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公开(公告)号：US20160371826A1
公开(公告)日：2016-12-22
申请号：US14746820
申请日：2015-06-22
Applicant: KLA-TENCOR CORPORATION
Inventor： Himanshu VAJARIA , Shabnam Ghadar , Tommaso Torelli , Bradley RIES , Mohan MAHADEVAN , Stilian Pandev
IPC: G06T7/00
CPC classification number: G06T7/11 , G06T7/001 , G06T2207/30148
Abstract: Methods and devices are disclosed for automated detection of a status of wafer fabrication process based on images. The methods advantageously use segment masks to enhance the signal-to-noise ratio of the images. Metrics are then calculated for the segment mask variations in order to determine one or more combinations of segment masks and metrics that are predictive of a process non-compliance. A model can be generated as a result of the process. In another embodiment, a method uses a model to monitor a process for compliance.
Abstract translation: 公开了用于基于图像自动检测晶片制造过程的状态的方法和装置。 这些方法有利地使用段掩模来增强图像的信噪比。 然后针对段掩码变化计算度量，以便确定预测过程不符合性的段掩码和度量的一个或多个组合。 作为过程的结果可以生成模型。 在另一个实施例中，一种方法使用模型来监视合规性的过程。
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2.发明申请Wafer and Lot Based Hierarchical Method Combining Customized Metrics with a Global Classification Methodology to Monitor Process Tool Condition at Extremely High Throughput 审中-公开基于晶圆和批次的分层方法将定制度量与全球分类方法相结合，以极高的吞吐量监测过程工具条件公开(公告)号：US20150234379A1
公开(公告)日：2015-08-20
申请号：US14209198
申请日：2014-03-13
Applicant: KLA-Tencor Corporation
Inventor： Himanshu Vajaria , Tommaso Torelli , Bradley Ries , Mohan Mahadevan
IPC: G05B19/418 , H01L21/02
CPC classification number: G06T7/0004 , G06T2207/20076 , G06T2207/30148 , H01L22/12 , H01L22/20 , Y02P90/14
Abstract: Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.
Abstract translation: 公开了用于监测工艺工具条件的方法和系统。 该方法将单个晶圆，多个晶圆和多个批次信息统一组合在一起，作为自定义分类引擎的输入，可以消耗单个或多个扫描，通道，晶圆和批次来确定过程工具状态。
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公开(公告)号：US10290088B2
公开(公告)日：2019-05-14
申请号：US14209198
申请日：2014-03-13
Applicant: KLA-Tencor Corporation
Inventor： Himanshu Vajaria , Tommaso Torelli , Bradley Ries , Mohan Mahadevan
Abstract: Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.
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公开(公告)号：US09569834B2
公开(公告)日：2017-02-14
申请号：US14746820
申请日：2015-06-22
Applicant: KLA-TENCOR CORPORATION
Inventor： Himanshu Vajaria , Shabnam Ghadar , Tommaso Torelli , Bradley Ries , Mohan Mahadevan , Stilian Pandev
CPC classification number: G06T7/11 , G06T7/001 , G06T2207/30148
Abstract: Methods and devices are disclosed for automated detection of a status of wafer fabrication process based on images. The methods advantageously use segment masks to enhance the signal-to-noise ratio of the images. Metrics are then calculated for the segment mask variations in order to determine one or more combinations of segment masks and metrics that are predictive of a process non-compliance. A model can be generated as a result of the process. In another embodiment, a method uses a model to monitor a process for compliance.
Abstract translation: 公开了用于基于图像自动检测晶片制造过程的状态的方法和装置。 这些方法有利地使用段掩模来增强图像的信噪比。 然后针对段掩码变化计算度量，以便确定预测过程不合规性的段掩码和度量的一个或多个组合。 作为过程的结果可以生成模型。 在另一个实施例中，一种方法使用模型来监视合规性的过程。
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