公开(公告)号：US08824292B2

公开(公告)日：2014-09-02

申请号：US12574347

申请日：2009-10-06

申请人： Hiroyuki Matsuo

发明人： Hiroyuki Matsuo

IPC分类号： G01R31/08 ,  G06F11/00 ,  G08C15/00 ,  H04J1/16 ,  H04J3/14 ,  H04L1/00 ,  H04L12/26 ,  H04J3/16

CPC分类号： H04J3/1611

摘要： A cross-connect apparatus and method where the apparatus includes an interface section which divides signals from a transmission line into multiple paths to provide the signals to cross-connect sections, and multiplexes signals provided from the cross-connect sections to send out the signals to the transmission line, the cross-connect sections cross-connects the signals from the interface section to output the signals to the interface section. The cross-connect apparatus includes a control section which determines a number of paths divided by the interface section and an operation mode of the cross-connect sections, according to a line capacity occupied by the signals from the transmission line and which controls the interface section and stops an operation of a cross-connect section which does not perform cross-connect processing.

摘要翻译： 一种交叉连接装置和方法，其中所述装置包括将来自传输线的信号分成多个路径以将信号提供给交叉连接部分的接口部分，并且将从交叉连接部分提供的信号多路复用以发送到 传输线，交叉连接部分交叉连接来自接口部分的信号，以将信号输出到接口部分。 交叉连接装置包括：控制部，其根据来自传输线的信号占用的线路容量确定由接口部分划分的路径数量和交叉连接部分的操作模式，并控制接口部分 并停止不进行交叉连接处理的交叉连接部的动作。

公开(公告)号：US20140000779A1

公开(公告)日：2014-01-02

申请号：US14004473

申请日：2012-03-23

申请人： Koichi Naoi ,  Hiroyuki Matsuo

发明人： Koichi Naoi ,  Hiroyuki Matsuo

IPC分类号： D02G3/48 ,  B60C9/18

CPC分类号： D02G3/48 ,  B60C9/0007 ,  B60C9/0057 ,  B60C9/18 ,  B60C9/185 ,  B60C2009/1842 ,  B60C2009/2067 ,  B60C2009/2077 ,  D07B1/062 ,  D07B1/0646 ,  D07B1/0653 ,  D07B2201/2006 ,  D07B2201/2029 ,  D07B2201/2051 ,  D07B2201/2065 ,  D07B2801/12

摘要： Provided is a steel cord for reinforcing rubber articles which, when applied to a belt of a tire, can attain lightweight without reducing the durability of the tire, and in particular, to a steel cord for reinforcing rubber articles in which the properties of a treat after rubberizing are excellent and a pneumatic radial tire using the same.Also provided is a steel cord for reinforcing rubber articles comprising a core formed by arranging two core filaments 1 in parallel without being twisted together, and N (2≦N≦4) sheath filaments 2 which are twisted together around the core. Letting the diameter of the core filament 1 be d1, and the diameter of the sheath filament 2be d2, d1>d2.

摘要翻译： 本发明提供一种用于加强橡胶制品的钢丝帘线，当应用于轮胎的皮带时，可以实现轻量化而不降低轮胎的耐久性，特别是涉及用于增强橡胶制品的钢丝帘线 涂橡胶之后，使用其的充气子午线轮胎。 还提供了一种用于增强橡胶制品的钢丝帘线，其包括通过将两个芯丝1平行布置而不被扭转而形成的芯和在芯周围扭绞在一起的N（2 @ N 4）个鞘丝2。 使芯丝1的直径为d1，鞘丝2be的直径d2 d2为d2。

公开(公告)号：US07875557B2

公开(公告)日：2011-01-25

申请号：US11313255

申请日：2005-12-20

申请人： Hiroyuki Matsuo ,  Kunihiro Miyazaki ,  Toshiki Nakajima

发明人： Hiroyuki Matsuo ,  Kunihiro Miyazaki ,  Toshiki Nakajima

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/31116 ,  C09K13/08 ,  H01L21/02052 ,  H01L21/28061 ,  H01L21/31133 ,  H01L21/31138 ,  H01L21/8238 ,  H01L29/66575

