Abstract:
A solar cell is discussed, and includes a substrate; a first field region; a first electrode directly formed on an emitter region; and a second electrode directly formed on a second field region, wherein a second passivation layer comprises a first back passivation portion and a second back passivation portion. Furthermore, the first back passivation portion is merely positioned between the emitter region and the substrate and the second field region and the substrate, and the second back passivation portion is positioned between the emitter region and the second field region, and wherein the first back passivation portion positioned between the emitter region and the substrate is physically separated from first back passivation portion positioned between the second field region and the substrate.
Abstract:
Manufacturing an exterior decor panel for a home appliance includes laminating a photosensitive dry film on a front surface of a metal sheet, the photosensitive dry film having a higher etch resistance than the metal sheet against an electrolytic solution, photo-masking the photosensitive dry film attached to the metal sheet to create a pattern having a minimum width of 0.1 mm in the photosensitive dry film to thereby expose the front surface of the metal sheet corresponding to the pattern in the photosensitive film, electrolytic-polishing the photo-masked metal sheet by dipping the photo-masked metal sheet in an electrolytic bath to allow the electrolytic solution to contact the exposed front surface of the metal sheet and form the pattern in the front surface of the metal sheet, and performing post-treatment on the metal sheet, the post-treatment including washing and removing the photosensitive dry film.
Abstract:
The present disclosure is applicable to a technical field related to display devices, and relates to a display device using, for example, a micro light emitting diode (LED), and a manufacturing method therefor. The present disclosure may comprise: a substrate; a partition defining a unit pixel region; a first electrode located in the unit pixel region; a semiconductor light-emitting element electrically connecting a first-type electrode to the first electrode and provided in the unit pixel region; an inclined a layer formed on the semiconductor light-emitting element and the partition, and having a high incline on the semiconductor light-emitting element; and a second electrode electrically connected, on the inclined coating layer, to a second-type electrode of the semiconductor light-emitting element.
Abstract:
The present invention is applicable to a display device-related technical field, and relates to, for example, a flat lighting device and a display device using a light-emitting diode (LED). The present invention relates to a display device including a plurality of individual unit compartment regions, comprising: at least one light-emitting diode provided in the individual unit compartment regions; a gate-on voltage line connected to the light-emitting diode; a first scan line for applying a common voltage to the plurality of individual unit compartment regions; a second scan line for applying a voltage inverted from the common voltage to the plurality of individual unit compartment regions; a data line for applying individual switching voltages to the plurality of individual unit compartment regions; a driving unit including a driving MOSFET device connected to the light-emitting diode; and a switching unit including a switching MOSFET device connected to the first scan line and the data line to perform a switching operation.
Abstract:
Discussed is a method of manufacturing a display device, the method including: introducing semiconductor light emitting devices including a magnetic material into a fluid chamber; transferring a substrate to the fluid chamber, the substrate including assembly electrodes, an insulating layer covering the assembly electrodes, and open holes in the insulating layer and exposing portions of both ends of the assembly electrodes; applying a magnetic force to the semiconductor light emitting devices introduced into the fluid chamber to move the semiconductor light emitting devices in one direction; and forming an electric field so that the moving semiconductor light emitting devices are disposed at preset positions of the substrate, wherein a probe pin is in contact with the assembly electrodes exposed through the open holes to individually apply a voltage to the assembly electrodes to form the electric field.
Abstract:
Disclosed in the present specification are a micro LED display device in which an assembly electrode capable of forming a non-uniform electric field is assembled in a provided assembly hole, and a manufacturing method therefor. The display device according to one embodiment of the present invention comprises: a substrate; a first assembly electrode and a second assembly electrode arranged to be spaced apart on the substrate; an insulating layer deposited on top of the first assembly electrode and the second assembly electrode; an assembly hole defining a pixel area formed on the insulating layer; a semiconductor light-emitting element assembled in the assembly hole; and a wiring electrode electrically connected to the semiconductor light-emitting element, wherein the first assembly electrode and the second assembly electrode have a pattern for generating non-uniform electric field in the assembly hole by means of applied voltage, and the semiconductor light-emitting element is assembled, on the basis of the non-uniform electric field, at a specific location in the assembly hole after moving in a specific direction.
Abstract:
A solar cell includes a substrate; a first passivation layer on a first surface of the substrate; a first field region on the first surface of the substrate; an anti-reflection layer on the first passivation layer; a second passivation layer on a second surface of the substrate; an emitter region on the second passivation layer, the emitter region forming a p-n junction and a hetero-junction junction with the substrate; a second field region on the second passivation layer, the second field region forming a hetero-junction with the substrate; a first electrode contacted to the emitter region; a second electrode contacted to the second field region; a spacing between the emitter region and the second field region; and a third passivation layer on the second surface of the substrate at the spacing.
Abstract:
The mold apparatus enables the integration of a plurality of rim-shaped cores each corresponding to the shape of a case forming the exterior of a display device, and thus a plurality of cavities may be formed on a parting surface without having to increase the thickness or size of a mold.
Abstract:
The display device can include a substrate; a barrier rib disposed on the substrate and having an assembly hole; a semiconductor light emitting device in the assembly hole; and an adhesive part between the substrate and the semiconductor light emitting device within the assembly hole. The adhesive part can include adhesive particles in contact with each other.
Abstract:
The present disclosure is applicable to a display device-related technology field, for example, relates to a display device using a micro light emitting diode (LED) and a method for manufacturing the same. The display device using the semiconductor light emitting device includes a wiring substrate with a first electrode disposed thereon, a light emitting device disposed on the wiring substrate to constitute a unit sub-pixel, a seating layer located between the wiring substrate and the light emitting device, wherein the seating layer includes a first portion in contact with the light emitting device and a second portion located under the first portion and having an area size greater than an area size of the first portion, a first connection electrode electrically connecting the first electrode to one side of the light emitting device corresponding to a shape of the seating layer, a planarization layer covering the light emitting device and the first connection electrode, and a second connection electrode located on the planarization layer and electrically connected to the other side of the light emitting device.