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公开(公告)号：US11737242B2
公开(公告)日：2023-08-22
申请号：US17949801
申请日：2022-09-21
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Lei Cao , Shoubiao Xu , Shanjiu Chi
CPC classification number: H05K7/20418 , G06F1/20 , H05K7/20709
Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.
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公开(公告)号：US10278309B2
公开(公告)日：2019-04-30
申请号：US15785159
申请日：2017-10-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhongjiang Qu , Shanjiu Chi , Yangfan Zhong , Jin Wang
Abstract: The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.
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公开(公告)号：US20170196124A1
公开(公告)日：2017-07-06
申请号：US15468859
申请日：2017-03-24
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yaofeng Peng , Zhijian Li , Honghui Liu , Shanjiu Chi
CPC classification number: H05K7/20681 , F28D15/0266 , F28D15/04 , H05K7/20327 , H05K7/20336 , H05K7/20381 , H05K7/20672 , H05K7/20809
Abstract: A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.
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Patent Agency Ranking
公开(公告)号：US20230032386A1
公开(公告)日：2023-02-02
申请号：US17949801
申请日：2022-09-21
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Lei Cao , Shoubiao Xu , Shanjiu Chi
Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.
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公开(公告)号：US20220361346A1
公开(公告)日：2022-11-10
申请号：US17871404
申请日：2022-07-22
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yinzhong Tang , Na Wang , Shanjiu Chi , Zhengquan Wang
IPC: H05K5/02
Abstract: An electronic device cover is configured to accommodate an electronic device. A first air intake window and a first air exhaust window are disposed on the electronic device cover. The first air intake window is configured to communicate with an air intake vent of the electronic device to form an air intake channel, and the first air exhaust window is configured to communicate with an air exhaust vent of the electronic device to form an air exhaust channel. An air return channel is disposed inside the electronic device, and the air return channel is configured to communicate the air exhaust channel and the air intake channel.
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16.发明授权公开(公告)号：US11043442B2
公开(公告)日：2021-06-22
申请号：US16298443
申请日：2019-03-11
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Shoubiao Xu , Shanjiu Chi , Wenhui Zeng
IPC: H01L23/00 , H01L23/40 , H01L23/467 , H01L23/427 , H05K7/20 , F28F3/06
Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.
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公开(公告)号：US20160209133A1
公开(公告)日：2016-07-21
申请号：US15084098
申请日：2016-03-29
Applicant: Huawei Technologies Co., Ltd.
Inventor： Rui Hu , Liqian Zhai , Dong Wang , Shanjiu Chi , Jinshan Li , Zhigang Sun
CPC classification number: F28F21/02 , B32B37/06 , B32B37/1018 , B32B37/142 , B32B2307/302 , F28F21/084 , H01L21/4882 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L23/42 , H01L2924/0002 , H01L2924/00
Abstract: The present invention discloses a thermally conductive composite sheet, including a first aluminum alloy layer, at least one graphite sheet, an aluminum alloy frame, and a second aluminum alloy layer, where the aluminum alloy frame is provided with at least one opening; the graphite sheet is positioned inside the opening of the aluminum alloy frame; the aluminum alloy frame and the graphite sheet are sandwiched between the first aluminum alloy layer and the second aluminum alloy layer; the first aluminum alloy layer is diffusion-bonded to the graphite sheet and the aluminum alloy frame; the second aluminum alloy layer is diffusion-bonded to the graphite sheet and the aluminum alloy frame; and the graphite sheet is cladded by the first aluminum alloy layer, the second aluminum alloy layer, and the aluminum alloy frame, to form a unity.
Abstract translation: 本发明公开了一种导热复合片材，其包括第一铝合金层，至少一个石墨片，铝合金框架和第二铝合金层，其中铝合金框架设置有至少一个开口; 石墨片位于铝合金框架的开口内部; 铝合金框架和石墨片夹在第一铝合金层和第二铝合金层之间; 第一铝合金层扩散粘结到石墨片和铝合金框架上; 第二铝合金层被扩散粘合到石墨片和铝合金框架上; 并且石墨片被第一铝合金层，第二铝合金层和铝合金框架包覆以形成一体。
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公开(公告)号：US09357679B2
公开(公告)日：2016-05-31
申请号：US14077498
申请日：2013-11-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yuan Dong , Liqian Zhai , Shanjiu Chi , Jun Zhao
IPC: H05K7/20
CPC classification number: H05K7/20581 , H05K7/20727 , H05K7/20736
Abstract: Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is installed inside the cabinet; and an auxiliary cooling device including an air pressurizing device, an air supply plenum box, and an air-guiding device. The air supply plenum box is disposed on an inner side of the cabinet. The air pressurizing device is disposed at the top or bottom of the cabinet, and an air exhaust on a sidewall of the air pressurizing device is connected to a corresponding air intake on a sidewall of the air supply plenum box. The air-guiding device is installed inside the electronic equipment chassis, an air intake of the air-guiding device is connected to an air exhaust of the air supply plenum device, and an air exhaust of the air-guiding device faces a component inside the electronic equipment chassis.
Abstract translation: 本发明的实施例公开了一种电子设备冷却系统，包括：柜体; 安装在机柜内的至少一个电子设备底盘; 以及辅助冷却装置，其包括空气加压装置，空气供给箱和空气引导装置。 供气室被设置在机柜的内侧。 空气加压装置设置在机柜的顶部或底部，空气加压装置的侧壁上的排气口与供气室的侧壁上的相应进气口连接。 空气引导装置安装在电子设备底盘的内部，空气引导装置的进气口连接到供气通风装置的排气口，空气引导装置的排气面向内部的部件 电子设备底盘。
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