摘要： A semiconductor substrate treating method is disclosed that can selectively remove contaminants or unnecessary substances present on the surface of a semiconductor substrate. Also disclosed are a semiconductor component of enhanced reliability produced by this method and an electronic appliance incorporating the semiconductor component. The semiconductor substrate treating method comprises the step of treating a semiconductor substrate with a treating fluid containing NH4OH and HF wherein the relationships 0.30≦X/Y≦0.78 and 0.03≦Y≦6.0 are satisfied, where X represents a concentration [mol/L] of NH4OH in the treating fluid and Y represents a concentration [mol/L] of HF in the treating fluid. Preferably, the treating fluid is substantially free from H2O2. The semiconductor substrate has a surface, at least a part of which is composed of high melting point metal.

摘要翻译： 公开了可以选择性地去除存在于半导体衬底的表面上的污染物或不需要的物质的半导体衬底处理方法。 还公开了通过该方法产生的增​​强的可靠性的半导体部件和结合有半导体部件的电子设备。 半导体衬底处理方法包括用含有NH 4 OH和HF的处理流体处理半导体衬底的步骤，其中满足0.30＆nlE; X / Y＆nlE; 0.78和0.03＆nlE; Y＆nlE; 6.0的关系，其中X表示浓度[mol / L]，Y表示处理液中HF的浓度[mol / L]。 优选地，处理流体基本上不含H 2 O 2。 半导体基板具有至少一部分由高熔点金属构成的表面。

公开(公告)号：US07599460B2

公开(公告)日：2009-10-06

申请号：US11400337

申请日：2006-04-07

申请人： Hiroyuki Matsuo ,  Eiji Maeda

发明人： Hiroyuki Matsuo ,  Eiji Maeda

IPC分类号： H04L7/00

CPC分类号： H03L7/08 ,  H03L7/0812 ,  H04J3/0688 ,  H04J3/0691 ,  H04J3/08 ,  H04J2203/006

摘要： A device including a line interface for additionally installing a line is installed in a terminal repeater device which takes a work and protection redundancy configuration based on a criterion such as SONET, SDH, or the like. Within the device additionally installed, the clocks supplied from work and protection devices are each compared. The respective clocks are variably delayed based on the comparison result so as to allow the device additionally installed to perform clock phase control as to the work and protection lines.

摘要翻译： 包括用于额外安装线路的线路接口的设备安装在终端中继设备中，终端中继设备基于诸如SONET，SDH等的标准进行工作和保护冗余配置。 在额外安装的设备中，从工作和保护装置提供的时钟进行比较。 基于比较结果，相应的时钟被可变地延迟，以便允许另外安装的设备对工作和保护线路执行时钟相位控制。

公开(公告)号：US07443843B2

公开(公告)日：2008-10-28

申请号：US11100335

申请日：2005-04-06

申请人： Hiroyuki Matsuo ,  Mitsuhiro Kawaguchi ,  Shosaku Yamasaki ,  Takashi Umegaki ,  Koji Komatsu ,  Yoshimasa Itsuki

发明人： Hiroyuki Matsuo ,  Mitsuhiro Kawaguchi ,  Shosaku Yamasaki ,  Takashi Umegaki ,  Koji Komatsu ,  Yoshimasa Itsuki

IPC分类号： H04Q11/00

CPC分类号： H04L12/437

摘要： An apparatus has a cross connection circuit, first switching sections located on the input side of the cross connection circuit to switch a presently-used transmission path and a reserve transmission path, and second switching sections located on the output side of the cross connection circuit to switch the presently-used transmission path and the reserve transmission path and comprises slot sections, first selecting section selectively connecting any one of the slot sections to the input side of the first switching section, second selecting section connecting the output side of the first switching section to the input side of the cross connection circuit, third selecting section selectively connecting the output side of the cross connection circuit to the input side of any of the second switching sections, and fourth selecting section connecting the output side of the second switching section to any one of the slot sections.

