AUTOMATED IMAGE-BASED PROCESS MONITORING AND CONTROL
    11.
    发明申请
    AUTOMATED IMAGE-BASED PROCESS MONITORING AND CONTROL 有权
    自动化图像过程监控与控制

    公开(公告)号:US20160371826A1

    公开(公告)日:2016-12-22

    申请号:US14746820

    申请日:2015-06-22

    CPC classification number: G06T7/11 G06T7/001 G06T2207/30148

    Abstract: Methods and devices are disclosed for automated detection of a status of wafer fabrication process based on images. The methods advantageously use segment masks to enhance the signal-to-noise ratio of the images. Metrics are then calculated for the segment mask variations in order to determine one or more combinations of segment masks and metrics that are predictive of a process non-compliance. A model can be generated as a result of the process. In another embodiment, a method uses a model to monitor a process for compliance.

    Abstract translation: 公开了用于基于图像自动检测晶片制造过程的状态的方法和装置。 这些方法有利地使用段掩模来增强图像的信噪比。 然后针对段掩码变化计算度量,以便确定预测过程不符合性的段掩码和度量的一个或多个组合。 作为过程的结果可以生成模型。 在另一个实施例中,一种方法使用模型来监视合规性的过程。

    Semiconductor Metrology and Defect Classification Using Electron Microscopy

    公开(公告)号:US20190214285A1

    公开(公告)日:2019-07-11

    申请号:US16198658

    申请日:2018-11-21

    Abstract: In some embodiments, a first plurality of electron-microscope images for respective instances of a semiconductor structure is obtained from a first source. The electron-microscope images of the first plurality show different values of one or more semiconductor-fabrication parameters. A model is trained that specifies a relationship between the first plurality of electron-microscope images and the values of the one or more semiconductor-fabrication parameters. A second plurality of electron-microscope images for respective instances of the semiconductor structure on one or more semiconductor wafers is collected. The one or more semiconductor wafers are distinct from the first source. Values of the one or more semiconductor-fabrication parameters for the second plurality of electron-microscope images are predicted using the model.

    Process-sensitive metrology systems and methods

    公开(公告)号:US10216096B2

    公开(公告)日:2019-02-26

    申请号:US15174111

    申请日:2016-06-06

    Abstract: A lithography system includes an illumination source and a set of projection optics. The illumination source directs a beam of illumination from an off-axis illumination pole to a pattern mask. The pattern mask includes a set of pattern elements to generate a set of diffracted beams including illumination from the illumination pole. At least two diffracted beams of the set of diffracted beams received by the set of projection optics are asymmetrically distributed in a pupil plane of the set of projection optics. The at least two diffracted beams of the set of diffracted beams are asymmetrically incident on the sample to form a set of fabricated elements corresponding to an image of the set of pattern elements. The set of fabricated elements on the sample includes one or more indicators of a location of the sample along an optical axis of the set of projection optics.

    Process-Sensitive Metrology Systems and Methods
    14.
    发明申请
    Process-Sensitive Metrology Systems and Methods 审中-公开
    过程敏感计量系统和方法

    公开(公告)号:US20170045826A1

    公开(公告)日:2017-02-16

    申请号:US15174111

    申请日:2016-06-06

    CPC classification number: G03F7/70558 G03F7/70091 G03F7/70641

    Abstract: A lithography system includes an illumination source and a set of projection optics. The illumination source directs a beam of illumination from an off-axis illumination pole to a pattern mask. The pattern mask includes a set of pattern elements to generate a set of diffracted beams including illumination from the illumination pole. At least two diffracted beams of the set of diffracted beams received by the set of projection optics are asymmetrically distributed in a pupil plane of the set of projection optics. The at least two diffracted beams of the set of diffracted beams are asymmetrically incident on the sample to form a set of fabricated elements corresponding to an image of the set of pattern elements. The set of fabricated elements on the sample includes one or more indicators of a location of the sample along an optical axis of the set of projection optics.

    Abstract translation: 光刻系统包括照明源和一组投影光学元件。 照明源将来自离轴照明杆的照明光束引导到图案掩模。 图案掩模包括一组图案元件,以生成包括来自照明杆的照明的衍射光束集合。 由该组投影光学器件接收的衍射光束组中的至少两个衍射光束不对称地分布在该组投影光学器件的光瞳平面中。 衍射光束组中的至少两个衍射光束不对称地入射到样品上,以形成一组对应于该组图案元素的图像的制造元件。 样品上的一组制造元件包括样品沿该组投影光学器件的光轴的位置的一个或多个指示器。

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