High Resolution High Quantum Efficiency Electron Bombarded CCD Or CMOS Imaging Sensor
    11.
    发明申请
    High Resolution High Quantum Efficiency Electron Bombarded CCD Or CMOS Imaging Sensor 有权
    高分辨率高量子效率电子轰击CCD或CMOS成像传感器

    公开(公告)号:US20160027605A1

    公开(公告)日:2016-01-28

    申请号:US14614088

    申请日:2015-02-04

    CPC classification number: H01J31/26 G01N21/88 H01J29/46

    Abstract: An electron-bombarded detector for detecting low light signals includes a vacuum tube structure defining a cylindrical vacuum tube chamber, a photocathode disposed at a first end of the vacuum tube chamber, a sensor disposed at a second end of the vacuum tube chamber, ring electrodes disposed in the vacuum tube chamber for generating an electric field that accelerates emitted photoelectrons toward the sensor, and a magnetic field generator configured to generate a symmetric magnetic field that applies a focusing lens effect on the photoelectrons. The ring electrodes and magnetic field generator are operating using one of a reduced distance focusing approach and an acceleration/deceleration approach such that the photoelectrons have a landing energy below 2 keV. The use of reflective mode photocathodes is enabled using either multi-pole deflector coils, or ring electrodes formed by segmented circular electrode structures. Large angle deflections are achieved using magnetic or electrostatic deflectors.

    Abstract translation: 用于检测低光信号的电子轰击检测器包括限定圆柱形真空管室的真空管结构,设置在真空管室的第一端的光电阴极,设置在真空管室的第二端的传感器,环形电极 设置在真空管室中,用于产生将发射的光电子朝向传感器加速的电场;以及磁场发生器,被配置为产生对光电子产生聚焦透镜效应的对称磁场。 环形电极和磁场发生器使用减小的距离聚焦方法和加速/减速方法之一进行操作,使得光电子具有低于2keV的着陆能量。 使用反射模式光电阴极可以使用多极偏转线圈或由分段圆形电极结构形成的环形电极。 使用磁性或静电偏转器实现大角度偏转。

    Multi-Spot Defect Inspection System
    12.
    发明申请
    Multi-Spot Defect Inspection System 有权
    多点缺陷检测系统

    公开(公告)号:US20140268118A1

    公开(公告)日:2014-09-18

    申请号:US13834662

    申请日:2013-03-15

    CPC classification number: G01N21/9501 G01N21/956

    Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.

    Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射,散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例,控制扫描间距,光斑尺寸,光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。

    Spread-Spectrum Clock-Signal Adjustment for Image Sensors

    公开(公告)号:US20190288019A1

    公开(公告)日:2019-09-19

    申请号:US16297534

    申请日:2019-03-08

    Abstract: An image sensor is provided that includes a pixel array divided into a plurality of pixel groups. Each pixel group is clocked by a respective plurality of horizontal-register clocks. Clock signals for the image sensor are adjusted. Adjusting the clock signals includes phase-shifting each plurality of horizontal-register clocks by a respective phase delay of a plurality of phase delays. The phase delays are evenly spaced and are spaced symmetrically about zero. With the clock signals adjusted, a target is imaged using the image sensor.

    Dark-Field Inspection Using A Low-Noise Sensor
    18.
    发明申请
    Dark-Field Inspection Using A Low-Noise Sensor 审中-公开
    使用低噪声传感器进行暗场检测

    公开(公告)号:US20170048467A1

    公开(公告)日:2017-02-16

    申请号:US15210056

    申请日:2016-07-14

    Abstract: An inspection system and methods in which analog image data values (charges) captured by an image sensor are binned (combined) before or while being transmitted as output signals on the image sensor's output sensing nodes (floating diffusions), and in which an ADC is controlled to sequentially generate multiple corresponding digital image data values between each reset of the output sensing nodes. According to an output binning method, the image sensor is driven to sequentially transfer multiple charges onto the output sensing nodes between each reset, and the ADC is controlled to convert the incrementally increasing output signal after each charge is transferred onto the output sensing node. According to a multi-sampling method, multiple charges are vertically or horizontally binned (summed/combined) before being transferred onto the output sensing node, and the ADC samples each corresponding output signal multiple times. The output binning and multi-sampling methods may be combined.

    Abstract translation: 一种检查系统和方法,其中由图像传感器捕获的模拟图像数据值(电荷)在作为图像传感器的输出感测节点(浮动扩散)之间的输出信号被发送之前或同时被分组(组合),并且其中ADC是 被控制以在输出感测节点的每个复位之间顺序地生成多个对应的数字图像数据值。 根据输出合并方法,驱动图像传感器以在每个复位之间顺序地将多个电荷传送到输出感测节点上,并且在每个电荷被传送到输出感测节点之后,控制ADC转换递增增加的输出信号。 根据多采样方法,在转移到输出感测节点之前,将多个电荷垂直或水平分类(相加/组合),并且ADC对每个对应的输出信号进行多次采样。 可以组合输出合并和多采样方法。

    Wafer Inspection
    20.
    发明申请
    Wafer Inspection 有权
    晶圆检验

    公开(公告)号:US20150369753A1

    公开(公告)日:2015-12-24

    申请号:US14838194

    申请日:2015-08-27

    Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

    Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为将光脉冲引导到晶片上的区域的照明子系统; 扫描子系统,被配置为扫描穿过所述晶片的光脉冲; 配置为将从晶片上的区域散射的光脉冲成像到传感器的集合子系统,其中,所述传感器被配置为将少数散射光的脉冲的数量积分成散射光的脉冲数, 在传感器的整个区域成像,并且其中传感器被配置为响应于散射光的积分脉冲产生输出; 以及计算机子系统,被配置为使用由所述传感器产生的输出来检测所述晶片上的缺陷。

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