摘要翻译： 一种装置具有交叉连接电路，位于交叉连接电路的输入侧的第一开关部分，用于切换当前使用的传输路径和预留传输路径，以及位于交叉连接电路的输出侧的第二开关部分， 切换当前使用的传输路径和预留传输路径，并且包括时隙部分，第一选择部分选择性地连接任一个时隙部分到第一切换部分的输入侧;第二选择部分，连接第一切换部分的输出侧 到交叉连接电路的输入侧，第三选择部选择性地将交叉连接电路的输出侧连接到任何第二切换部的输入侧，第四选择部将第二切换部的输出侧连接到 其中一个插槽部分。

公开(公告)号：US07439183B2

公开(公告)日：2008-10-21

申请号：US11211708

申请日：2005-08-26

申请人： Kunihiro Miyazaki ,  Hiroyuki Matsuo ,  Toshiki Nakajima

发明人： Kunihiro Miyazaki ,  Hiroyuki Matsuo ,  Toshiki Nakajima

IPC分类号： H01L21/302

CPC分类号： H01L21/30608 ,  H01L21/3085 ,  H01L21/76224 ,  H01L21/823412 ,  H01L21/823481 ,  H01L27/0805 ,  H01L29/1037 ,  H01L29/66795 ,  H01L29/7853

摘要： A method of manufacturing a semiconductor device. In the method, a thin film is formed on an Si substrate having face orientation (100), that part of the thin film, which lies on an element-isolating region, is removed. Then, the Si substrate is subjected to selective etching, making a trench in the substrate to isolate an element, by using the thin film as mask and a mixture solution of hydrofluoric acid and ozone water.

摘要翻译： 一种制造半导体器件的方法。 在该方法中，在具有面取向（100）的Si衬底上形成薄膜，去除位于元件隔离区上的部分薄膜。 然后，通过使用薄膜作为掩模和氢氟酸和臭氧水的混合溶液，对Si衬底进行选择性蚀刻，在衬底中形成沟槽以隔离元件。

公开(公告)号：US07245508B2

公开(公告)日：2007-07-17

申请号：US11139982

申请日：2005-05-31

申请人： Hirokazu Tokuda ,  Nobuyuki Kobayashi ,  Yasuhiro Okuma ,  Hiroyuki Matsuo ,  Osamu Hashimoto

发明人： Hirokazu Tokuda ,  Nobuyuki Kobayashi ,  Yasuhiro Okuma ,  Hiroyuki Matsuo ,  Osamu Hashimoto

IPC分类号： H02M3/335 ,  H02H7/122

CPC分类号： H02M5/4585

摘要： A power conversion apparatus includes serially connected arms U and X, serially connected arms V and Y, serially connected arms W and Z, and a capacitor, the pairs of serially connected arms and the capacitor all connected in parallel to one another. The input-side arms U and X and the output-side arms W and Z are subjected to PWM control so that the arms W and Z are controlled to have a voltage that is lower than that of the arms U and X, thereby providing a step down operation. A step up operation also can be provided by an opposite relation in which the arms W and Z are controlled to have a voltage that is higher than that of the arms U and X, thereby to expand the range within which the output voltage is controlled with the effect of reducing distortion.

摘要翻译： 功率转换装置包括串联连接的臂U和X，串联的臂V和Y，串联的臂W和Z以及电容器，所述串联连接的臂和电容器彼此并联连接。 输入侧臂U和X以及输出侧臂W和Z经受PWM控制，使得臂W和Z被控制为具有低于臂U和X的电压，从而提供 降档操作。 也可以通过相对的关系提供升压操作，其中臂W和Z被控制为具有高于臂U和X的电压，从而扩大其中输出电压被控制的范围 减少失真的效果。

公开(公告)号：US07195411B2

公开(公告)日：2007-03-27

申请号：US10999845

申请日：2004-11-30

申请人： Hiroyuki Matsuo ,  Koji Ikeda ,  Masaichiro Tatekawa ,  Yosuke Toyofuku ,  Hideaki Horio ,  Kazuyuki Nakashima

发明人： Hiroyuki Matsuo ,  Koji Ikeda ,  Masaichiro Tatekawa ,  Yosuke Toyofuku ,  Hideaki Horio ,  Kazuyuki Nakashima

IPC分类号： B41J13/14 ,  B41J13/10 ,  B41J2/01 ,  B41J29/00

CPC分类号： B41J29/023 ,  B41J29/02

摘要： A printer includes: a recording section for recording information on a recording medium; a medium carrying mechanism provided in an apparatus casing having an eject port that is opened in an upward direction or in a slanted upward direction; a medium accommodating section extending in a vertical or slanted vertical direction that defines a medium accommodating space that is continuous with the eject port; and an upward medium carrying mechanism that carries the recording medium upward by an amount according to the size of the recording medium stored in a size memory device, so that the re cording medium projects from the eject port by a predetermined constant length.

