公开(公告)号：US20150120220A1

公开(公告)日：2015-04-30

申请号：US14512446

申请日：2014-10-12

Applicant: KLA-Tencor Corporation

Inventor： Joanne Wu ,  Ellis Chang ,  Lisheng Gao ,  Satya Kurada ,  Allen Park ,  Raghav Babulnath

IPC: G01N21/95

CPC classification number: H01L22/12 ,  G01N21/8851 ,  G01N21/956 ,  H01L22/14 ,  H01L22/20

Abstract: Methods and systems for detecting reliability defects on a wafer are provided. One method includes acquiring output for a wafer generated by an inspection system. The method also includes determining one or more geometric characteristics of one or more patterned features formed on the wafer based on the output. In addition, the method includes identifying which of the one or more patterned features will cause one or more reliability defects in a device being formed on the wafer based on the determined one or more characteristics.

Abstract translation: 提供了用于检测晶片上的可靠性缺陷的方法和系统。 一种方法包括获取由检查系统产生的晶片的输出。 该方法还包括基于输出来确定在晶片上形成的一个或多个图案特征的一个或多个几何特征。 此外，该方法包括基于所确定的一个或多个特性来识别一个或多个图案化特征中的哪一个将导致在晶片上形成的器件中的一个或多个可靠性缺陷。

公开(公告)号：US20140307947A1

公开(公告)日：2014-10-16

申请号：US14251415

申请日：2014-04-11

Applicant: KLA-Tencor Corporation

Inventor： Satya Kurada ,  Raghav Babulnath ,  Kwok Ng ,  Lisheng Gao

IPC: G06T7/00

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95676 ,  G01N2201/06113 ,  G01N2201/068 ,  G01N2201/10 ,  G01N2201/12 ,  G06K9/00 ,  G06K9/66 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.

Abstract translation: 提供了用于产量关键缺陷的基于设计的抽样和装箱的方法和系统。 一种方法包括通过检查系统的光学子系统对于为晶片生成的每个检查图像帧中的每个图像补片进行对准以设计晶片的信息。 该方法还包括在图像斑块中检测到的缺陷位置导出多层设计属性。 另外，该方法包括使用多层设计属性构建决策树。 决策树用于将缺陷分离成对晶片上形成的器件产生不同产量的影响。 该方法还包括使用决策树将缺陷合并。

公开(公告)号：US20140303921A1

公开(公告)日：2014-10-09

申请号：US14244859

申请日：2014-04-03

Applicant: KLA-Tencor Corporation

Inventor： Thirupurasundari Jayaraman ,  Raghav Babulnath

IPC: G01R31/265

CPC classification number: H01L22/12 ,  G01N21/9501 ,  G06T7/001 ,  G06T2207/30148

Abstract: Methods and systems for dynamic design attributes for wafer inspection are provided. One method includes, at run time of a wafer inspection recipe, prompting a user of a wafer inspection tool on which the wafer inspection recipe is performed for information for a design based binning (DBB) process. The information includes one or more formulae for calculating design attributes from a design for a wafer. The design attributes are used to bin the defects in the DBB process. The method also includes performing inspection of a wafer according to an updated wafer inspection recipe. Performing the inspection includes binning defects detected on the wafer according to the DBB process in the updated wafer inspection recipe.

Abstract translation: 提供了晶圆检测动态设计属性的方法和系统。 一种方法包括在晶片检查配方的运行时，提示晶片检查工具的用户在其上执行晶片检查配方以用于基于设计的合并（DBB）处理的信息。 信息包括用于从晶片的设计计算设计属性的一个或多个公式。 设计属性用于分析DBB过程中的缺陷。 该方法还包括根据更新的晶片检查配方执行晶片检查。 执行检查包括根据更新的晶片检查配方中的DBB处理在晶片上检测到的合并缺陷。

