公开(公告)号：US09887221B2

公开(公告)日：2018-02-06

申请号：US15119182

申请日：2015-02-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Jukka Alasirniö ,  Bojan Tesanovic ,  Tobias Senn ,  Devanraj Kupusamy ,  Alexander Bietsch

IPC: H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H04N5/225

CPC classification number: H01L27/14618 ,  H01L24/48 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/181 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

公开(公告)号：US20180006192A1

公开(公告)日：2018-01-04

申请号：US15631361

申请日：2017-06-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L31/02 ,  H01L33/54 ,  H01L31/0232 ,  H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L31/0203

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

公开(公告)号：US20160031169A1

公开(公告)日：2016-02-04

申请号：US14882905

申请日：2015-10-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Susanne Westenhöfer ,  Bojan Tesanovic

IPC: B29D11/00 ,  G02B13/00

CPC classification number: G02B3/0031 ,  B29D11/00307 ,  B29D11/00375 ,  B29D11/0074 ,  B29D11/00932 ,  B29K2063/00 ,  B29L2011/00 ,  G02B3/00 ,  G02B5/20 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).