摘要翻译： 打印机包括：用于在记录介质上记录信息的记录部分; 介质承载机构，设置在具有沿向上方向或向上倾斜方向开口的排出口的装置壳体中; 介质容纳部，其在垂直或倾斜的垂直方向上延伸，限定与所述排出口连续的介质容纳空间; 以及向上介质承载机构，其将记录介质向上运送一定量，根据存储在尺寸存储装置中的记录介质的尺寸，使得重新引导介质从排出口突出预定的恒定长度。

公开(公告)号：US20060144421A1

公开(公告)日：2006-07-06

申请号：US11313255

申请日：2005-12-20

申请人： Hiroyuki Matsuo ,  Kunihiro Miyazaki ,  Toshiki Nakajima

发明人： Hiroyuki Matsuo ,  Kunihiro Miyazaki ,  Toshiki Nakajima

IPC分类号： C23G1/00

CPC分类号： H01L21/31116 ,  C09K13/08 ,  H01L21/02052 ,  H01L21/28061 ,  H01L21/31133 ,  H01L21/31138 ,  H01L21/8238 ,  H01L29/66575

摘要： A semiconductor substrate treating method is disclosed that can selectively remove contaminants or unnecessary substances present on the surface of a semiconductor substrate. Also disclosed are a semiconductor component of enhanced reliability produced by this method and an electronic appliance incorporating the semiconductor component. The semiconductor substrate treating method comprises the step of treating a semiconductor substrate with a treating fluid containing NH4OH and HF wherein the relationships 0.30≦X/Y≦0.78 and 0.03≦Y≦6.0 are satisfied, where X represents a concentration [mol/L] of NH4OH in the treating fluid and Y represents a concentration [mol/L] of HF in the treating fluid. Preferably, the treating fluid is substantially free from H2O2. The semiconductor substrate has a surface, at least a part of which is composed of high melting point metal.

摘要翻译： 公开了可以选择性地去除存在于半导体衬底的表面上的污染物或不需要的物质的半导体衬底处理方法。 还公开了通过该方法产生的增​​强的可靠性的半导体部件和结合有半导体部件的电子设备。 半导体衬底处理方法包括用含有NH 4 OH和HF的处理流体处理半导体衬底的步骤，其中0.30 <= X / Y <= 0.78和0.03 <= Y <6.0的关系 满足，其中X表示处理流体中NH 4 OH的浓度[mol / L]，Y表示处理流体中HF的浓度[mol / L]。 优选地，处理流体基本上不含H 2 O 2。 半导体基板具有至少一部分由高熔点金属构成的表面。

公开(公告)号：US20050259133A1

公开(公告)日：2005-11-24

申请号：US11180019

申请日：2005-07-12

申请人： Tetsuroh Nakamura ,  Hiroyuki Matsuo

发明人： Tetsuroh Nakamura ,  Hiroyuki Matsuo

IPC分类号： B41J2/045 ,  B41J2/05 ,  B41J2/14

CPC分类号： B41J2/14233 ,  B41J2002/1425 ,  B41J2002/14459 ,  B41J2002/14491

摘要： An ink jet head includes a head body (11) which is provided with a plurality of nozzles and a plurality of pressure chambers and actuators (14) respectively corresponding to the nozzles. Input terminals (37) of the actuators (14) are arranged locally between left-side and right-side central actuator columns (14A, 14A). A driver IC (13) is mounted on the head body (11) by flip chip bonding.

摘要翻译： 一种喷墨头包括：头本体（11），其设有多个喷嘴;和多个分别对应于喷嘴的压力室和致动器（14）。 致动器（14）的输入端子（37）被局部布置在左侧和右侧中央致动器柱（14A，14A）之间。 驱动器IC（13）通过倒装芯片接合安装在头本体（11）上。