公开(公告)号：US09865512B2

公开(公告)日：2018-01-09

申请号：US14244859

申请日：2014-04-03

Applicant: KLA-Tencor Corporation

Inventor： Thirupurasundari Jayaraman ,  Raghav Babulnath

IPC: G01R31/265 ,  H01L21/66 ,  G06T7/00 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/9501 ,  G06T7/001 ,  G06T2207/30148

Abstract: Methods and systems for dynamic design attributes for wafer inspection are provided. One method includes, at run time of a wafer inspection recipe, prompting a user of a wafer inspection tool on which the wafer inspection recipe is performed for information for a design based binning (DBB) process. The information includes one or more formulae for calculating design attributes from a design for a wafer. The design attributes are used to bin the defects in the DBB process. The method also includes performing inspection of a wafer according to an updated wafer inspection recipe. Performing the inspection includes binning defects detected on the wafer according to the DBB process in the updated wafer inspection recipe.

公开(公告)号：US09766187B2

公开(公告)日：2017-09-19

申请号：US14838091

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka ,  Gangadharan Sivaraman ,  Raghav Babulnath ,  Satya Kurada ,  Shuo Sun

IPC: G01N21/95 ,  G01N21/956 ,  G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/95 ,  G01N21/95607

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

公开(公告)号：US09563943B2

公开(公告)日：2017-02-07

申请号：US15092510

申请日：2016-04-06

Applicant: KLA-Tencor Corporation

Inventor： Satya Kurada ,  Raghav Babulnath ,  Kwok Ng ,  Lisheng Gao

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/956 ,  G01N21/95

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95676 ,  G01N2201/06113 ,  G01N2201/068 ,  G01N2201/10 ,  G01N2201/12 ,  G06K9/00 ,  G06K9/66 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.

Abstract translation: 提供了用于产量关键缺陷的基于设计的抽样和装箱的方法和系统。 一种方法包括通过检查系统的光学子系统对于为晶片生成的每个检查图像帧中的每个图像补片进行对准以设计晶片的信息。 该方法还包括在图像斑块中检测到的缺陷位置导出多层设计属性。 另外，该方法包括使用多层设计属性构建决策树。 决策树用于将缺陷分离成对晶片上形成的器件产生不同产量的影响。 该方法还包括使用决策树将缺陷合并。

公开(公告)号：US09310320B2

公开(公告)日：2016-04-12

申请号：US14251415

申请日：2014-04-11

Applicant: KLA-Tencor Corporation

Inventor： Satya Kurada ,  Raghav Babulnath ,  Kwok Ng ,  Lisheng Gao

IPC: G06K9/00 ,  G01N21/956 ,  G06T7/00 ,  G01N21/95

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95676 ,  G01N2201/06113 ,  G01N2201/068 ,  G01N2201/10 ,  G01N2201/12 ,  G06K9/00 ,  G06K9/66 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.

Abstract translation: 提供了用于产量关键缺陷的基于设计的抽样和装箱的方法和系统。 一种方法包括通过检查系统的光学子系统对于为晶片生成的每个检查图像帧中的每个图像补片进行对准以设计晶片的信息。 该方法还包括在图像斑块中检测到的缺陷位置导出多层设计属性。 另外，该方法包括使用多层设计属性构建决策树。 决策树用于将缺陷分离成对晶片上形成的器件产生不同产量的影响。 该方法还包括使用决策树将缺陷合并。

公开(公告)号：US20160061745A1

公开(公告)日：2016-03-03

申请号：US14838091

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka ,  Gangadharan Sivaraman ,  Raghav Babulnath ,  Satya Kurada ,  Shuo Sun

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/95 ,  G01N21/95607

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system.The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括从通过用检查系统扫描晶片产生的帧图像为晶片上的晶片中的晶片的阵列区域的至少一部分生成测试图像。 该方法还包括从通过晶片扫描生成的帧图像生成阵列区域中的单元的参考图像。 此外，该方法包括通过从测试图像的一部分中减去参考图像来确定模具中的阵列区域的至少一部分中的至少一个单元的差分图像， 对应于至少一个小区。 该方法还包括基于差分图像来检测至少一个单元中的晶片上的缺陷。