PACKAGE OF ELECTRONIC DEVICE AND DISPLAY PANEL

    公开(公告)号:US20190058158A1

    公开(公告)日:2019-02-21

    申请号:US16104956

    申请日:2018-08-20

    Abstract: A package of electronic device including a substrate, at least one electronic device and an encapsulation layer is provided. The substrate has a device area and a light transmitting area located outside the device area. The at least one electronic device is disposed on the device area of the substrate. The encapsulation layer is disposed on the substrate and covers the at least one electronic device. The encapsulation layer extends continuously from the device area to the light transmitting area, and a nitrogen content of the encapsulation layer on the device area is higher than a nitrogen content of the encapsulation layer on the light transmitting area. A display panel is also provided.

    ELECTRONIC DEVICE
    13.
    发明申请

    公开(公告)号:US20250081335A1

    公开(公告)日:2025-03-06

    申请号:US18820222

    申请日:2024-08-29

    Abstract: An electronic device includes a surface structure. The surface structure has a curved surface and includes a substrate, a first conductive line, and a first dielectric pattern. The first conductive line is disposed above the substrate. The first dielectric pattern is disposed above the first conductive line and overlaps with the first conductive line. The surface structure has a first region and a second region. The first dielectric pattern in the first region has a first average width, the first dielectric pattern in the second region has a second average width, and the first average width is different from the second average width.

    PRINTABLE PROCESS FOR FORMING A MULTI-LAYERED GAS BARRIER LAMINATE FILM
    18.
    发明申请
    PRINTABLE PROCESS FOR FORMING A MULTI-LAYERED GAS BARRIER LAMINATE FILM 审中-公开
    形成多层气体屏障层压膜的可打印方法

    公开(公告)号:US20150252161A1

    公开(公告)日:2015-09-10

    申请号:US14720833

    申请日:2015-05-24

    Abstract: The present invention employs the printable process to fabricate a multi-layered laminate gas barrier film. According to an embodiment of the present invention, after providing a plastic substrate, a first organic layer is printed with a first pattern on the plastic substrate. A first inorganic layer is printed to the first organic layer, filling up openings within the first pattern of the first organic layer and covering a surface of the first organic layer. A second organic layer is printed with a second pattern on the first inorganic layer. A second inorganic layer is printed to the second organic layer, filling up openings within the second pattern of the second organic layer and covering a surface of the second organic layer.

    Abstract translation: 本发明采用可印刷方法制造多层层压气体阻隔膜。 根据本发明的实施例,在提供塑料基板之后,在塑料基板上以第一图案印刷第一有机层。 将第一无机层印刷到第一有机层上,填充第一有机层的第一图案内的开口并覆盖第一有机层的表面。 在第一无机层上以第二图案印刷第二有机层。 将第二无机层印刷到第二有机层上,填充第二有机层的第二图案内的开口并覆盖第二有机层的表面。

    SUBSTRATE STRUCTURE
    19.
    发明申请
    SUBSTRATE STRUCTURE 审中-公开
    基板结构

    公开(公告)号:US20140370228A1

    公开(公告)日:2014-12-18

    申请号:US14279327

    申请日:2014-05-16

    Abstract: A substrate structure including a bottom organic layer, at least one inorganic layer, at least one organic layer and at least one protruding object is provided. The at least one protruding object is protruded from an upper surface of the bottom organic layer or the organic layer. A maximum height of the protruding object protruded from the upper surface of the bottom organic layer or the organic layer is H, and a thickness of the organic layer covering the protruding object is T, wherein T≧1.1 H.

    Abstract translation: 提供了包括底部有机层,至少一个无机层,至少一个有机层和至少一个突出物体的基底结构。 至少一个突出物体从底部有机层或有机层的上表面突出。 从底部有机层或有机层的上表面突出的突出物体的最大高度为H,覆盖突出物体的有机层的厚度为T,其中T≥1.1H。

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