulus of the first resin member. Thereby, the reliability of the power semiconductor module is improved.
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公开(公告)号：US20190057928A1
公开(公告)日：2019-02-21
申请号：US15763232
申请日：2016-02-09
摘要： A lead frame (4) includes an inner lead (5), an outer lead (2) connected to the inner lead (5), and a power die pad (7). A power semiconductor device (9) is bonded onto the power die pad (7). A first metal thin line (11) electrically connects the inner lead (5) and the power semiconductor device (9). Sealing resin (1) seals the inner lead (5), the power die pad (7), the power semiconductor device (9), and the first metal thin line (11). The sealing resin (1) includes an insulating section (15) directly beneath the power die pad (7). A thickness of the insulating section (15) is 1 to 4 times a maximum particle diameter of inorganic particles in the sealing resin (1). A first hollow (14) is provided on an upper surface of the sealing resin (1) directly above the power die pad (7) in a region without the first metal thin line (11) and the power semiconductor device (9).
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公开(公告)号：US20190051539A1
公开(公告)日：2019-02-14
申请号：US16078642
申请日：2016-03-29
发明人： Keitaro ICHIKAWA , Ken SAKAMOTO , Kazuo FUNAHASHI
IPC分类号： H01L21/48 , H01L21/56 , H01L23/42 , H01L23/495 , H01L23/31
摘要： It is an object of the present invention to provide a method for manufacturing a resin-sealed power semiconductor device that facilitates the separation of a suspension lead from a mold resin and a lead frame. A method for manufacturing a resin-sealed power semiconductor device according to the present invention includes the following steps: (a) sealing a semiconductor element and a lead frame, to prepare a sealed body in which a terminal lead and a suspension lead that are included in the lead frame project outward from a side of the mold resin; (b) punching a portion of the suspension lead, the portion projecting from the mold resin, with a first punch in a first direction, to separate the suspension lead from the mold resin; and (c) punching the projecting portion of the suspension lead with a second punch in a second direction.
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公开(公告)号：US20180174864A1
公开(公告)日：2018-06-21
申请号：US15738836
申请日：2015-10-06
发明人： Tetsuya UEDA , Hiroshi YOSHIDA , Seiji OKA , Ken SAKAMOTO
IPC分类号： H01L21/56 , H01L23/495 , H01L25/065 , H01L21/67 , B29C45/14
CPC分类号： H01L21/565 , B29C45/14065 , B29C45/14639 , B29C2045/14163 , B29L2031/3406 , H01L21/56 , H01L21/67126 , H01L23/3121 , H01L23/48 , H01L23/49541 , H01L23/49575 , H01L24/48 , H01L25/0655 , H01L2224/45124 , H01L2224/48091 , H01L2224/48101 , H01L2224/48106 , H01L2224/48137 , H01L2224/48245 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An object is to provide a technology that reduces the number of components and that is capable of suppressing the cost. A structure including semiconductor elements, a plurality of electrode terminals, and a dam bar for connecting the plurality of electrode terminals is prepared, and a part of the structure including a part of the plurality of electrode terminals and the dam bar is arranged in the terminal hole. Further, the part of the structure is clamped by a movable clamp inside the terminal hole, and at least a portion of the movable clamp is fitted into the terminal hole, and then a resin is injected into an internal space of a pair of molds.
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公开(公告)号：US20170345742A1
公开(公告)日：2017-11-30
申请号：US15379776
申请日：2016-12-15
发明人： Ken SAKAMOTO , Tetsuya UEDA , Keitaro ICHIKAWA , Yuki YOSHIOKA
IPC分类号： H01L23/495 , H01L21/56 , H01L21/48
CPC分类号： H01L23/49555 , H01L21/4853 , H01L21/565 , H01L23/3107 , H01L23/4952 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/49586 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49175
摘要： A lead frame includes a plurality of circuit patterns which each have a die pad and an electrode terminal portion and are disposed in a band shape, a tie bar, a frame portion and a suspension lead. Cut are a connection portion between electrode terminals and the frame portion, a connection portion between the frame portion and the tie bar at both end portions in a disposition direction of circuit patterns, and a connection portion from a connection part of the frame portion with the tie bar, between the circuit patterns to a part of the frame portion extending in the disposition direction. The electrode terminal portion is bent to extend to a direction of an upper surface of a semiconductor element. The lead frame is collectively resin-sealed while exposing the tie bar and the electrode terminal portion above the tie bar.
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公开(公告)号：US20170148709A1
公开(公告)日：2017-05-25
申请号：US15322191
申请日：2014-10-03
IPC分类号： H01L23/495 , H01L21/56
摘要： A first lead terminal, a second lead terminal provided parallel to the first lead terminal, and a tie bar connecting the first lead terminal and the second lead terminal are provided. The tie bar includes a first narrow-width section touching the first lead terminal, a second narrow-width section touching the second lead terminal, and a wide-width section having a larger width than the first narrow-width section and the second narrow-width section and connecting the first narrow-width section and the second narrow-width section. The wide-width section has a through-hole formed between the first narrow-width section and the second narrow-width section.
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