公开(公告)号：US20230352384A1

公开(公告)日：2023-11-02

申请号：US18188622

申请日：2023-03-23

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Mikhail DOLGANOV ,  Steve CHEUNG ,  Lijun ZHU

IPC: H01L23/498 ,  H05K3/46 ,  H05K1/11 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01L23/49822 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09563

Abstract: In some implementations, a substrate comprises a ceramic core, multiple metal-filled vias through the ceramic core, and a first metal layer, on a top side of the ceramic core, including metal traces, over respective metal-filled vias. The substrate comprises a second metal layer, including a first electrical contact over a first metal trace, a second electrical contact over a second metal trace, and a third electrical contact over a third metal trace, where the second metal trace is electrically isolated from the first and third metal traces. The substrate comprises a thin dielectric layer separating the first metal layer and the second metal layer. The dielectric layer between the first metal layer and the second layer provides the substrate with a low parasitic inductance and a low thermal resistance based on a thickness of the dielectric layer and/or a material used for the dielectric layer.

公开(公告)号：US20230115690A1

公开(公告)日：2023-04-13

申请号：US17644679

申请日：2021-12-16

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Kevin WANG ,  Hao HUANG ,  John Michael MILLER ,  Siu Kwan CHEUNG ,  Lijun ZHU

IPC: H01S5/42 ,  H01S5/042 ,  H01S5/183 ,  H01S5/026

Abstract: An optical assembly includes an integrated circuit (IC) driver chip; an optical subassembly disposed on the IC driver chip that includes: a vertical cavity surface emitting laser (VCSEL) device, an optical element disposed above a top surface of the VCSEL device, and two or more attachment structures disposed between the VCSEL device and the optical element; and two or more additional attachment structures disposed between the IC driver chip and the optical subassembly. The VCSEL device includes: a cathode contact disposed on the top surface of the VCSEL device, and an anode contact disposed on the top surface of the VCSEL device. The optical element includes two or more conductive traces on a bottom surface of the optical element. The two or more attachment structures are disposed between the two or more conductive traces of the optical element, and the cathode contact and the anode contact of the VCSEL device.

公开(公告)号：US20220066036A1

公开(公告)日：2022-03-03

申请号：US17109943

申请日：2020-12-02

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Huanlin ZHU ,  Lijun ZHU ,  Raman SRINIVASAN ,  Ed Murphy

IPC: G01S17/89 ,  H01S5/183 ,  H05K9/00 ,  G01S7/4865 ,  G03B17/02

Abstract: In some implementations, a housing for an electro-optical device comprises a molded dielectric structural component, an electromagnetic interference (EMI) shield, and a plurality of conductive traces. The molded dielectric structural component may be configured to separate the EMI shield and the plurality of conductive traces.

公开(公告)号：US20240195151A1

公开(公告)日：2024-06-13

申请号：US18194133

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip. The emitter assembly may include a dummy pillar, electrically isolated from the VCSEL chip, mating with a slot. The VCSEL chip may include one of the dummy pillar or the slot.

公开(公告)号：US20240195145A1

公开(公告)日：2024-06-13

申请号：US18194123

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Eric R. HEGBLOM ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/0239 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02375 ,  H01S5/183 ,  H01S5/42

CPC classification number: H01S5/0239 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02375 ,  H01S5/18305 ,  H01S5/423

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs respectively associated with a plurality of first electrical contacts. A first spacing of the plurality of first electrical contacts may define a first pitch. The emitter assembly may include a redistribution layer, disposed on the VCSEL chip, to increase the first pitch of the plurality of first electrical contacts. The emitter assembly may include a carrier having a plurality of second electrical contacts. A second spacing of the plurality of second electrical contacts may define a second pitch greater than the first pitch. The emitter assembly may include a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via the redistribution layer. The plurality of conductive pillars may be arranged according to the second spacing.

公开(公告)号：US20230047740A1

公开(公告)日：2023-02-16

申请号：US17449612

申请日：2021-09-30

Applicant: Lumentum Operations LLC

Inventor： Siu Kwan CHEUNG ,  Wei SHI ,  Hao HUANG ,  Lijun ZHU ,  Huanlin ZHU

IPC: H01S5/042 ,  H01L49/02

Abstract: In some implementations, a vertical cavity surface emitting laser (VCSEL) package may include a substrate. The VCSEL package may include a VCSEL disposed on a surface of the substrate. The VCSEL package may include a VCSEL driver disposed on the surface of the substrate. The VCSEL package may include an embedded capacitor electrically connected to the VCSEL and the VCSEL driver. The embedded capacitor may be formed from a subset of layers of the substrate. The capacitor may be associated with a first capacitance that is different from a second capacitance of at least one other capacitor associated with the substrate.

公开(公告)号：US20230027279A1

公开(公告)日：2023-01-26

申请号：US17449386

申请日：2021-09-29

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Kevin WANG ,  Hao HUANG ,  John Michael MILLER ,  Siu Kwan CHEUNG ,  Lijun ZHU

IPC: H01S5/183 ,  H01S5/42 ,  H01S5/024 ,  H01S5/026

Abstract: In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.